? semiconductor components industries, llc, 2015 june, 2015 ? rev. 2 1 publication order number: ncp51400/d ncp51400, ncv51400 3 amp v tt termination regulator ddr1, ddr2, ddr3, lpddr3, ddr4 the ncp51400 is a source/sink double data rate (ddr) termination regulator specifically designed for low input voltage and low?noise systems where space is a key consideration. the ncp51400 maintains a fast transient response and only requires a minimum output capacitance of 20 f. the ncp51400 supports a remote sensing function and all power requirements for ddr v tt bus termination. the ncp51400 can also be used in low?power chipsets and graphics processor cores that require dynamically adjustable output voltages. the ncp51400 is available in the thermally?efficient dfn10 exposed pad package, and is rated both green and pb?free. features ? for automotive applications ? input voltage rails: supports 2.5 v, 3.3 v and 5 v rails ? pv cc voltage range: 1.1 v to 3.5 v ? integrated power mosfets ? fast load?transient response ? p good ? logic output pin to monitor v tt regulation ? en ? logic input pin for shutdown mode ? v ri ? reference input allows for flexible input tracking either directly or through resistor divider ? remote sensing (v tts ) ? built?in soft start, under voltage lockout and over current limit ? thermal shutdown ? small, low?profile 10?pin, 3x3 dfn package ? ncv51400mwtxg ? w ettable flank option for enhanced optical inspection ? ncv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable* ? these devices are pb?free and are rohs compliant applications ? ddr memory termination ? desktop pc?s, notebooks, and workstations ? servers and networking equipment ? telecom/datacom, gsm base station ? graphics processor core supplies ? set top boxes, lcd?tv/pdp?tv, copier/printers ? chipset/ram supplies as low as 0.5 v ? active bus termination www. onsemi.com dfn10, 3x3, 0.5p case 506cl device package shipping ? ordering information dfn10 (pb?free) 3000 / tape & reel ncp51400mntxg pin connection ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. marking diagram 51400 = specific device code a = assembly location l = wafer lot y = year w = work week = pb?free package 51400 alyw (note: microdot may be in either location) 1 2 3 4 5 10 9 8 7 6 v cc p good gnd en v ro v ri pv cc v tt p gnd v tts gnd + exposed pad NCV51400MNTXG* ncv51400mwtxg*
ncp51400, ncv51400 www. onsemi.com 2 pin function description pin number pin name pin function 1 v ri v tt external reference input ( set to v ddq / 2 thru resistor network ). 2 pv cc power input. internally connected to the output source mosfet. 3 v tt power output of the linear regulator. 4 p gnd power ground. internally connected to the output sink mosfet. 5 v tts v tt sense input. the v tts pin provides accurate remote feedback sensing of v tt . connect v tts to the remote ddr termination bypass capacitors. 6 v ro independent buffered v tt reference output. sources and sinks over 5 ma. connect to gnd thru 0.1 f ceramic capacitor. 7 en shutdown control input. cmos compatible input. logic high = enable, logic low = shutdown. connect to v ddq for normal operation. 8 gnd common ground. 9 p good power good (open drain output). 10 v cc analog power supply input. connect to gnd thru a 1 ? 4.7 f ceramic capacitor. thermal pad pad for thermal connection. the exposed pad must be connected to the ground plane using multiple vias for maximum power dissipation performance. absolute maximum ratings rating symbol value unit v cc , pv cc , v tt , v tts , v ri , v ro (note 1) ?0.3 to 6.0 v en, p good (note 1) ?0.3 to 6.0 v p gnd to gnd (note 1) ?0.3 to +0.3 v storage temperature t stg ?55 to 150 c operating junction temperature range t j 150 c esd capability, human body model (note 2) esd hbm 2000 v stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. refer to electrical characteristics and application information for safe operating area. 2. this device series incorporates esd protection and is tested by the following method: esd human body model tested per aec?q100?002 (eia/jesd22?a114) esd machine model tested per aec?q100?003 (eia/jesd22?a115) latchup current maximum rating tested per jedec standard: jesd78. dissipation ratings package t a = 25 c power rating derating factor above t a = 25 c t a = +85 c power rating 10?pin dfn 1.92 w 19 mw/ c 0.79 w recommened operating conditions rating symbol value unit supply voltage v cc 2.375 to 5.5 v voltage range v ro ?0.1 to 1.8 v v ri 0.5 to 1.8 pv cc , v tt , v tts , en, p good ?0.1 to 3.5 p gnd ?0.1 to +0.1 operating free?air temperature t a ?40 to +125 c functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability.
