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  54122-809-32-1000 Datasheet PDF File

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    8097-90

Intel Corporation
Part No. 8097-90
Description (809x-90) Microcontroller

File Size 871.04K  /  19 Page

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Amphenol Cables on Demand

Part No. SF-NLMAMB0001-0001
Description Amphenol SF-NLMAMB0001-0001 OSFP 400G Loopback Adapter Module for OSFP Port Testing - 0dB Attenuation & 0W Power Consumption [400-Gigabit Ethernet Ready]
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    22-28-8091

Molex Electronics Ltd.
Part No. 22-28-8091
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle Surface Mount Compatible, 9 Circuits, Tin (Sn) Plating, Mating Pin Length 8.23mm (.324)

File Size 356.30K  /  20 Page

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Amphenol Cables on Demand

Part No. SF-NLNAMB0001-0001
Description Amphenol SF-NLNAMB0001-0001 QSFP-DD 400G Loopback Adapter Module for QSFP-DD Port Testing - 0dB Attenuation & 0W Power Consumption [400-Gigabit Ethernet Ready]
Tech specs    

Official Product Page

    8096-90

Intel Corporation
Part No. 8096-90
Description (809x-90) Microcontroller

File Size 1,253.43K  /  19 Page

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Amphenol Communications Solutions

Part No. 54122-403161000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    09-50-8093

Molex Electronics Ltd.
Part No. 09-50-8093
Description 3.96mm (.156) Pitch KK? Crimp Terminal Housing, Friction Ramp, 9 Circuits

File Size 400.94K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-810341000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 34 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    14-56-8090

Molex Electronics Ltd.
Part No. 14-56-8090
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 22, 0.76μm (30μ) Gold (Au), 9 Circuits

File Size 163.87K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-415161000LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 16 Positions
Tech specs    

Official Product Page

    8097

Sonardyne sound in depth
Part No. 8097
Description Modular Over-The-Side Deployment Pole

File Size 187.16K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-109281000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 28 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    OKI[OKI electronic componets]
Part No. MSM5412222B-XXTS-K MSM5412222B MSM5412222B-25JS MSM5412222B-25TS-K MSM5412222B-30JS MSM5412222B-30TS-K MSM5412222B-XXJS
Description 262,214-Word × 12-Bit Field Memory
262,214-Word 】 12-Bit Field Memory

File Size 125.93K  /  17 Page

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Amphenol Communications Solutions

Part No. 54122-110221000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 22 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Xicon Passive Components
Part No. 420-8809
Description
File Size 15.04K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-803161000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    809-IF90.0M-A

Oscilent Corporation
Part No. 809-IF90.0M-A
Description Mobile Communication

File Size 185.16K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-108261000LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 26 Positions
Tech specs    

Official Product Page

    BPC-8090

Protech Systems Co., Ltd.
Part No. BPC-8090
Description High Performance Core2 Duo Book Size PC

File Size 445.88K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-106061000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

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