Part Number Hot Search : 
MC1455 034R7 V630ME05 015EZ0 TA2026F OP705A TA166 033BM1
Product Description
Full Text Search

J20BPACKAGE - 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE

J20BPACKAGE_201494.PDF Datasheet


 Full text search : 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE


 Related Part Number
PART Description Maker
LV3344BE-70.0M LV3344BV-70.0M LV3344BY-70.0M LV114 6 Pad Leadless Surface Mount Oscillator
Pletronics, Inc.
LV1145BE-70.0M LV3320BE-70.0M LV3320BV-70.0M LV114 6 Pad Leadless Surface Mount Oscillator
Pletronics, Inc.
http://
PVB5VBV PVB5VBW PVB5VFV PVB5VFW PVB5WBV PVB5WBW PV 6 Pad Leadless Surface Mount or 4 Lead Thru-Hole PECL Voltage Controlled Xtal Oscillator
ETC
List of Unclassifed Manufacturers
ZTA-MG ZTA-MT ZTA-MX 2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
ILSI America LLC
V56MLA1206H23 BIDIRECTIONAL, SILICON, TVS DIODE LEADLESS, CERAMIC PACKAGE-2
Littelfuse, Inc.
MGF1952A Microwave Power MES FET (Leadless Ceramic Package)
Mitsubishi Electric Semiconductor
IL3X-HX5F12.5-32.768 2 Pad Ceramic Package, 1.5 mm x 3.2 mm
ILSI America LLC
MGF4953B SUPER LOW NOISE InGaAs HEMT Leadless Ceramic Package
Mitsubishi Electric Semiconductor
MGF4851A SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
Mitsubishi Electric Semiconductor
CR1209X7R104Z3F5 CR1209X7R104Z3NG5 CR1209X7R104Z3F CAPACITOR, CERAMIC, MULTILAYER, 100 V, X7R, 0.1 uF, SURFACE MOUNT, 1209 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.00047 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0056 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0022 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0033 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.0012 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.001 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0015 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0047 uF, SURFACE MOUNT, 0603 CHIP
Presidio Components, Inc.
489-28.0M-3GN-TTS 489-28.0M-3FN-TTS 489-28.0M-3DN- 6 Pad J-Lead Ceramic PECL Output
Oscilent Corporation
SSC-GR202 Surface-mounted and leadless chip LED device
Seoul Semiconductor
 
 Related keyword From Full Text Search System
J20BPACKAGE protection J20BPACKAGE DATASHEET PDF J20BPACKAGE server J20BPACKAGE Logic J20BPACKAGE Crystals
J20BPACKAGE ICPRICE J20BPACKAGE 应用线路 J20BPACKAGE watt J20BPACKAGE rohm J20BPACKAGE Number
 

 

Price & Availability of J20BPACKAGE

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
0.22350001335144