ncp51400, ncv51400 www. onsemi.com 3 electrical characteristics ?40 c t a 125 c; v cc = 3.3 v; pv cc = 1.8 v; v ri = v tts = 0.9 v; en = v cc ; c out = 3 x 10 f (ceramic); unless otherwise noted. parameter conditions symbol min typ max unit supply current v cc supply current t a = +25 c, en = 3.3 v, no load i vcc 0.7 1 ma v cc shutdown current t a = +25 c, en = 0 v, v ri = 0 v, no load i vcc shd 65 80 a t a = +25 c, en = 0 v, v ri > 0.4 v, no load 200 400 v cc uvlo threshold wake?up, t a = +25 c v uvlo 2.2 2.3 2.375 v hysteresis 50 mv pv cc supply current t a = +25 c, en = 3.3 v, no load i pvcc 1 50 a pv cc shutdown current t a = +25 c, en = 0 v, no load i pvcc shd 0.1 50 a v tt output v tt output dc voltage pv cc = 1.50 v, v ro = 0.75 v, i tt = 0 a v os 0.75 v pv cc = 1.35 v, v ro = 0.675 v, i tt = 0 a 0.675 pv cc = 1.20 v, v ro = 0.60 v, i tt = 0 a 0.60 v tt output voltage tolerance to v ro pv cc = 1.50 v, v ro = 0.75 v, ?2 a < i tt < 2 a 18 mv pv cc = 1.35 v, v ro = 0.675 v, ?2 a < i tt < 2 a 20 pv cc = 1.20 v, v ro = 0.60 v, ?2 a < i tt < 2a 20 source current limit v tts = 90% * v ro 3 4.5 a sink current limit v tts = 110% * v ro 3.5 5.5 a soft?start current limit timeout t ss 200 s discharge mosfet on?resist- ance v ri = 0 v, v tt = 0.3 v, en = 0 v, t a = +25 c r dis 18 25 v ri ? input reference v ri voltage range v ri 0.5 1.8 v v ri input?bias current en = 3.3 v i ri +1 a v ri uvlo voltage v ri rising v ri uvlo 360 390 435 mv hysteresis v ri hys 60 v ro ? output reference v ro voltage v ri v v ro voltage tolerance to v ri ?10 ma < i ro < 10 ma, v ri = 1.25 v ?15 +15 mv ?10 ma < i ro < 10 ma, v ri = 0.9 v ?15 +15 ?10 ma < i ro < 10 ma, v ri = 0.75 v ?15 +15 ?10 ma < i ro < 10 ma, v ri = 0.6 v ?15 +15 v ro source current limit v ro = 0 v 10 40 ma v ro sink current limit v ro = 0 v 10 40 ma p good ? powergood comparator p good lower threshold (with respect to v ro ) ?23.5 % ?20% ?17.5 % v/v p good upper threshold (with respect to v ro ) 17.5% 20% 23.5% p good hysteresis 5% p good start?up delay start?up rising edge, v tts within 15% of v ro 2 ms
ncp51400, ncv51400 www. onsemi.com 4 electrical characteristics ?40 c t a 125 c; v cc = 3.3 v; pv cc = 1.8 v; v ri = v tts = 0.9 v; en = v cc ; c out = 3 x 10 f (ceramic); unless otherwise noted. parameter unit max typ min symbol conditions p good leakage current v tts = v ri (p good = true) p good = v cc + 0.2 v 1 a p good = false delay v tts is beyond 20% p good trip thresholds 10 s p good output low voltage i good = 4 ma 0.4 v en ? enable logic logic input threshold en logic high v ih 1.7 v en logic low v il 0.3 hysteresis voltage en pin v enhys 0.5 v logic leakage current en pin, t a = +25 c i ileak ?1 +1 a thermal shutdown thermal shutdown temperature t sd 150 c thermal shutdown hysteresis t sh 25 c product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. figure 1. typical ddr?3 application schematic
ncp51400, ncv51400 www. onsemi.com 5 figure 2. block diagram
ncp51400, ncv51400 www. onsemi.com 6 general the ncp51400 is a sink/source tracking termination regulator specifically designed for low input voltage and low external component count systems where space is a key application parameter. the ncp51400 integrates a high?performance, low?dropout (ldo) linear regulator that is capable of both sourcing and sinking current. the ldo regulator employs a fast feedback loop so that small ceramic capacitors can be used to support the fast load transient response. to achieve tight regulation with minimum effect of trace resistance, a remote sensing terminal, v tts , should be connected to the positive terminal of the output capacitors as a separate trace from the high current path from v tt . v ri ? generation of internal voltage reference the output voltage, v tt , is regulated to v ro . when v ri is configured for standard ddr termination applications, v ri can be set by an external equivalent ratio voltage divider connected to the memory supply bus (v ddq ). the ncp51400 supports v ri voltage from 0.5 v to 1.8 v, making it versatile and ideal for many types of low?power ldo applications. v ro ? reference output when it is configured for ddr termination applications, v ro generates the ddr v tt reference voltage for the memory application. it is capable of supporting both a sourcing and sinking load of 10 ma. v ro becomes active when v ri voltage rises to 435 mv and v cc is above the uvlo threshold. when v ro is less than 360 mv, it is disabled and subsequently discharges to gnd