so8 pdf Datasheet P11 Full Text Search --- IC-ON-LINE

so8 Datasheet PDF File

For so8 Found Datasheets File :: 3392 Search Time::2.438ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |

				NXP Semiconductors
Part No.	PSMN6R1-30YLD
OCR Text	...ded and solder die attach power so8 package; no glue, no wire bonds, qualified to 175 c ? wave solderable; exposed leads for optimal visual solder inspection 3. applications ? on-board dc-to-dc solutions for server and telecommunications ? ...
Description	N-channel 30 V, 6.1 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology
File Size	335.33K / 13 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	PSMN6R0-30YLD PSMN6R0-30YLD-15
OCR Text	...ded and solder die attach power so8 package; no glue, no wire bonds, qualified to 175 c ? wave solderable; exposed leads for optimal visual solder inspection 3. applications ? on-board dc-to-dc solutions for server and telecommunications ? ...
Description	N-channel 30 V, 6.0 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology
File Size	324.13K / 13 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	TDA8541 TDA8541T
OCR Text	...R TDA8541T TDA8541 PACKAGE NAME so8 DIP8 DESCRIPTION plastic small outline package; 8 leads; body width 3.9 mm plastic dual in-line package; 8 leads (300 mil) VERSION SOT96-1 SOT97-1 1998 Apr 01 2 Philips Semiconductors Product ...
Description	1 W BTL audio amplifier
File Size	190.57K / 20 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	PSMN4R0-30YLD
OCR Text	...ded and solder die attach power so8 package; no glue, no wire bonds, qualified to 175 c ? wave solderable; exposed leads for optimal visual solder inspection 3. applications ? on-board dc-to-dc solutions for server and telecommunications ? ...
Description	N-channel 30 V, 4.0 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology
File Size	360.67K / 13 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	PSMN3R0-30YLD
OCR Text	...ded and solder die attach power so8 package; no glue, no wire bonds, qualified to 175 c ? wave solderable; exposed leads for optimal visual solder inspection 3. applications ? on-board dc-to-dc solutions for server and telecommunications ? ...
Description	N-channel 30 V, 3.0 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology
File Size	285.63K / 13 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	PSMN2R4-30YLD
OCR Text	...ded and solder die attach power so8 package; no glue, no wire bonds, qualified to 175 c ? wave solderable; exposed leads for optimal visual solder inspection 3. applications ? on-board dc-to-dc solutions for server and telecommunications ? ...
Description	N-channel 30 V, 2.4 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology
File Size	281.17K / 13 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	PSMN1R2-30YLD
OCR Text	...ded and solder die attach power so8 package; no glue, no wire bonds, qualified to 175 c ? wave solderable; exposed leads for optimal visual solder inspection 3. applications ? on-board dc-to-dc solutions for server and telecommunications ? ...
Description	N-channel 30 V, 1.2 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology
File Size	286.45K / 13 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	PSMN1R0-30YLD
OCR Text	...ded and solder die attach power so8 package; no glue, no wire bonds, qualified to 175 c ? wave solderable; exposed leads for optimal visual solder inspection 3. applications ? on-board dc-to-dc solutions for server and telecommunications ? ...
Description	N-channel 30 V, 1.0 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology
File Size	286.58K / 13 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	PSMN0R9-30YLD
OCR Text	...ded and solder die attach power so8 package; no glue, no wire bonds, qualified to 175 c ? wave solderable; exposed leads for optimal visual solder inspection 3. applications ? on-board dc-to-dc solutions for server and telecommunications ? ...
Description	N-channel 30 V, 0.87 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology
File Size	290.72K / 13 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	PSMN1R4-40YLD
OCR Text	...? high reliability lfpak (power-so8) package, copper-clip, solder die attach and qualified to 150 c ? exposed leads can be wave soldered, visual solder joint inspection and high quality solder joints ? low parasitic inductance and resistanc...
Description	N-channel 40 V 1.4 mΩ logic level MOSFET in LFPAK56 using NextPower-S3 technology
File Size	275.39K / 13 Page	View it Online	Download Datasheet

For so8 Found Datasheets File :: 3392 Search Time::2.438ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |