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an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. CSD96497Q5MC slps714 ? january 2019 CSD96497Q5MC synchronous buck nexfet ? smart power stage 1 1 features 1 ? 65-a continuous operating current capability ? over 93.5% system efficiency at 30 a ? high-frequency operation (up to 1.25 mhz) ? diode emulation mode with fccm ? temperature compensated bi-directional current sense ? analog temperature output ? fault monitoring - otp, hs ocp, and short circuit protection ? 3.3-v and 5-v pwm signal compatible ? tri-state pwm input ? integrated bootstrap switch ? optimized dead time for shoot-through protection ? high-density qfn 5-mm 6-mm footprint ? ultra-low-inductance package ? system optimized pcb footprint ? dualcool ? packaging ? rohs compliant, lead-free terminal plating ? halogen free 2 applications ? multiphase synchronous buck converters ? high-frequency applications ? high-current, low-duty cycle applications ? pol dc-dc converters ? memory and graphic cards ? desktop and server vr12.x and vr13.x v-core synchronous buck converters ? high-current pol for network communications 3 description the csd96497 nexfet ? power stage is a highly optimized design for use in a high-power, high- density synchronous buck converter. this product integrates the driver ic and power mosfets to complete the power stage switching function. this combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm 6-mm outline package. it also integrates accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. in addition, the pcb footprint has been optimized to help reduce design time and simplify the completion of the overall system design. device information (1) device media qty package ship csd96497 13-in reel 2500 qfn 5.00-mm 6.00-mm tape and reel csd96497t 7-in reel 250 (1) for all available packages, see the orderable addendum at the end of the data sheet. simplified application typical power stage efficiency output current (a) efficiency ( % ) power loss (w) 0 10 20 30 40 50 60 65 30 0 40 3 50 6 60 9 70 12 80 15 90 18 100 21 v dd = 5v v in = 12 v v out = 1.8 v l out = 150 nh f sw = 600 khz t a = 25 c d000 pwm tao/flt CSD96497Q5MC iout refin vin vos vsw pgnd vdd em/fccm lset boot boot_r c vdd pgnd pgnd pwm tao/flt iout refin em/fccm r vdd 5v in r lset pgnd pgnd pgnd r boot c boot v in c in v out tools & software technical documents ordernow productfolder support &community
2 CSD96497Q5MC slps714 ? january 2019 www.ti.com submit documentation feedback copyright ? 2019, texas instruments incorporated 4 revision history date revision notes january 2019 * initial release.
3 CSD96497Q5MC www.ti.com slps714 ? january 2019 submit documentation feedback copyright ? 2019, texas instruments incorporated 5 device and documentation support 5.1 trademarks dualcool, nexfet are trademarks of texas instruments. all other trademarks are the property of their respective owners. 5.2 electrostatic discharge caution these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 5.3 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions.
4 CSD96497Q5MC slps714 ? january 2019 www.ti.com submit documentation feedback copyright ? 2019, texas instruments incorporated 6 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation. 6.1 mechanical drawing 1. all linear dimensions are in millimeters. any dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. the package thermal pads must be soldered to the printed circuit board for thermal and mechanical performance. 4. exposed tie bar features may vary. c 22x 0.3 0.2 5.4 0.1 10x 0.6 0.4 2x 5 3.3 0.1 20x 0.5 1.05 max 0.05 0.00 2x (0.31) 2x 0.6 0.4 b 5.1 4.9 a 6.1 5.9 (0.2) typ 2x (2) 4x (0.25) (0.51) (0.51) typ 4223036/a 07/2016 pin 1 index area seating plane 0.08 c note 4 typ 1 6 7 12 (optional) pin 1 id 0.1 c a b 0.05 c exposed thermal pad 13 notes: note 4
5 CSD96497Q5MC www.ti.com slps714 ? january 2019 submit documentation feedback copyright ? 2019, texas instruments incorporated 6.2 recommended pcb land pattern 1. all linear dimensions are in millimeters. any dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. this package is designed to be soldered to thermal pads on the board. for more information, see qfn/son pcb attachment (slua271). 4. vias are optional depending on application, refer to device data sheet. if any vias are implemented, refer to their locations shown on this view. it is recommended that vias under paste be filled, plugged or tented. (0.05) typ 2x (1.13) 6x (1.32) 2x (0.31) 2x (2.85) (3.3) 20x (0.5) (4.7) 22x (0.25) 10x (0.7) (5.4) (r0.05) typ ( 0.2) via typ 6x (1.4) 2x (0.7) symm 1 6 7 12 symm land pattern example 13 metal under solder mask 2x solder mask opening 2x 5 8 0.05 min all around 0.05 max all around solder mask opening solder mask metal under solder mask defined (pads 6 - 7, optional for other pads) metal solder mask opening solder mask details non solder mask defined (preferred for pads 1 - 5 & 8 - 12)
