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  (0.635 mm) .025" qms series note: some lengths, styles and options are non-standard, non-returnable. board mates: qfs cable mates: 6qcd standoffs: so, jsom f-217 also available (moq required) ? other platings ? guide posts ? without pcb alignment pins (05.75 and 06.75 only) ? hot pluggable ? 64 (-dp) and 104 positions per row contact samtec. rugged ground plane header (1.60 mm) .063" nominal wipe requires standoff so-1524-03-01-01-l or jsom-1524-02 for 15.24 mm or so-2215-02-01-01-l for 22 mm board spacing. connectors designed to not fully seat when mated. qms pins per row no. of pairs plating option C026, C052, C078 (52 total pins per bank = Cd) C016, C032, C048 (16 pairs per bank = CdCdp) (C078 & C048 not available with C09.75 lead style) Cd = single-ended CdCdp = differential pair lead style type a other option Ck = (5.50 mm) .217" dia polyimide flm pick & place pad specify lead style from chart Cl (C05.75 and C06.75 lead style only) = 10 " (0.25 m) gold on signal pins and ground plane (tin on signal pin tails, and ground plane tails) Csl (C09.75 lead style only) = 10 " (0.25 m) gold on signal pins and ground plane (tin on signal pin tails, and ground plane tails) mated height* lead style a qfs lead style C04.25 C06.25 C05.75 (5.38) .212 10 mm 12 mm C06.75 (6.35) .250 11 mm 13 mm C09.75 (9.35) .368 14 mm 16 mm *processing conditions will affect mated height. see so series for board space tolerances. (0.44) .017 st ac k height 02 01 (21.34) .840 (0.23) .009 (7.26) .286 (no . of banks) x (21.34) .840 - (0.51) .020 (0.635) .025 (2.29) .090 (0.25) .010 (6.35) .250 (7.52) .296 a Cd CdCdp industry standard interconnects terminal socket banks stack height sumit ? asp-129637-01 asp-129646-01 1 15.24 mm pci/104-express ? asp-129637-03 asp-129646-03 3 15.24 mm pci/104-express ? asp-129637-13 asp-129646-22 1 15.24 mm pci/104-express ? asp-142781-02 asp-129646-02 2 22 mm pci/104-express ? asp-142781-03 asp-129646-03 3 22 mm for complete specifcations and recommended pcb layouts see www.samtec.com?qms insulator material: liquid crystal polymer terminal & ground plane material: phosphor bronze plating: au over 50 " (1.27 m) ni (tin on ground plane tail) current rating: contact: 2.6 a per pin (1 pin powered per row) ground plane: 15.7 a per ground plane (1 ground plane powered) operating temp: -55 c to +125 c voltage rating: 300 vac mated with qfs rohs compliant: yes for complete scope of recognitions see www.samtec.com/quality recognitions processing specifications leadCfree solderable: ye s smt lead coplanarity: (0.10 mm) .004" max (026-052) (0.15 mm) .006" max (078) board stacking: for applications requiring more than two connectors per board, contact ipg@samtec.com file no. e111594 standards protocols ? sumit ? ? pci/104-express ? ? 100 gbe ? fibre channel ? xaui ? pci express ? ? s ata gbps 2 5 high-speed channel performance qms-dp/qfs-dp @ 10 mm mated stack height rating based on samtec reference channel. for full si performance data visit samtec.com or contact sig@samtec.com application increased insertion depth for rugged applications qmsC026C06.75ClCdCa qmsC032C06.75ClCdCdpCa integral metal plane for power or ground www.samtec.com due to technical progress, all designs, specifcations and components are subject to change without notice.


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