multilayer ceramic chip capacitors 1 of 3 creation date : november 20, 2017 (gmt) CGA5H4X7R2J222K115AE tdk item description cga5h4x7r2j222kt***s applications automotive grade feature mid mid voltage (100 to 630v) soft soft termination aec-q200 aec-q200 series cga5(3216) [eia 1206] status production size length(l) 3.20mm +0.40,-0.20mm width(w) 1.60mm +0.30,-0.20mm thickness(t) 1.15mm 0.15mm terminal width(b) 0.20mm min. terminal spacing(g) 1.00mm min. recommended land pattern (pa) 2.10mm to 2.50mm(flow soldering) 2.00mm to 2.40mm(re?ow soldering) recommended land pattern (pb) 1.10mm to 1.30mm(flow soldering) 1.00mm to 1.20mm(re?ow soldering) recommended land pattern (pc) 1.00mm to 1.30mm(flow soldering) 1.10mm to 1.60mm(re?ow soldering) electrical characteristics capacitance 2.2nf 10% rated voltage 630vdc temperature characteristic x7r(15%) dissipation factor (max.) 3% insulation resistance (min.) 10000m other soldering method wave (flow) re?ow aec-q200 yes packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : november 20, 2017 (gmt) CGA5H4X7R2J222K115AE characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance CGA5H4X7R2J222K115AE esr CGA5H4X7R2J222K115AE capacitance CGA5H4X7R2J222K115AE dc bias characteristic CGA5H4X7R2J222K115AE temperature characteristic CGA5H4X7R2J222K115AE(no bias) CGA5H4X7R2J222K115AE(dc bias = 315v) ripple temperature rising CGA5H4X7R2J222K115AE(100khz) CGA5H4X7R2J222K115AE(500khz) CGA5H4X7R2J222K115AE(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : november 20, 2017 (gmt) CGA5H4X7R2J222K115AE associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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