View BD92111F-E2_8626278.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1/ 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 31.jan.2016 rev.001 tsz22111 ? 14 ? 001 www.rohm.com pfc direct current resonance type white led driver for large lcd bd92111f general description bd92111f is a current resonance type led driver with frequency-controlled led current. it can connect to pfc directly and can use half-bridge structure reducing the number of external components. it incorporates some protection functions against fault conditions such as over-voltage protection and led open detection (is low detection). features ? 20v high rating process ? 1 channel push-pull control ? current and voltage feedback by driving frequency ? adjustable soft start ? adjustable timer latch ? under-voltage detection for ic s power l ine ? output over-voltage protection ? output error signal from fail terminal ? shift to save mode by stb terminal ? burst control by external pwm signal applications ? tv, computer display, lcd backlighting. key specifications ? operating power supply voltage range: 8 .0v to 18.0v ? minimum oscillator frequency: 6 5.8 khz (r rt = 2 2 k , r adj = 36 k ,v fb = 3.2v ) ? operating current: 2.3ma (ty p) ? operating temperature range: -40 c to +85c package w(typ) x d(typ) x h(max) sop18 11.20mm x 7.80mm x 2.01mm pin pitch 1.27mm figure. 1 sop18 typical application circuit figure. 2 typical application circuit(s) < primary side > gnd pvin < secondary side > gnd vcc vcc gnd pwmin pwm fail err on /off stb t1 pdim pdim r rt r adj c fbis c fbvs r fbvs r fbis c cp c sdon c ss r s datashee t
2 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f contents general description ................................ ................................ ................................ ................................ .................... 1 features ................................ ................................ ................................ ................................ ................................ ....... 1 applications ................................ ................................ ................................ ................................ ................................ 1 key specifications ................................ ................................ ................................ ................................ ...................... 1 package ................................ ................................ ................................ ................................ ................................ ....... 1 typical application circuit ................................ ................................ ................................ ................................ ......... 1 abso lute maximum ratings ................................ ................................ ................................ ................................ ....... 3 recommended operating conditions ................................ ................................ ................................ ...................... 3 external components recomm ended range ................................ ................................ ................................ .......... 3 pin configuration ................................ ................................ ................................ ................................ ........................ 3 physical dimension and marking diagram ................................ ................................ ................................ .............. 3 electrical characteristics ................................ ................................ ................................ ................................ ........... 4 pin description ................................ ................................ ................................ ................................ ............................ 6 i/o equivalent circuits ................................ ................................ ................................ ................................ ................ 7 block diagram ................................ ................................ ................................ ................................ ............................. 8 typical performance curves ................................ ................................ ................................ ................................ ..... 9 pin function description ................................ ................................ ................................ ................................ ......... 10 detection condition list of the prot ection functions ................................ ................................ .......................... 15 behavior list of the protect function ................................ ................................ ................................ .................... 15 application example ................................ ................................ ................................ ................................ ................ 16 timing chart ................................ ................................ ................................ ................................ .............................. 17 operational notes ................................ ................................ ................................ ................................ ..................... 20 ordering information ................................ ................................ ................................ ................................ ................ 22 marking diagrams ................................ ................................ ................................ ................................ ..................... 22 physical dimension, tape and reel information ................................ ................................ ................................ ... 23 revision history ................................ ................................ ................................ ................................ ....................... 24
3 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f absolute maximum ratings (ta = 25c) parameter symbol rating unit supply voltage v cc 20 v stb, n2, n1 terminal voltage v stb , v n2 , v n1 20 v rt,fb,is,vs,pwmcmp,cp, pwmin ,ss,fail, comp,sdon , compsd terminal voltage v rt , v fb , v is , v vs , v pwmcmp , v cp , v pwmin , v adim , v ss , v fail ,v comp ,v sdon , v co mpsd 5.5 v power dissipation pd 0.69 (note 1) w operating temperature range topr - 40 to +85 c junction temperature tjmax 150 c storage temperature range tstg - 55 to +150 c (note 1) derating in done 5.5 mw/ &irurshudwlqjderyh7d? c (mount on 1 - layer 70.0mm x 70.0mm x 1.6mm board) caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta= - 40 c to +85 c ) parameter symbol range unit power supply voltage v cc 8 .0 to 18.0 v pwmin input frequency range f pwmin 60 to 500 hz oscillation frequency f out 30 to 2 00 khz external components recommended range (ta= - 40 c to +85 c ) parameter symbol range unit rt connection resistance r rt 24 to 160 k set up resistance for operation freque ncy range r adj 51 (unit : mm) pkg : sop18 drawing no. : ex115 - 5001 (max 11.55 (include.burr)) bd 9 2111 f n 1 _ 1 8 p g n d _ 1 6 n 2 _ 1 7 3 _ g n d 4 _ r t 1 _ v c c 2 _ s t b 5 _ f b 6 _ i s 7 _ v s f a i l _ 1 3 8 _ p w m c m p c o m p s d _ 1 4 9 _ c p s s _ 1 2 p w m _ i n _ 1 0 sdon _ 11 comp _ 15
4 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f electrical characteristics (unless otherwise specified ta=25c , v cc =12v ) parameter symbol limit unit conditions min typ max ? whole device circuit current i cc1 2.3 5.0 ma f out =60 k h z , v pwmcomp =0v circuit current at stand - by i cc2 0 20 a v stb =0v ? stb block stb pin high voltage v sth 2.0 v cc v system on stb pin low voltage v stl - 0.3 +0.8 v system off ? vcc uvlo block vcc operation voltage v vccuvp 6.17 6.50 6.83 v vcc uvlo hysteresis S
5 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f electrical characteristics C S
6 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f pin descriptio n pin no. pin name in/out function rating [v] 1 vcc in power supply pin for ic ( b uilt - i n uvlo f unction ) - 0.3 to + 20 2 stb in power on/off c ontrol p in for ic p ower off when stb=l and p ower on when stb=h. - 0.3 to + 20 3 gnd in ground pin for internal signal in ic - 4 rt out drive f requency setting pin b asic f requency is set by the resistor bet ween rt and gnd and d rive f requency m odulation r ange is set by th e resistor bet ween rt and fb . - 0.3 to + 5.5 5 fb out error amplifier output pin for led current feedback and led voltage feedback - 0.3 to + 5.5 6 is in error amplifier input pin for led current feedback - 0.3 to + 5.5 7 vs in error amplifier input pin for l ed open voltage feedback - 0.3 to + 5.5 8 pwmcmp in pwm comparator input pin which controls pwm operation during brightness adjustment. n1 and n2 output stop when pwmcmp=l, and they output max duty when pwmcmp=h - 0.3 to + 5.5 9 cp out timer latch setting pi n in abnormal case , 1a ( t yp) will be charged to the capacitor connected to cp , and ic becomes latch status after output operatio n stops at cp>2v( t yp) - 0.3 to + 5.5 10 pwmin in pwm s ignal i nput p in for burst bright ness adjustment - 0.3 to + 5.5 11 sdon out enable compsd inputs over voltage detection when start up, 1 a (typ) will be charged to connected capacitor. when sdon>2.0v(typ), it will be possible to detect over voltage. - 0.3 to + 5.5 12 ss out soft s tart timer and compsd timer setting p in during sta rt - up, 2a ( t yp) will be charged to connected capacitor. at ss>2.0v(typ), compsd can start to detect. at ss> 2.5 v (typ), cp can accept charge operation . - 0.3 to + 5.5 13 fail out error indication signal output pin normal : l, error : open - 0.3 to + 5.5 14 compsd in quickly over voltage detection p in when detecting abnormality, output operation stops and ic becomes latch status after 2 clocks. - 0.3 to + 5.5 15 comp in detection pin for over voltage - 0.3 to + 5.5 16 p gnd in power ground for external mosfet drive - 17 n2 out output pin for external fet drive circuit (ch annel n2) - 0.3 to + 20 18 n1 out output pin for external fet drive circuit (ch annel n 1 ) - 0.3 to + 20
7 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f i/o equivalent circuit s stb rt fb is vs pwmcmp cp pwmin sdon ss fail compsd comp n2 n1 figure. 5 i/o equi valent circuit n 2 90 k v s 1 0 0 k n 1 90 k p w m c m p 2 0 f b 2 0 i s 1 0 k c p 3 5 0 p w m i n 1 0 0 k sdon 350 ? ref vcc gnd gnd gnd r t v c c g n d r e f r e f g n d s t b 1 6 0 k comp 100 k ? gnd gnd gnd ref c o m p s d 1 0 0 k ? g n d g n d g n d r e f fail 50 s s 3 5 0
8 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f block diagram figure. 6 block diagram osc rt is feedback block pwm logic ct vs fb protect block gnd cp fail block block stb ct pwmcomp pgnd uvlo block vcc comp compsd n 1 n 2 drv block vcc pwmin pwm block vcc stb system
9 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f typical performance curves figure 7 . operating current vs power supply voltage ta=25 c supply voltage : v cc [v] operating current : i cc [ma] figure 9 . max duty vs temperature v cc =12v r rt =100k v pwmcmp =open temperatur e : ta [c] max duty [%] figure 8 . output frequency vs temperature v cc =12v r rt =100k r adj = none temperatur e : ta [c] output frequency : f out [khz] v cc =12v figure. 10 cp time setting current vs temperature 40 42 44 46 48 50 -40 -20 0 20 40 60 80 100 temperature : temp [deg] max duty : [%] 0 1 2 3 4 5 8 10 12 14 16 18 supply voltage : v cc [v] operating current : i cc1 [ma] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 80 100 temprature : ta [c] cp charge current : icp [a] 50 52 54 56 58 60 62 64 66 68 70 -40 -20 0 20 40 60 80 100 temperature : temp. [
10 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f pin function de scription pin.1 vcc this is power s upply pin for the ic. normal operation ra nge ( t yp) is from 9 v to 18v. please place ceramic capacitor bigger than 0.1f as bypass capacitor between vcc and gnd . it is for noise elimination. pin.2 stb this pin is for setting of on/off. it is p os sible to use as reset when shutting down. please set the stb terminal voltage below vcc voltage . in addition , please set below 4v if the voltage is applied earlier than vcc. depending on input voltage to stb pin, the status of ic might be switched (on/off). please avoid using between the two stat us ( 0.8 v to 2.0v ) pin.3 gnd this is signal system gnd for ic inside. please make it independent from pgnd as much as possible ( we recommend this because it has less influence with switching noise which comes from short circuit of pgnd and gnd at connec tor close to gn d pin. pin.4 rt set up the charge/discharge current by frequency of ic inside. by changing the resistance value of resistor between rt pin and gnd, it is possible to set up basic drive frequency as following formula; basi c frequency means output n1, n2 frequency which is determined only with resistor between rt pin and gnd. there is a discrepancy between theoretical formula and actual device. for frequency setting, please thoroughly ve rify it with actual application. in addition, frequency may change upon resistor radj which is placed between rt and fb pins figure. 11 figure. 12 rt resistance vs output frequency figure. 13 r rt resistor connection method i c n1 n2 vin gnd gnd_pin pgnd osc r rt rt bd 92111 f fb c fbis is vs error amp c fbvs r fbis r fbvs 1 10 100 1,000 10 100 1000 drive output frequency [khz] r rt [k ?@ ] [ ]) [ 4 10 5371 . 2 ( ) 4 10 4948 . 2 ( ]) [ 5 10 32 . 3 ( 217 . 1 khz k r k r f rt rt out ? ? ? ? ? ? ? ? ? ? ? ? ?
11 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f pin.5 fb this is output pin for led current feedback (is pin) error amplifier and open led voltage feedback (vs pin) error amplifi er. the capacitance between fb and is (1500pf to 0.01f) also determines start up time of led current necessary during phase compensation and brightness adjustment. capacitance between fb and vs (1500p f to 0.01f) is for phase compensation of error amp lifi er . as shown by left graph, by changing resistor r adj between f b and rt, it is possible to determine the modulation width of frequency. modulation width of frequency determined by the resistor between f b and rt resistor (theoretical formula : example) when r adj =100k ? , a f out =84.46 khz . modulation width of frequency determined by the resistor between f b and rt resistor (theoretical formula : example) when r adj =100k ? , a f out =84.46 khz the basic drive frequency is determined by resistor r rt which is connected from rt pin to gnd. the basic frequency is the one a t v fb =1.5v, a nd operation frequency range will be fixed with frequency modulation width that is determined by r adj under this condition. figure. xx figure. 16 output frequency vs fb voltage figure. 15 modulation width of output frequency vs r adj resistance output frequency vs fb voltage fb voltage vin [v] output frequency fout [khz] figure. 14 r rt and r adj resistor connection method osc r rt rt bd 92111 f fb c fbis is vs error amp c fbvs r fbis r fbvs r adj
