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  milliwatts Datasheet PDF File

For milliwatts Found Datasheets File :: 1872    Search Time::1.5ms    
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    BAW56WT1-D

ON Semiconductor
Part No. BAW56WT1-D
OCR Text ...evice which in this case is 200 milliwatts. p d = 150 c 25 c 0.625 c/w = 200 milliwatts the 0.625 c/w assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 200 milliwatts...
Description Dual Switching Diode

File Size 59.65K  /  8 Page

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    MSB92W MSB92WT1-D

ON Semiconductor
Part No. MSB92W MSB92WT1-D
OCR Text ... 150 c 25 c 0.625 c/w = 200 milliwatts ? the soldering temperature and time should not exceed 260 c for more than 10 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient should be 5 c or less. ? afte...
Description PNP Silicon General Purpose High Voltage Transistor

File Size 49.12K  /  8 Page

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    MMBTA55LT1-D

ON Semiconductor
Part No. MMBTA55LT1-D
OCR Text ...evice which in this case is 225 milliwatts. p d = 150 c 25 c 556 c/w = 225 milliwatts the 556 c/w for the sot23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation...
Description Driver Transistors PNP Silicon

File Size 73.03K  /  8 Page

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    BCW68GLT1-D

ON Semiconductor
Part No. BCW68GLT1-D
OCR Text ...evice which in this case is 225 milliwatts. p d = 150 c 25 c 556 c/w = 225 milliwatts the 556 c/w for the sot23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation...
Description General Purpose Transistors PNP Silicon

File Size 35.17K  /  4 Page

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    BCW33LT1-D

ON Semiconductor
Part No. BCW33LT1-D
OCR Text ...evice which in this case is 225 milliwatts. p d = 150 c 25 c 556 c/w = 225 milliwatts the 556 c/w for the sot23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation...
Description General Purpose Transistors NPN Silicon

File Size 191.69K  /  8 Page

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    MMQA5V6T1-D

ON Semiconductor
Part No. MMQA5V6T1-D
OCR Text ...evice which in this case is 225 milliwatts. p d = 150 c 25 c 556 c/w = 225 milliwatts the 556 c/w for the sc-59 6 lead package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dis...
Description 24 Watt Peak Power Zener Transient Voltage Suppressors SC-59 Quad Common Anode for Zeners ESD Protection

File Size 81.39K  /  8 Page

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    MGSF3441XT1-D

ON Semiconductor
Part No. MGSF3441XT1-D
OCR Text ...evice which in this case is 950 milliwatts. p d = 150 c 25 c 132 c/w = 950 milliwatts the 132 c/w for the tsop6 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation...
Description Low Rds(on) Small-Signal MOSFETs TMOS Single P-Channel Field Effect Transistors

File Size 86.43K  /  4 Page

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    2SA1037P

ON Semiconductor
Part No. 2SA1037P
OCR Text ...evice which in this case is 150 milliwatts. information for using the sc?88 surface mount package minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the to- tal design. the fo...
Description Complementary Dual General Purpose Amplifier Transistor

File Size 67.17K  /  8 Page

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    MMBD330 MMBD330T1

ON Semiconductor
Part No. MMBD330 MMBD330T1
OCR Text ... 150 c 25 c 0.625 c/w = 200 milliwatts ? the soldering temperature and time should not exceed 260 c for more than 10 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient should be 5 c or less. ? afte...
Description Switching Diode MINIBLOC

File Size 55.74K  /  8 Page

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For milliwatts Found Datasheets File :: 1872    Search Time::1.5ms    
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