cystech electronics corp. spec. no. : c824l3 issued date : 2003.07.31 revised date :2013.11.12 page no. : 1/7 BTP2907SL3 cystek product specification low v ce(sat) pnp epitaxial planar transistor BTP2907SL3 features ? excellent dc current gain characteristics ? low saturation voltage v ce (sat)=-0.5v(max) (i c =-1a, i b =-100ma). ? pb-free lead plating and halogen-free package symbol outline BTP2907SL3 ordering information device package shipping BTP2907SL3-0-t3-g sot-223 (pb-free lead plating and halogen-free package) 2500 pcs / tape & reel sot-223 c c b e b base c collector e emitter environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t3 : 2500 pc s / tape & reel, 13? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c824l3 issued date : 2003.07.31 revised date :2013.11.12 page no. : 2/7 BTP2907SL3 cystek product specification absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo -100 v collector-emitter voltage v ceo -80 v emitter-base voltage v ebo -6 v collector current(dc) i c -1 collector current(pulsed) (note 1) i cp -2 (note) a power dissipation @ t c =25 pd 2 w junction temperature tj 150 c storage temperature tstg -55~+150 c note : single pulse, pw 10ms, duty cycle 30%. characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo -100 - - v i c =-50 a bv ceo -80 - - v i c =-1ma bv ebo -5 - - v i e =-50 a i cbo - - -100 na v cb =-80v i ebo - - -100 na v eb =-6v *v ce(sat) - - -0.5 v i c =-1a, i b =-100ma *h fe 180 - 390 - v ce =-2v, i c =-100ma f t - 125 - mhz v ce =-10v, i c =-50ma, f=100mhz cob - 10 20 pf v cb =-10v, i e =0a, f=1mhz *pulse test: pulse width 380 s, duty cycle 2% recommended soldering footprint
cystech electronics corp. spec. no. : c824l3 issued date : 2003.07.31 revised date :2013.11.12 page no. : 3/7 BTP2907SL3 cystek product specification typical characteristics emitter grounded output characteristics 0 0.05 0.1 0.15 0.2 0.25 0123456 -v ce , collector-to-emitter voltage(v) -i c , collector current(a) 200ua 300ua 400ua 500ua 1ma -i b =100u a emitter grounded output characteristics 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0123456 -v ce , collector-to-emitter voltage(v) -i c , collector current(a) 1m a 1.5ma 2ma 2.5ma 5ma -i b =500ua current gain vs collector current 10 100 1000 1 10 100 1000 -i c , collector current(ma) h fe , current gain ta=125c ta= 75c ta= 25c ta= -25c -v ce =1v current gain vs collector current 10 100 1000 1 10 100 1000 -i c , collector current(ma) h fe , current gain ta=125c ta=75c ta=25c ta=-25c -v ce =2v current gain vs collector current 10 100 1000 1 10 100 1000 -i c , collector current(ma) h fe , current gain ta=125c ta=75c ta=25c ta=-25c -v ce =5v saturation voltage vs collector current 10 100 1000 1 10 100 1000 -i c , collector current(ma) -v ce(sat) , saturation voltage(mv) ta=125c ta=75c ta=25c ta=-25c v cesat @i c =10i b
cystech electronics corp. spec. no. : c824l3 issued date : 2003.07.31 revised date :2013.11.12 page no. : 4/7 BTP2907SL3 cystek product specification typical characteristics(cont.) saturation voltage vs collector current 10 100 1000 1 10 100 1000 -i c , collector current(ma) -v ce(sat) , saturation voltage(mv) ta=125c ta=75c ta=25c ta=-25c v ce(sat) @i c =20i b saturation voltage vs collector current 10 100 1000 10000 1 10 100 1000 -i c , collector current(ma) -v ces(sat) , saturation voltage(mv) ta=125c ta=75c ta=25c ta=-25c v ce(sat) @i c =50i b saturation voltage vs collector current 100 1000 10000 1 10 100 1000 -i c , collector current(ma) -v ce(sat) , saturation voltage(mv) v be(sat) @i c =10i b ta=-25c ta=25c ta=75c ta=125c on voltage vs collector current 100 1000 1 10 100 1000 -i c , collector current(ma) -v be(on) , on voltage(mv) v be(on) @v ce =-5v ta=-25c ta=25c ta=75c ta=125c capacitance vs reverse-biased voltage 1 10 100 1000 0.1 1 10 100 v r , reverse-biased voltage(v) capacitance(pf) cib cob power derating curve 0 0.5 1 1.5 2 2.5 0 50 100 150 200 t c , case temperature() p d , power dissipation(w)
cystech electronics corp. spec. no. : c824l3 issued date : 2003.07.31 revised date :2013.11.12 page no. : 5/7 BTP2907SL3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c824l3 issued date : 2003.07.31 revised date :2013.11.12 page no. : 6/7 BTP2907SL3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c824l3 issued date : 2003.07.31 revised date :2013.11.12 page no. : 7/7 BTP2907SL3 cystek product specification sot-223 dimension *: typical 3-lead sot-223 plastic surface mounted package cystek package code: l3 321 f b a c d e g h a1 a2 i marking: date code device name 2907s style: pin 1.base 2.collector 3.emitter inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1142 0.1220 2.90 3.10 g 0.0551 0.0709 1.40 1.80 b 0.2638 0.2874 6.70 7.30 h 0.0098 0.0138 0.25 0.35 c 0.1299 0.1457 3.30 3.70 i 0.0008 0.0039 0.02 0.10 d 0.0236 0.0315 0.60 0.80 a1 *13 o - *13 o - e *0.0906 - *2.30 - a2 0 o 10 o 0 o 10 o f 0.2480 0.2638 6.30 6.70 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
|