12 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f pin.6 is this is input pin of l ed current feedback (is pin) error amplifier. please set up as normal voltage 1.25v . when is pin voltage becomes less than 0.625v ( t yp), the output will be stopped and latched. w$ ( t yp) current flows from is pin to exte rnal resistor during off period of burst brightness adjustment. considering m in value of is source current during burst brightness adjustment, please set that total resistance from is pin to gnd is more than 32 n when r 2 is 100 n in above diagram, please set r 1 + r 2 > 32 k . pin.7 vs this is input pin of open led voltage feedback (vs pin) error amplifier. it has to be 1.25v during led is open. when led is on, it will be 0.5v to 1.0v . when vs pin becomes over 1.25v, protection circuit will start operation, and if it becomes more than cp timer set up time (timer latch), it w ill shut down. please set c 1 , c 2 , r 1 , r 2 , and r 3 value to input 1.25v to vs pin during led bar ? s connector disconnects . pin.8 pwmcmp pwmcomp pin voltag e is fixed by duty of drive output n1, n2 in comparison with a saw wave of ic inside. this pin has 100a sink/source current capability and when external capacitor is connected between pwmcmp and gnd, ic will operate pwm at brightness start up stage. when n1 and n2 only drive at maxduty, please set pwmcmp=open. figure. 17 is block diagram figure. 18 vs block diagram + _ e r r o r a m p 1 . 2 5 v r 2 r 1 r 3 v s f b 5 6 7 8 c o n n e c t o r + _ e r r o r a m p 1 . 2 5 v r 2 r 1 1 0 0 k i s f b 5 0 u a
13 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f pin.9 cp this pin set s up the time from the point of abnormal detection till shut down (timer latch). having 1a constant current charge s at external capacitor connected to cp pin, it will shut dow n when it becomes over 2.0v. during soft start, there is no charge to cp external capacitor even fulfilling cp pin charge condition (timer latch) . external capacitor is set around 0.01f to 2.2 f). pin.10 pwmin by inputting pwm pulse signal at pwmin pin, it is possible to adjust burst brightness. (high level: over 2.0 v, low level: below 0.8 v). condition led condition pwmin : 2.0 v to 5.0v t urn on pwmin : - 0.3v to 0.8v t urn off pin.11 sdon th is is for the set up of time till compsd starts operation when start up. after stb starts to become on, there will be 1 a constant current charging at external capacitor that is connected to sdon pin. then if it becomes over 2.0v, it is possible to detect compsd. when it is below 2.0v, immediately latch protection current will no operate. external capacitor is around 0.01 f to 2.2 f. figure. 19 cp block diagram figure. 20 timer latch t i me vs cp capacitance figure. 21 is sdon block d iagram [sec] 10 0 . 2 10 0 . 1 0 . 2 6 6 cp cp cp cp cp cp c c i v c t ? ? ? ? ? ? ? ? ? 1 u a t i m e r l a t c h s h u t - d o w n t i m e r s t a r t 2 . 0 v c c p 1 ua compsd power on 2 . 0 v enable to detect c sdon [sec] 10 0 . 2 10 0 . 1 0 . 2 6 6 sdon sdon sdon sdon sdon sdon c c i v c t ? ? ? ? ? ? ? ? ? 0.001 0.01 0.1 1 10 100 0.001 0.01 0.1 1 10 timer latch time : t cp [sec] cp capacitance c cp >w)@ timer latch time t cp
14 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f pin.12 ss this is soft start time and sdon time set up pin. co nstant current 2.0a( t yp) is charged to external capacitor (0.01f to 0.1f). when soft start is under operation (ss pin voltage is less than 3.0 v), timer latch protection circuit by cp charge will not operate. where: c s s is the capacitance of ss pin pin.13 fail this is fail signal output pin of ic. at normal situation , it outputs gnd level and it becomes open after timer latch in case any abnormality is detected. the pull up voltage du ring open must be set less than rated voltage 5.5v of fail pin. please connect about 0.1uf capacitor for noise reduction to fail pin. pin.1 4 comp sd this is input pin f or shut down detection comparator. when sdon pin voltage is over 2.0v(typ) and compsd is 4.0v(typ), it will latch after the next clock. pin.1 5 comp this is input pin for over voltage protection comparator. the detection voltage of comparator is 4.0v(typ) and will start charging to cp pin after over voltage detection. after cp is charged, it will shut down by timer latch. pin.16 pgnd this is power gnd pin for out put pin n1, n2 at driver part. please make it independent from g nd (pin 3 ) pin on inverter pcb. this pin is not connected to gnd pin in ic in side. pin.17 n2 this is gate drive output pin for low side external nch fet. normally please connect it to fet gate through about uhvlvwru it is for noise reduction. gate has to be pull - down to source by resistor of n to n . pin.18 n1 this is gate drive output pin for low side external nch fet. normally please connect it to fet gate through about uhvlvwru it is for noise reduction. gate has to be pull - down to source by resistor of n to n . condition fail output n ormal operation gnd level abnormal operation open figure. 22 ss block diagram figure. 23 fail block diagram 2 ua finish soft start power on css ss 3 . 0 v [sec] 10 5 . 1 10 0 . 2 0 . 3 6 6 ss ss ss ssend ss ssend c c i v c t ? ? ? ? ? ? ? ? ? fail
