| PART |
Description |
Maker |
| 21-0542 |
PACKAGE OUTLINE 12 BUMPS, WLP PKG, 0.4MM PITCH
|
Maxim Integrated Products
|
| IRS21814M IRS21814MTRPBF |
High and Low Side driver in a 16 Lead MLPQ 4mm x 4mm package.
|
International Rectifier
|
| IRS21844M IRS21844MTRPBF |
Half Bridge Driver in a 16 Lead MLPQ 4mm x 4mm package
|
International Rectifier
|
| N8T97 N8T98 N8T95 N8T98N 8T95 8T96 8T97 8T98 N8T95 |
8-Channel, 10-Bit ADC with I2C Compatible Interface in 20-Lead TSSOP; Package: TSSOP; No of Pins: 20; Temperature Range: Industrial
High Speed Hex 3-State Buffers/Inverters 高速六角三态缓冲器/逆变
|
List of Unclassifed Manufacturers
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AD7927BRUZ AD7927BRUZ-REEL7 |
8-Channel, 200 kSPS, 12-Bit ADC with Sequencer in 20-Lead TSSOP; Package: TSSOP; No of Pins: 20; Temperature Range: Industrial 8-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO20
|
Analog Devices, Inc.
|
| TQFN3X3-16 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT27-1 |
Package outline
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| SC70-3 SOT323 |
Package Outline
|
Global Mixed-mode Techn...
|