6 CSD96497Q5MC slps714 ? january 2019 www.ti.com submit documentation feedback copyright ? 2019, texas instruments incorporated 6.3 recommended stencil opening 1. all linear dimensions are in millimeters. any dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. ipc-7525 may have alternate design recommendations. 2x (0.31) 2x (0.7) 22x (0.25) 10x (0.7) 20x (0.5) 8x (1.12) 8x (1.41) (4.7) (r0.05) typ (0.66) typ (1.32) typ (0.8) typ solder paste example symm 1 6 7 12 symm typ metal 13 metal under solder mask 2x 5 8
CSD96497Q5MC www.ti.com slps714 ? january 2019 7 submit documentation feedback copyright ? 2019, texas instruments incorporated (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. pre_prod unannounced device, not in production, not available for mass market, nor on the web, samples not available. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. space (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti ' s terms " lead-free " or " pb-free " mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br) : ti defines " green " to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) space (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. space (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device space (5) multiple device markings will be inside parentheses. only on device marking contained in parentheses and separated by a " ~ " will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. important information and disclaimer: the information provided on this page represents ti ' s knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti ' s liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. 6.4 package option addendum 6.4.1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) op temp ( c) device marking (4) (5) csd96497 active vson-clip dmc 12 2500 pb-free (rohs exempt) cu sn level-2-260c-1 year ? 55 to 150 96497mc
8 CSD96497Q5MC slps714 ? january 2019 www.ti.com submit documentation feedback copyright ? 2019, texas instruments incorporated 6.4.2 tape and reel information device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant csd96497 vson- clip dmc 12 2500 330 12.4 5.30 6.30 1.20 8.00 12.00 q1 reel width (w1) reel dimensions a0 b0k0 w dimension designed to accommodate the component lengthdimension designed to accommodate the component thickness overall width of the carrier tape pitch between successive cavity centers dimension designed to accommodate the component width tape dimensions k0 p1 b0 w a0 cavity quadrant assignments for pin 1 orientation in tape pocket quadrants sprocket holes q1 q1 q2 q2 q3 q3 q4 q4 reel diameter user direction of feed p1
package option addendum www.ti.com 10-feb-2019 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples CSD96497Q5MC active vson-clip dmc 12 2500 green (rohs & no sb/br) cu sn level-2-260c-1 year -55 to 150 96497mc CSD96497Q5MCt active vson-clip dmc 12 2500 green (rohs & no sb/br) cu sn level-2-260c-1 year -55 to 150 96497mc (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
package option addendum www.ti.com 10-feb-2019 addendum-page 2
important notice and disclaimer ti provides technical and reliability data (including datasheets), design resources (including reference designs), application or other design advice, web tools, safety information, and other resources ?as is? and with all faults, and disclaims all warranties, express and implied, including without limitation any implied warranties of merchantability, fitness for a particular purpose or non-infringement of third party intellectual property rights. these resources are intended for skilled developers designing with ti products. you are solely responsible for (1) selecting the appropriate ti products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. these resources are subject to change without notice. ti grants you permission to use these resources only for development of an application that uses the ti products described in the resource. other reproduction and display of these resources is prohibited. no license is granted to any other ti intellectual property right or to any third party intellectual property right. ti disclaims responsibility for, and you will fully indemnify ti and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. ti?s products are provided subject to ti?s terms of sale ( www.ti.com/legal/termsofsale.html ) or other applicable terms available either on ti.com or provided in conjunction with such ti products. ti?s provision of these resources does not expand or otherwise alter ti?s applicable warranties or warranty disclaimers for ti products. mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2019, texas instruments incorporated

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