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  54112-814-50-1250 Datasheet PDF File

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    87759-1250

Molex Electronics Ltd.
Part No. 87759-1250
Description
File Size 174.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-112502500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    T-11-1250-P3-MSC T-11-1250-R3-MSC T-11-1250-P3-MST T-11-1250-R3-MST T-11-1250-P3-SSC T-11-1250-P3-SFC T-11-1250-P3-SST T

Source Photonics, Inc.
Panasonic, Corp.
Part No. T-11-1250-P3-MSC T-11-1250-R3-MSC T-11-1250-P3-MST T-11-1250-R3-MST T-11-1250-P3-SSC T-11-1250-P3-SFC T-11-1250-P3-SST T-11-1250-P3-MFC T-11-1250-R3-SSC T-11-1250-R3-SST T-11-1250-R3-MFC T-11-1250-R3-SFC T-11-1250-P3-SFC-O T-11-1250-P3-SFC-G5 T-11-1250-P3-SFC-O-GR T-11-1250-P3-SFC-O-G5 T-11-1250-R3-S-O-G5
Description PIN-TIA Receiver Modules-Receptacle & Pigtailed(3.3V)
FIBER OPTIC RECEIVER, 1100-1650nm, THROUGH HOLE MOUNT, FC/PC CONNECTOR ROHS COMPLIANT PACKAGE-4
FIBER OPTIC RECEIVER, 1100-1650nm, PANEL MOUNT, FC/PC CONNECTOR ROHS COMPLIANT PACKAGE-4
FIBER OPTIC RECEIVER, 1100-1650nm, THROUGH HOLE MOUNT, SC/PC CONNECTOR

File Size 414.29K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-405201250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    VPP16-1250

TRIAD MAGNETICS
Part No. VPP16-1250
Description VPP16-1250

File Size 43.23K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-807161250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    VPS20-1250

TRIAD MAGNETICS
Part No. VPS20-1250
Description
File Size 110.85K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-809401250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ARIES ELECTRONICS INC
Part No. 12-81250-610C
Description DIP12, IC SOCKET

File Size 670.92K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-508121270LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MOLEX INC
Part No. 87758-1250
Description 2mm MGrid VHdr .38AuLF 12Ckt

File Size 104.89K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-107041250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Molex
Part No. 51110-1250
Description Multipole Connector; Gender:Male; No. of Contacts:12; Series:Milli-Grid; Body Material:Glass-filled Polyester; No. of Rows:2; Pitch Spacing:0.079" RoHS Compliant: Yes

File Size 31.06K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-808141250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70287-1250

Molex Electronics Ltd.
Part No. 70287-1250
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 14 Circuits, 8.13mm (.320) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective

File Size 303.46K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-107061250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Shenzhen Sunnyway Batte...
Part No. SW1250
Description General Battery

File Size 358.43K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-807201250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MM1250

Mitsumi Electronics, Corp.
Part No. MM1250
Description Monolithic IC MM1250

File Size 260.04K  /  9 Page

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Amphenol Communications Solutions

Part No. 54112-109401250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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