i ntegrated c ircuits d ivision www.ixysic.com ds-XCA170-r04 1 XCA170 single-pole, normally open optomos ? relay e 3 pb part # description XCA170 6-pin dip (50/tube) XCA170s 6-pin surface mount (50/tube) XCA170str 6-pin surface mount (1,000/reel) parameter ratings units blocking voltage 350 v p load current 100 ma rms / ma dc on-resistance (max) 50 ? control current to operate 5 ma applications features description ordering information pin configuration ? telecommunications ? telecom switching ? tip/ring circuits ? modem switching (laptop, notebook, pocket size) ? hook switch ? dial pulsing ? ground start ? ringing injection ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment?patient/equipment isolation ? security ? aerospace ? industrial controls ? 3750v rms input/output isolation ? low drive power requirements (ttl/cmos compatible) ? high reliability ? arc-free with no snubbing circuits ? fcc compatible ? vde compatible ? no emi/rfi generation ? small 6-pin package ? machine insertable, wave solderable ? surface mount tape & reel version available switching characteristics of normally open devices approvals ? ul recognized component: file e76270 ? csa certified component: certificate 1175739 ? en/iec 60950-1 certified component: tuv certificate b 09 07 49410 004 form-a i f i load 10% 90% t on t off 1 3 2 4 5 6 + control C control do not use load do not use load ac/dc configuration 1 3 2 4 5 6 + control C control do not use + load C load dc only configuration the XCA170 is a 350v, 100ma, 50 ? , normally open (1-form-a) solid state relay that features high sensitivity and that, using optically coupled mosfet technology, provides 3750v rms of input to output isolation. its optically coupled outputs, which use the patented optomos architecture, are controlled by a highly efficient gaaias infrared led. useful as a replacement for mechanical relays, the XCA170 offers the superior reliability associated with semiconductor devices. because it has no moving parts, it offers faster, bounce-free switching in a more compact surface mount or through hole package.
i ntegrated c ircuits d ivision www.ixysic.com 2 r04 XCA170 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. absolute maximum ratings @ 25oc parameter ratings units blocking voltage 350 v p reverse input voltage 5 v input control current peak (10ms) 50 ma 1a input power dissipation 1 150 mw total power dissipation 2 800 mw isolation voltage, input to output 3750 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / oc 2 derate linearly 6.67 mw / oc parameter conditions symbol min typ max units output characteristics load current ac/dc con? guration, continuous - i l - - 100 ma rms / ma dc dc con? guration, continuous - - - 180 ma dc peak t=10ms i lpk - - 350 ma p on-resistance 1 ac/dc con? guration i l =120ma r on -3150 ? dc con? guration i l =200ma - 10 15 off-state leakage current v l =350v p i leak --1a switching speeds turn-on i f = 5ma, v l = 10v t on --5ms turn-off t off --5ms output capacitance v l =50v, f=1mhz c out -25 - pf input characteristics input control current to activate i l = 120ma i f --5ma input control current to deactivate - i f 0.4 0.7 - ma input voltage drop i f = 5ma v f 0.9 1.2 1.4 v reverse input current v r = 5v i r - - 10 a common characteristics capacitance, input to output - c i/o -3 -pf 1 measurement taken within 1 second of on-time. electrical characteristics @ 25oc
i ntegrated c ircuits d ivision XCA170 www.ixysic.com 3 r04 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. performance data @25oc (unless otherwise noted)* typical led forward voltage drop (n=50, i f =5ma) 35 30 25 20 15 10 5 0 1.17 1.19 1.21 1.23 1.25 led forward voltage drop (v) device count (n) typical turn-on time (n=50, i l =100ma dc ) 0.67 0.83 0.99 1.14 0.75 0.91 1.06 turn-on time (ms) device count (n) 25 20 15 10 5 0 typical turn-off time (n=50, i l =100ma dc ) 0.11 0.17 0.22 0.28 0.25 0.19 0.14 turn-off time (ms) device count (n) 25 20 15 10 5 0 typical i f for switch operation (n=50, i l =100ma dc ) 0.50 0.62 0.75 0.44 0.56 0.69 0.81 led current (ma) device count (n) 25 20 15 10 5 0 typical i f for switch dropout (n=50, i l =100ma dc ) 25 20 15 10 5 0 0.50 0.62 0.75 0.44 0.56 0.69 0.81 led current (ma) device count (n) typical on-resistance distribution (n=50, i l =100ma dc ) 25 20 15 10 5 0 29.09 30.63 32.16 33.70 29.86 31.40 32.93 on-resistance ( : ) device count (n) typical blocking voltage distribution (n=50) 25 20 15 10 5 0 424.0 434.5 444.9 455.4 429.3 439.7 450.1 blocking voltage (v p ) device count (n) typical led forward voltage drop vs. temperature temperature (oc) led forward voltage drop (v) 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 i f =50ma i f =30ma i f =20ma i f =10ma i f =5ma typical turn-on time vs. led forward current (i l =100ma dc ) led forward current (ma) turn-on time (ms) 0 5 1015202530354045 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 50 typical turn-off time vs. led forward current (i l =100ma dc ) led forward current (ma) turn-off time (ms) 0 5 1015202530354045 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 50