through an internal 10 k mosfet. v ro is independent of the en pin state. soft start the soft?start function of the v tt pin is achieved via a current clamp. the current clamp allows the output capacitors to be charged with low and constant current, providing a linear ramp?up of the output voltage. when v tt is outside of the power good window, the current clamp level is one?half of the full over?current limit (ocl) level. when v tt rises or falls within the p good window, the current clamp level switches to the full ocl level. the soft?start function is completely symmetrical; it works not only from gnd to the v ro voltage but also from pv cc to the v ro voltage. en ? enable control when en is driven high, the ncp51400 v tt regulator begins normal operation. when en is driven low, v tt is discharges to gnd through an internal 18 mosfet. v ref remains on when en is driven low. p good ? powergood the ncp51400 provides an open?drain p good output that goes high when the v tt output is within 20% of v ro . p good de?asserts within 10 s after the output exceeds the limits of the powergood window. during initial v tt startup, p good asserts high 2 ms after the v tt enters power good window. because p good is an open?drain output, a 100 k , pull?up resistor between p good and a stable active supply voltage rail is required. the ldo has a constant over?current limit (ocl). note that the ocl level reduces by one?half when the output voltage is not within the power good window. this reduction is non?latch protection. for v cc under?voltage lockout (uvlo) protection, the ncp51400 monitors v cc voltage. when the v cc voltage is lower than the uvlo threshold voltage, both the v tt and v ro regulators are powered off. this shutdown is also non?latch protection. thermal shutdown with hysteresis if the ncp51400 is to operate in elevated temperatures for long durations, care should be taken to ensure that the maximum operating junction temperature is not exceeded. to guarantee safe operation, the ncp51400 provides on?chip thermal shutdown protection. when the chip junction temperature exceeds 150 c, the part will shutdown. when the junction temperature falls back to 125 c, the device resumes normal operation. if the junction temperature exceeds the thermal shutdown threshold then the v tt and v ro regulators are both shut off, discharged by the internal discharge mosfets. the shutdown is a non?latch protection. tracking startup and shutdown the ncp51400 also supports tracking startup and shutdown when en is tied dir ectly to the system bus and not used to turn on or turn off the device. during tracking startup, v tt follows v ro once v ri voltage is greater than 435 mv. v ri follows the rise of v ddq memory supply rail via a voltage divider. the typical soft?start time for the v ddq memory supply rail is approximately 3 ms, however it may vary depending on the system configuration. the ss time of the v tt output no longer depends on the ocl setting, but it is a function of the ss time of the v ddq memory supply rail. p good is asserted 2 ms after v tt is within 20% of v ro . during tracking shutdown, v tt falls following v ro until v ro reaches 360 mv. once v ro falls below 360 mv , the internal discharge mosfets are turned on and quickly discharge both v ro and v tt to gnd. p good is de?asserted once v tt is beyond the 20% range of v ro .
ncp51400, ncv51400 www. onsemi.com 7 package dimensions ??? ??? ??? case 506cl issue o 10x seating plane l d e 0.10 c a a1 e d2 e2 b 1 5 10 6 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from the terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. 5. terminal b may have mold compound material along side edge. mold flashing may not exceed 30 microns onto bottom surface of terminal b. 6. for device opn containing w option, detail b alternate construction is not applicable. b a 0.10 c top view side view bottom view pin one reference 0.05 c 0.05 c (a3) c 10x 10x 0.10 c 0.05 c a b note 3 k dim min max millimeters a 0.80 1.00 a1 0.00 0.05 a3 0.20 ref b 0.20 0.30 d 3.00 bsc d2 2.40 2.60 e 3.00 bsc e2 1.40 1.60 e 0.50 bsc l 0.25 0.45 l1 0.00 0.03 detail a 2x 2x detail b l1 detail a l alternate terminal constructions l ?? *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 3.30 0.50 0.57 10x dimensions: millimeters 0.32 2.70 pitch 1.70 10x 1 package outline recommended note 4 k 0.25 ??? on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 ncp51400/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
|
