q?v~zy??q?v?_ra]?????qcabgq HFH10N90Z_hfa10n90z absolute maximum ratings t c =25 e unless otherwise specified HFH10N90Z / hfa10n90z 900v n-channel mosfet oct 2016 parameter value unit bv dss 900 v i d 10 a r ds(on), typ 1.0
qg ,typ 72 nc key parameters features * drain current limited by maximum junction temperature thermal resistance characteristics ? superior avalanche rugged technology ? robust gate oxide technology ? very low intrinsic capacitances ? excellent switching characteristics ? 100% avalanche tested ? rohs compliant ? built-in esd diode symbol parameter to-3p to-247 unit v dss drain-source voltage 900 v i d drain current ? continuous (t c = 25 e ) 10 10 * a drain current ? continuous (t c = 100 e ) 6.3 6.3 * a i dm drain current ? pulsed (note 1) 40 40 * a v gs gate-source voltage 30 v e as single pulsed avalanche energy (note 2) 950 mj i ar avalanche current (note 1) 9.0 a e ar repetitive avalanche energy (note 1) 29 mj dv/dt peak diode recovery dv/dt (note 3) 4.0 v/ns p d power dissipation (t c = 25 e ) - derate above 25 e 290 115 w 2.32 0.92 w/ e v esd(g-s) gate source esd(hbm-c=100pf, r=1.5k ? 4 kv t j , t stg operating and storage temperature range -55 to +150 e t l maximum lead temperature for soldering purposes, 1/8? from case for 5 seconds 300 e symbol parameter to-3p to-247 unit r jc thermal resistance, junction-to-case, max. 0.43 1.08 e /w r cs thermal resistance, case-to-sink, typ. 0.24 -- e /w r ja thermal resistance, junction-to-ambient, max. 40 40 e /w HFH10N90Z to-3p hfa10n90z to-247 symbol g d s g d s
q?v~zy??q?v?_ra]?????qcabgq HFH10N90Z_hfa10n90z notes : 1. repetitive rating : pulse width limited by maximum junction temperature 2. l=18mh, i as =10a, v dd =50v, r g =25 : , starting t j =25 q c 3. i sd ? $ g l g w ? $ v 9 dd ? % 9 dss , starting t j =25 q c 4. pulse test : pulse width ? v ' x w \ & |