PART |
Description |
Maker |
349-10-103-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
349-10-164 349-10-164-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
429-10-272-00-560000 |
Interconnect Header .100 Grid; Surface Mount Pin Header Stub Tail Double Row Surface Mount
|
Mill-Max Mfg. Corp.
|
800-10-010-40-002000 |
Interconnect Header .100 Grid; Surface Mount Pin Header Horizontal Mount Single Row Surface Mount
|
Mill-Max Mfg. Corp.
|
90627-0761 0906270761 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, with Kinked PC Tail 2.54mm (.100") Pitch C-Grid III垄芒 Header, Single Row, Vertical, with Kinked PC Tail
|
Molex Electronics Ltd.
|
0901362202 90136-2202 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
829-22-018-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
829-22-002-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
829-22-014-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
0901200140 90120-0140 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 20 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 20 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
|