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IRLI540G 0924H MMBZ5243 IDT72V1 SC2412 CE6353 S10S04MR DF06M
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  2.54mm Datasheet PDF File

For 2.54mm Found Datasheets File :: 492    Search Time::1.187ms    
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    AVX CORP
Part No. CP0402A2442ELTR CP0402A0897ANTR CP0402A0947CLTR 2A1441DLTR 2A1441DNTR 2A1441ALTR 2A1441BNTR 2A1441ELTR 2A1441CNTR 2A1441ENTR CP0402A0881FLTR CP0402A0881BNTR
OCR Text ...ce to the pcb ground plane is 0.254mm (0.010") rohs compliant pb: free please select correct termination style 37 3 thin-film directional couplers cp0402 high directivity lga termination coupler type selection graph cp0402a **** al cp04...
Description 2400 MHz - 2484 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.35 dB INSERTION LOSS-MAX
880 MHz - 915 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.25 dB INSERTION LOSS-MAX
935 MHz - 960 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.2 dB INSERTION LOSS-MAX
1429 MHz - 1453 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.2 dB INSERTION LOSS-MAX
1429 MHz - 1453 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.4 dB INSERTION LOSS-MAX
1429 MHz - 1453 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.25 dB INSERTION LOSS-MAX
869 MHz - 894 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.2 dB INSERTION LOSS-MAX

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    HMC42409

Hittite Microwave Corporation
Hittite Microwave Corporati...
Part No. HMC42409
OCR Text ...rom the chip (figure 1). if 0.254mm (10 mil) thick alumina thin lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. one way to accom- pli...
Description 0.5dB LSB GaAs MMIC 6-BIT DIGITAL ATTENUATOR, DC - 13 GHz

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    Linear
Part No. LT3460
OCR Text .... MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 0.10 - 0.40 0.47 MAX 0.65 REF 1.16 REF 0.10 - 0.30 0.10 - 0.18 (NOTE 3) 3.26 MAX 2.1 REF 0.96 MIN 0.80 - 1.00 0.00 - 0.10 REF 1.00 MAX PIN 1 1.80 - 2.40 1.15 -...
Description 1.3MHz Step-Up DC/DC Converter in SC70 and ThinSOT

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    HMC26609

Hittite Microwave Corporation
Part No. HMC26609
OCR Text ...rom the chip (figure 1). if 0.254mm (10 mil) thick alumina thin lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. one way to accomplish...
Description GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 20 - 40 GHz

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    MAXIM - Dallas Semiconductor
Part No. MAX2246EVKIT
OCR Text ....8mm C9 1000pF R3 8.2 *W = 0.254mm (10mils) ON FR4, 0.135mm (5.3mils) THICKNESS TO GROUND PLANE. Figure 1. MAX2244 EV Kit Schematic _______________________________________________________________________________________ 3 MAX...
Description Evaluation Kits for the MAX2244/MAX2245/MAX2246

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    AMSREF-02 AMSREF-02C AMSREF-02CP AMSREF-02CS AMSREF-02E AMSREF-02EP AMSREF-02ES AMSREF-02H AMSREF-02HP AMSREF-02HS

Advanced Monolithic Systems, Inc.
ADMOS[Advanced Monolithic Systems]
Part No. AMSREF-02 AMSREF-02C AMSREF-02CP AMSREF-02CS AMSREF-02E AMSREF-02EP AMSREF-02ES AMSREF-02H AMSREF-02HP AMSREF-02HS
OCR Text ...LASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE 8 LEAD PLASTIC DIP PACKAGE (P) 0.400* (10.160) MAX 8 7 6 5 0.2550.015* (6.4770.381) 1 2 3 4 0.045-0.065 (1.143-1.651) 0.1300.005 (3.3020.127) 0.300-0.325 (7.620-8...
Description 5V PRECISION VOLTAGE REFERENCE 5V的高精度电压基准

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    Linear
Part No. LT1030
OCR Text ...LASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE RELATED PARTS PART NUMBER LT1180A LTC (R) 1321 LT1134A LTC1383 DESCRIPTION Dual 5V RS232 Transceiver with Shutdown Programmable RS232/RS485 Transceiver 4-Driver/4-Receiver RS232 Tranceiver...
Description Quad Low Power Line Driver
From old datasheet system

File Size 178.57K  /  4 Page

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    HMC56208

Hittite Microwave Corporation
Part No. HMC56208
OCR Text ...rom the chip (figure 1). if 0.254mm (10 mil) thick alumina thin lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. one way to accom- pli...
Description GaAs PHEMT MMIC WIDEBAND DRIVER AMPLIFIER, 2 - 35 GHz

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    HMC56109

Hittite Microwave Corporation
Part No. HMC56109
OCR Text ...rom the chip (figure 1). if 0.254mm (10 mil) thick alumina thin lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. one way to accomplish...
Description GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT

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    HMC52809

Hittite Microwave Corporation
Part No. HMC52809
OCR Text ...from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. one way to accomplish ...
Description GaAs MMIC I/Q MIXER 11 - 16 GHz

File Size 235.76K  /  6 Page

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