i ntegrated c ircuits d ivision www.ixysic.com 4 r04 XCA170 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. performance data @25oc (unless otherwise noted)* typical turn-on time vs. temperature (i l =100ma dc ) temperature (oc) i f =5ma i f =10ma i f =20ma turn-on time (ms) -40 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -20 0 20 40 60 80 100 120 typical turn-off time vs. temperature (i l =100ma dc ) temperature (oc) turn-off time (ms) -40 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 -20 0 20 40 60 80 100 120 typical on-resistance vs. temperature (i f =2ma, i l =100ma dc ) temperature (oc) on-resistance ( : ) -40 70 60 50 40 30 20 10 0 -20 0 20 40 60 80 100 120 typical i f for switch operation vs. temperature (i l =100ma dc ) temperature (oc) led current (ma) -40 6 5 4 3 2 1 0 -20 0 20 40 60 80 100 120 typical i f for switch dropout vs. temperature (i l =100ma dc ) temperature (oc) led current (ma) -40 6 5 4 3 2 1 0 -20 0 20 40 60 80 100 120 typical load current vs. load voltage (i f =5ma) load voltage (v) load current (ma) 120 100 80 60 40 20 0 -20 -40 -60 -80 -100 -120 -3 -4 -2 -1 0 1 2 3 4 maximum load current vs. temperature temperature (oc) load current (ma) 160 140 120 100 80 60 40 20 0 -40 -20 0 20 40 60 80 120 100 i f =10ma i f =5ma i f =2ma typical blocking voltage vs. temperature temperature (oc) blocking voltage (v p ) -40 455 450 445 440 435 430 425 420 -20 0 20 40 60 80 100 typical leakage vs. temperature measured across pins 4&6 temperature (oc) leakage ( p a) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 -20 0 20 40 60 80 100 energy rating curve time load current (a) 10 p s 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1ms 100 p s 100ms 1s 10ms 10s 100s
i ntegrated c ircuits d ivision XCA170 www.ixysic.com 5 r04 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating XCA170 / XCA170s msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time XCA170 / XCA170s 250oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb
i ntegrated c ircuits d ivision www.ixysic.com 6 r04 XCA170 dimensions mm (inches) pcb hole pattern 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 5.080 0.127 (0.200 0.005) 6 - 0.800 dia. (6 - 0.031 dia.) 0.254 0.0127 (0.010 0.0005) 9.144 0.508 (0.360 0.020) 7.239 typ (0.285 typ) 7.620 0.254 (0.300 0.010) 3.302 0.051 (0.130 0.002) 4.064 typ (0.160 typ) 0.457 0.076 (0.018 0.003) 8.382 0.381 (0.330 0.015) 2.54 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 1.651 0.254 (0.065 0.010) pin 1 dimensions mm (inches) pcb land pattern 0.254 0.0127 (0.010 0.0005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 3.302 0.051 (0.130 0.002) 4.445 0.254 (0.175 0.010) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 8.382 0.381 (0.330 0.015) 2.54 0.127 (0.100 0.005) 9.524 0.508 (0.375 0.020) 6.350 0.127 (0.250 0.005) 0.457 0.076 (0.018 0.003) 1.651 0.254 (0.065 0.010) 1.651 0.254 (0.065 0.010) pin 1 XCA170 XCA170s mechanical dimensions
i ntegrated c ircuits d ivision specification: ds-XCA170-r04 ? copyright 2012, ixys integrated circuits division optomos ? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 12/22/2012 for additional information please visit our website at: www.ixysic.com 7 XCA170 ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infri ngement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. notes: 1. all dimensions carry tolerances of eia standard 481-2 2. the tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 dimensions mm (inches) embossment embossed carrier 330.2 dia (13.00 dia) top cover tape thickness 0.102 max (0.004 max) w=16.00 (0.63) b 0 = 10.10 (0.398) a 0 = 10.10 (0.398) p = 12.00 (0.472) k 1 = 3.80 (0.15) k 0 = 4.90 (0.19) user direction of feed XCA170str tape & reel
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