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For joint Found Datasheets File :: 5473 Search Time::1.641ms
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				LIGITEK electronics co., ltd.
Part No.	LI2040-PF
OCR Text	...ax Distance:2mm Min(From solder joint to case) 120X 25X Dip Soldering Preheat: 120 C Max Time(sec) Preheat time: 120 seconds Max Ramp-up 3 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:245 C Max Dipping Time:5 seconds Max Dista...
Description	ROUND TYPE LED LAMPS
File Size	109.86K / 6 Page	View it Online	Download Datasheet

				Lumberg
Part No.	SFV60 SFV50-6 SGV50-6 SGV70 SGV71 SGV30 SGV80 SFV30 SFV120 SFV40 SFV50 SGV SGV81 SGV60 SGV120 SGV40 SFV70 SFV81 SFV80 SFV71
OCR Text	joint acc. to IEC 60130-9, IP 40 Connecteurs circulaires avec verrouillage a vis suivant CEI 60130-9, IP 40 SFV SGV Einbaustecker nach IEC 60130-9, IP 40, mit Schraubverschluss und Lotanschlussen SFV: fur Frontmontage SGV: fur Ruckseitenmo...
Description	Rundsteckverbinder mit Schraubverschluss nach IEC 60130-9, IP 40
File Size	107.10K / 2 Page	View it Online	Download Datasheet

				LIGITEK electronics co., ltd.
Part No.	LFD495-62-XX-RP4-PF
OCR Text	...ax Distance:2mm Min(From solder joint to case) 120X 25X Dip Soldering Preheat: 120C Max Time(sec) Preheat time: 120 seconds Max Ramp-up 3C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:245 C Max Dipping Time:5 seconds Max Distance...
Description	FOUR DIGIT LED DISPLAY (0.4 lnch)
File Size	111.91K / 9 Page	View it Online	Download Datasheet

				Lumberg
Part No.	KFV60 KGV50-6 KGV70 KGV71 KGV30 KGV80 KFV120 KFV40 KFV50 KFV50_6 KFV30 KFV50/6 KFV70
OCR Text	joint acc. to IEC 60130-9, IP 40 Connecteurs circulaires avec verrouillage a vis suivant IEC 60130-9, IP 40 KFV KGV Einbaukupplung nach IEC 60130-9, IP 40, mit Schraubverschluss und Lotanschlussen KFV: fur Frontmontage KGV: fur Ruckseitenm...
Description	Rundsteckverbinder mit Schraubverschluss nach IEC 60130-9, IP 40
File Size	475.46K / 2 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	ARF1511
OCR Text	...nk (Use High Efficiency Thermal joint Compound and Planar Heat Sink Surface.) MIN TYP MAX UNIT C/W 10-2008 050-4927 Rev D 0.10 0.16 CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be...
Description	RF POWER MOSFET FULL-BRIDGE
File Size	95.06K / 2 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	ARF1510
OCR Text	...nk (Use High Efficiency Thermal joint Compound and Planar Heat Sink Surface.) MIN TYP MAX UNIT 050-4926 Rev F 10-2008 0.10 0.16 C/W CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should...
Description	RF POWER MOSFET FULL-BRIDGE
File Size	94.61K / 2 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	ARF1505
OCR Text	...nk (Use High Efficiency Thermal joint Compound and Planar Heat Sink Surface.) MIN TYP MAX UNIT C/W 050-4922 Rev F 10-2008 0.10 0.16 CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be...
Description	RF POWER MOSFET N-CHANNEL ENHANCEMENT MODE
File Size	138.88K / 4 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	ARF1501
OCR Text	...nk (Use High Efficiency Thermal joint Compound and Planar Heat Sink Surface.) MIN TYP MAX UNIT 3-2008 050-5982 Rev D 0.10 0.16 C/W CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should ...
Description	RF POWER MOSFET N-CHANNEL ENHANCEMENT MODE
File Size	137.64K / 4 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	ARF1500
OCR Text	...nk (Use High Efficiency Thermal joint Compound and Planar Heat Sink Surface.) MIN TYP MAX UNIT C/W 10-2008 050-5965 Rev E 0.10 0.16 CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be...
Description	RF POWER MOSFET N-CHANNEL ENHANCEMENT MODE
File Size	135.61K / 4 Page	View it Online	Download Datasheet

For joint Found Datasheets File :: 5473 Search Time::1.641ms
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