15 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f d etection condition list of the protection functions (typ condition) protect function detection pin detect condition release condition timer operation protection type detection condition ss ,sdon led open is is < 0.625 v s don>2.0 v is > 0. 625 v 2clk lat ch off ovp vs vs > 1.25v ss> 3.0 v vs < 1.25v cp latch off comp comp comp > 4.0v ss> 3 .0v comp < 3.8v cp latch off vcc uvlo vcc vcc < 6.0 v - vcc > 6.5 v - restart by release compsd compsd compsd > 4.0v s don >2.0v compsd < 3.8v 2clk latch off to reset the l atch type protection , sohdvhvhw67%orjlfwr/?rqfh2wkhuzlvhwkhghwhfwlrqri9&&89/2 is required. the count number in the list is calculated with double of output frequency. behavior list of the protect function protect function operation of the pro tect function n1,n2 output ss pin fail pin led open stop after latch low after latch high after latch ovp stop after latch low after latch high after latch comp stop after latch low after latch high after latch vcc uvlo stop immediately low immediate ly high immediately compsd stop after latch low after latch high after latch
16 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f application example introduce an application example with bd92111 f figure. 24 application example r rt r adj c fbis c fbvs r fbvs r fbis c cp c sdon c ss r s
17 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f timing chart when it d etects quick detec tion type e rror [t h e explanation of quick abnormal detection ] due to the timing of stb comp comsd cp fail ( a ) 2 . 0 v 4 . 0 v 1 . 25 v 0 . 625 v 1 . 25 v 1 2 . 0 v 3 . 0 v 0 . 7 v 0 . 625 v ss fb is vs 4 . 0 v 4 . 0 v 1 . 25 v 2 2 . 0 v sdon 2 . 0 v
18 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f when it detects timer latch type error [the explanation of time latch type error detection] due to the timing of and and abnormal led voltage detection vs 8 1.25v over voltage detection (multipurpose protection function) comp 8 4.0 v (release at comp<3.8v) figure. 2 6 timing chart 2 stb comp comsd cp fail ( a ) 2 . 0 v 1 . 80 v 4 . 0 v 1 . 25 v 0 . 625 v 3 . 2 v 1 . 25 v 3
19 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f output timing chart bd92111 f outputs the signal that operates the push - pull or half - bridge which is made up of nch fet . the output timing of drive signal is shown in the following chart figure. 27 output timing chart c t _ s y n c _ o u t ( c a n
20 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can d amage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by lar ge currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power di ssipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. reco mmended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, giv e special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to ma lfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may vxemhfwwkh,&wrvwuhvv$ozd\vglvfkdujhfdsdflwruvfrpsohwho\diwhuhdfksurfhvvruvwhs7kh,&?vs ower supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and s torage.
21 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f operational notes C n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
22 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f ordering informatio n b d 9 2 1 1 1 f - e 2 part number package f:sop18 packaging and forming specification e2: embossed tape and reel marking diagram s sop18(top view) b d 9 2 1 1 1 f part number marking lot number 1pin mark
23 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f physical dimension , tape and reel information package name sop18 (unit : mm) pkg : sop18 drawing no. : ex115 - 5001 (max 11.55 (include.burr))
24 / 24 tsz02201 - 0f5f0c100090 - 1 - 2 ? 20 16 ro hm co., ltd. all rights reserved. 31.jan.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b d92111 f revision history revision no. date page changes 001 31 .jan.2016 all new release
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd92111f package sop18 unit quantity 2000 minimum package quantity 2000 packing type taping constitution materials list inquiry rohs yes bd92111f - web page distribution inventory

▲Up To Search▲

Price & Availability of BD92111F-E2

	To Download BD92111F-E2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .