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ams datasheet, confidential page 1 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa digital als and proximity module the tmd2772/tmd2772wa family of devices provides digital ambient light sensing (als), a complete proximity detection system, and digital interface logic in a single 8-pin surface mount module. the devices are register-set and pin-compatible with the tmd2771 family of devices and include new and improved als and proximity detection features and are available with 25 and 50 fields of view. the als enhancements include a reduced-gain mode that extends the operating range in sunlight. proximity dete ction includes improved signal-to-noise performance and more accurate factory calibration. a proximity offset register allows compensation for optical system crosstalk between the ir led and the sensor. to prevent false proximity data measurement readings, a proximity saturation indicator bit signals that the internal analog circuitry has reached saturation. the tmd2772/tmd2772wa als is based on the ams patented dual-diode technology that enables accurate results and approximates human eye response to light intensity under a variety of lighting conditions. the proximity detection system includes an led driver and an ir led, which are factory trimmed to eliminate the need for end-equipment calibration due to component variations. ordering information and content guide appear at end of datasheet. key benefits & features the benefits and features of tmd2772/tmd2772wa, digital als and proximity module are listed below: figure 1: added value of using tmd2772/tmd2772wa benefits features minimizes board space requirements ambient light sensing, proximity detection, and ir led in a single module approximates human eye response over a wide variety of lighting conditions. achieves accurate sensing behind spectrally dark glass. ambient light sensing (als) ? wide variety of programmable features which enable 8,000,000:1 dynamic range with very high sensitivity general description
page 2 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? general description note(s) and/or footnote(s): 1. new or improved feature. applications the tmd2772 applic ations include: ?display backlight control ? cell phone touch screen disable ? mechanical switch replacement ? industrial process control ? medical diagnostics ? printer paper alignment ? eliminates need for customer end-product calibration. ? reduces the proximity noise ? control of system crosstalk and offset ? prevents false proximity detection in bright light ? selectable ir power-level without external resistor ? enables wide operating range proximity detection ? calibrated and trimmed to provide consistent reading ? reduced proximity count variation (1) ? programmable offset (1) ?saturation indicator bit (1) ? programmable driver for ir led ? 16,000:1 dynamic range reduces external processor burden ma skable als and proximity interrupt ? programmable upper and lower thresholds with persistence filter enables dynamic power dissipation control power management ? programmable average power consumption ? programmable wait time from 2.7 ms to > 8 seconds industry standard two-wire interfac e i2c fast mode compatible interface ? data rates up to 400 kbit/s ? input voltage levels compatible with v dd or 1.8v bus small foot-print module 3.94 mm x 2.36 mm x 1.35 mm package optimize ambient light sensing angle available with standard 25 (tmd2772) and wide 50 (tmd2772wa) benefits features
ams datasheet, confidential page 3 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? general description block diagram the functional blocks of this device for reference are shown below: figure 2: tmd2772/tmd2772wa block diagram this datasheet documents the following six devices. figure 3: available configurations note(s) and/or footnote(s): 1. contact ams for availability. device id (0x12) i 2 c address i 2 c voltage angular response tmd27721 0x30 0x39 = vdd 25 tmd27723 0x39 0x39 = 1.8 v 25 tmd27725 (1) 0x30 0x29 = vdd 25 tmd27727 (1) 0x39 0x29 = 1.8 v 25 TMD27721WA (1) 0x30 0x39 = vdd 50 tmd27723wa 0x39 0x39 = 1.8 v 50 control programmable current sink i2c interface ch0 ch0 adc ch1 adc int scl sda leda ledk ldr v dd ch1 ir led tmd2772/tmd2772wa
page 4 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? pin assignment this is a package module - 8 pin diagram. package drawing is not to scale. figure 4: pin diagram (top view) figure 5: pin description pin number pin name pin type description 1 v dd power supply voltage. 2scl input i2c serial clock input terminal clock signal for i2c serial data. 3 gndpower power supply ground. all voltages are referenced to gnd. 4 leda led anode. 5ledk led cathode. connect to ldr pin when using internal led driver circuit. 6ldr led driver input for proximity ir led, constant current source led driver. 7 int output interrupt open drain (active low). 8 sda input / output i2c serial data i/o terminal serial data i/o for i2c. pin assignment tmd2772 tmd2772wa 8 sda 7 int 6 ldr 5 ledk vdd 1 scl 2 gnd 3 leda 4 vdd 1 scl 2 gnd 3 leda 4 8 sda 7 int 6 ldr 5 ledk
ams datasheet, confidential page 5 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? absolute maximum ratings stresses beyond those listed under absolute maximum rating may cause permanent damage to the device. these are stress ratings only. functional operation of the device at these or any other conditions beyond those indicated under operating conditions is not implied. ex posure to absolute maximum rating conditions for extended periods may affect device reliability. figure 6: absolute maximum ratings note(s) and/or footnote(s): 1. all voltages are with respect to gnd. 2. maximum voltage with ldr = off. 3. maximum 4.8v dc over 7 years lifetime. maximum 5.0v spikes wi th up to 250s cumulative duration over 7 years lifetime. maximu m 5.5v spikes with up to 10s (=1000* 10ms) cumulative duration over 7 years lifetime. symbol parameter min max unit v dd (1) supply voltage 3.8 v v ldr (2) voltage on ldr signal with ldr = off. ?t a between 0-70 c ?t a outside of 0-70 c 4.8 4.4 v v leda (3) led supply voltage on leda input ?t a between 0-70 c ?t a outside of 0-70 c 4.8 4.4 v digital i/o voltage except ldr -0.5 3.8 output terminal current except ldr -1 20 ma t stg storage temperature range -40 85 c esd tolerance, human body model 2000 v absolute maximum ratings
page 6 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? electrical characteristics all limits are guaranteed. the parameters with min and max values are guaranteed with production tests or sqc (statistical quality control) methods. figure 7: recommended operating conditions note(s) and/or footnote(s): 1. while the device is operational across the temperature range, functionality will vary with temperature. specifications are s tated only at 25c unless otherwise noted. figure 8: operating characteristics v dd = 3v, t a = 25c (unless otherwise noted) symbol parameter min typ max unit v dd supply voltage 2.2 3 3.6 v supply voltage accuracy, v dd total error including transients -3 3 % t a operating free-air temperature (1) -30 85 c v leda led supply voltage on leda input ?t a between 0-70 c ?t a outside of 0-70 c 2.5 2.5 4.8 4.4 v symbol parameter conditions min typ max units i dd supply current active ldr pulse off 195 250 a wait state 90 sleep state no i2c activity 2.2 4 v ol int, sda output low voltage 3 ma sink current 0 0.4 v 6 ma sink current 0 0.6 i leak leakage current, sda, scl, int pins -5 5 a leakage current, ldr pin -5 5 a v ih scl, sda input high voltage tmd27721, tmd27725, TMD27721WA 0.7 v dd v tmd27723, tmd27727, tmd27723wa 1.25 v il scl, sda input low voltage tmd27721, tmd27725, TMD27721WA 0.3 v dd v tmd27723, tmd27727, tmd27723wa 0.54 electrical characteristics
ams datasheet, confidential page 7 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? electrical characteristics figure 9: adc characteristics, v dd = 3v, t a = 25c, again = 16x, aen = 1 (unless otherwise noted) parameter test conditions channel min typ max unit dark adc count value e e = 0, again = 120, atime = 0xdb (100ms) ch0 0 1 5 counts ch1 0 1 5 adc integration time step size atime = 0xff 2.58 2.73 2.9 ms adc number of integration steps 1 256 steps adc counts per step atime = 0xff 0 1023 counts adc count value atime = 0xc0 0 65535 counts
page 8 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? electrical characteristics figure 10: als characteristics, v dd = 3v, t a = 25c, again = 16x, aen = 1 (unless otherwise noted) note(s) and/or footnote(s): 1. optical measurements are made using small-angle incident radi ation from light-emitting diode optical sources. red 625 nm and infrared 850 nm leds are used for final product te sting for compatibility with high-volume production. 2. the 625 nm irradiance e e is supplied by an alingap light-emitting diode with the following typical characte ristics: peak wavelength p = 625 nm and spectral halfwidth ? = 20 nm. 3. the 850 nm irradiance e e is supplied by a gaas light-emitting diode with th e following typical characteristics: peak wavelength p = 850 nm and spectral halfwidth ? = 42 nm. 4. unless otherwise specified, measuremen ts are taken with atime= 0xf6 (27 ms). parameter test conditions (1), (2), (3), (4) channel min typ max unit adc count value tmd2772 (25) p = 625 nm, e e = 46.8 w/cm 2 ch0 4000 5000 6000 counts ch1 950 p = 850 nm, e e = 61.7 w/cm 2 ch0 4000 5000 6000 counts ch1 2900 adc count value tmd2772wa (50) p = 625 nm, e e = 129.5 w/cm 2 ch0 4000 5000 6000 counts ch1 950 p = 850 nm, e e = 181.2 w/cm 2 ch0 4000 5000 6000 counts ch1 2900 adc count value ratio: ch1/ch0 p = 625 nm 0.152 0.19 0.228 p = 850 nm 0.43 0.58 0.73 re irradiance responsivity tmd2772 (25) p = 625 nm ch0 107.2 counts /(w/ cm 2 ) ch1 20.4 p = 850 nm ch0 81.5 ch1 47.3 re irradiance responsivity tmd2772wa (50) p = 625 nm ch0 38.6 counts /(w/ cm 2 ) ch1 7.3 p = 850 nm ch0 27.6 ch1 16.0 gain scaling, relative to 1 gain setting again = 1 and agl = 1 0.16 x again = 8 and agl = 0 7.2 8.0 8.8 again = 16 and agl = 0 14.4 16.0 17.6 again = 120 and agl = 0 108 120 132
ams datasheet, confidential page 9 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? electrical characteristics figure 11: proximity characteristics, v dd = leda = 3v, t a = 25c, p en = 1 (unless otherwise noted) note(s) and/or footnote(s): 1. value is factory-adjusted to meet the prox count specificat ion. considerable variation (relative to the typical value) is po ssible after adjustment. 2. these parameters are ensured by design and characterization and are not 100% tested. 3. proximity offset varies with power supply characteristics and noise. 4. ileda is factory calibrated to achieve th is specification. offset and crosstalk dire ctly sum with this value and is system d ependent. 5. no glass or aperture above the module. tested value is the average of 5 consecutive readings. 6. proximity test was done using the circuit shown in figure 12 . see section , pcb pad layout, on page 46 for recommended application circuit. parameter test conditions min typ max units i dd supply current led on 3 ma i leda leda current (1) led on, pdrive = 0 100 ma led on, pdrive = 1 50 led on, pdrive = 2 25 led on, pdrive = 3 12.5 ptime adc conversion steps 1 256 steps ptime adc conversion time ptime = 0xff (= 1 conversion step) 2.58 2.73 2.9 ms ptime adc counts per step ptime = 0xff (= 1 conversion step) 0 1023 counts ppulse led pulses (2) 0 255 pulses led on led pulse width ppulse = 1, pdrive = 0 7.3 s led pulse period ppulse = 2, pdrive = 0 16.0 s proximity response, no target (offset) ppulse = 8, pdrive = 0, pgain = 4, (3) 100 counts prox count, 100mm target, tmd2772 devices (4) 73 mm 83 mm, 90% reflective kodak gray card, pgain = 4, ppulse = 8, pdrive = 0, ptime = 0xff (5) 450 520 590 counts prox count, 100mm target, tmd2772wa devices (4) 73 mm 83 mm, 90% reflective kodak gray card, pgain = 4, ppulse = 8, pdrive = 0, ptime = 0xff (5) 235 275 315 counts
page 10 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? electrical characteristics figure 12: proximity test circuit figure 13: ir led characteristics, v dd = 3v, t a = 25c figure 14: wait characteristics, v dd = 3v, t a = 25c, wen = 1 (unless otherwise noted) parameter test conditions min typ max unit v f forward voltage i f = 100 ma 1.5 2.2 v v r reverse voltage i r = 10 a 5v p o radiant power i f = 20 ma 4.5 mw p peak wavelength i f = 20 ma 850 nm spectral radiation bandwidth i f = 20 ma 40 nm parameter conditions min typ max units wait steps 1 256 steps wait time wtime = 0xff (= 1 wait step) 2.73 2.9 ms
ams datasheet, confidential page 11 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? timing characteristics figure 15: ac electrical characteristics, v dd = 3v, t a = 25c (unless otherwise noted) note(s) and/or footnote(s): 1. specified by design and characterization; not production tested. timing diagrams figure 16: parameter measurement information parameter (1) conditions min max unit f scl clock frequency (i2c only) 0 400 khz t buf bus free time between start and stop condition 1.3 s t hd;sta hold time after (repeated) start condition. after this period, the first clock is generated. 0.6 s t su;sta repeated start condition setup time 0.6 s t su;sto stop condition setup time 0.6 s t hd;dat data hold time 10 ns t su;dat data setup time 100 ns t low scl clock low period 1.3 s t high scl clock high period 0.6 s t f clock/data fall time 300 ns t r clock/data rise time 300 ns c i input pin capacitance 10 pf timing characteristics start start stop stop t buf t low t hd; sta t r t f v ih v il v ih v il t su; dat t su; sta t hd; dat t high t su; sto scl sda
page 12 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? typical operating characteristics figure 17: spectral responsivity figure 18: normalized i dd vs. v dd and temperature typical operating characteristics
ams datasheet, confidential page 13 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? typical operating characteristics figure 19: normalized responsivity vs. angular displacement for non-wa and wa devices both axes for tmd2772wa both axes for tmd2772
page 14 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? typical operating characteristics figure 20: proximity response of tmd2772 and tmd2772wa modules figure 21: typical ldr current vs. voltage 0 200 400 600 800 1000 1200 0 255075100125150175 proximity response of tmd2772 and tmd2772wa conditions; ppulse =8, pdrive = 0, pgain = 4x tmd2772 tmd2772wa proximity count distance in milimeters (response to 73mm x 83mm, 90% reflective kodak gray card)
ams datasheet, confidential page 15 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? detailed description the light-to-digital device provides on-chip photodiodes, integrating amplifiers, adcs, accumulators, clocks, buffers, comparators, a state machine, and an i2c interface. each device combines one photodiode (ch0), which is responsive to both visible and infrared light, and a second photodiode (ch1), which is responsive primarily to infrared light. two integrating adcs simultaneously convert the amplified photodiode currents to a digital value provid ing up to 16-bits of resolution. upon completion of the conversion cycle, the conversion result is transferred to the ch0 and ch1 data registers. this digital output can be read by a microprocessor where the luminance (ambient light level in lux) is derived using an empirical formula to approximate the human eye response. figure 22: detailed block diagram of tmd2772/tmd2772wa a fully integrated proximity detect ion solution is provided with an 850-nm ir led, led driver circuit, and proximity detection engine. an internal led driver pin (ldr) is externally connected to the led cathode (ledk) to provide a controlled led sink current. this is accomplished with a proprietary current calibration technique that accounts for all variances in silicon, optics, package, and most important, ir led output power. this eliminates or greatly reduces the need for factory calibration that is required for most discrete proximity sensor solutions. the device is factory calibrated to achieve a proximity count detailed description wait control interrupt i2c interface lower limit upper limit lower limit upper limit int scl sda leda ledk tmd2772 channel 0 channel 1 ldr v dd ch0 adc ch1 adc ch0 data ch1 data alc control prox data prox adc prox integration prox control ir led constant current sink gnd
page 16 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? detailed description reading at a specified distance wi th a specific number of pulses. in use, the number of proximity led pulses can be programmed from 1 to 255 pulses, which allows different proximity distances to be achieved. each pulse has a 16 s period with a 7.2 s on time. communication with the device is accomplished through a fast (up to 400 khz), two-wire i2c serial bus for easy connection to a microcontroller or embedded controller. the digital output of the device is inherently more immune to noise when compared to an analog photodiode interface. the device provides a separate pin for level-style interrupts. when interrupts are enabled and a pre-set value is exceeded, the interrupt pin is asserted an d remains asserted until cleared by the controlling firmware. the interrupt feature simplifies and improves system efficiency by eliminating the need to poll a sensor for a light intensity or proximity value. an interrupt is generated when the value of an als or proximity conversion exceeds either an upper or lower threshold. in addition, a programmable interrupt persistence feature allows the user to determine how many consecutive exceeded thresholds are necessary to trigger an interrupt. interrupt thresholds and persistence settings are configur ed independently for both als and proximity.
ams datasheet, confidential page 17 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? principles of operation system state machine an internal state machine provides system control of the als, proximity detection, and power management features of the device. at power up, an internal power-on-reset initializes the device and puts it in a low-power sleep state. when a start condition is detected on the i2c bus, the device transitions to the idle state where it checks the enable register (0x00) pon bit. if pon is disabled, the device will return to the sleep state to save power. otherwise, the devic e will remain in the idle state until a proximity or als function is enabled. once enabled, the device will execute the prox, wait, and als states in sequence as indicated in figure 23 . upon completion and return to idle, the device will automatically begin a new prox?wait?als cycle as long as pon and either pen or aen remain enabled. if the prox or als function ge nerates an interrupt and the sleep-after-interrupt (sai) feature is enabled, the device will transition to the sleep state and remain in a low-power mode until an i2c command is received. see section , interrupts, on page 22 for additional information. figure 23: simplified state diagram principles of operation
page 18 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? principles of operation photodiodes conventional als detectors respond strongly to infrared light, which the human eye does not see. this can lead to significant error when the infrared content of the ambient light is high (such as with incandescent lighting). this problem is overcome through the use of two photodiodes. the channel 0 photodiode, referred to as the ch0 channel, is sensitive to both visible and infrared light, while the channel 1 photodiode, referred to as ch1, is sensitive primarily to infrared light. two integrating adcs conv ert the photodiode currents to digital outputs. the adc digital outputs from the two channels are used in a formula to obtain a value that approximates the human eye response in units of lux. als operation the als engine contains als gain control (again) and two integrating analog-to-digital converters (adc), one for the ch0 and one for the ch1 photodiode s. the als integration time (atime) impacts both the resolution and the sensitivity of the als reading. integration of both channels occurs simultaneously and upon completion of the conversion cycle, the results are transferred to the data registers (c0data and c1data). this data is also referred to as channel count. the transfers are double-buffered to ensure data integrity. figure 24: als operation
ams datasheet, confidential page 19 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? principles of operation the registers for programming the integration and wait times are a 2s compliment values. the actual time can be calculated as follows: atime = 256 ? integration time / 2.73 ms inversely, the time can be calculated from the register value as follows: integration time = 2.73 ms (256 ? atime) in order to reject 50/60 hz ripple strongly present in fluorescent lighting, the integration time needs to be programmed in multiples of 10 / 8.3 ms or the half cycle time. both frequencies can be rejected with a programmed value of 50 ms (atime = 0xed) or multiples of 50 ms (i.e. 100, 150, 200, 400, 600). the registers for programming the again hold a two-bit value representing a gain of 1, 8, 16, or 120. the gain, in terms of amount of gain, will be represented by the value againx, i.e. againx = 1, 8, 16, or 120. with the agl bit set, the gains will be lowered to 1/6, 8/6, 16/6, and 20, allowing for up to 60k lux. lux equation the lux calculation is a function of ch0 channel count (c0data), ch1 channel count (c1data), als gain (againx), and als integration time in milliseconds (atime_ms). if an aperture, glass/plastic, or a light pipe attenuates the light equally across the spectrum (300 nm to 1100 nm), then a scaling factor referred to as glass attenuation (ga) can be used to compensate for attenuation. for a device in open air with no aperture or glass/plastic above the device, ga = 1. if it is not spectrally flat, then a custom lux equation with new coefficients should be generated. (see ams application note). counts per lux (cpl) needs to be calculated only when atime or again is changed, otherwise it remains a constant. the first segment of the equation (lux1) covers fluorescent and incandescent light. the second segment (lux2) covers dimmed incandescent light. the final lux is the maximum of lux1, lux2, or 0. lux formula for tmd2772 : cpl = (atime_ms againx) / 20 lux1 = (c0data C (1.75 c1data)) / cpl lux2 = ((0.63 c0data) C (1.00 c1data)) / cpl lux = max(lux1, lux2, 0) lux formula for tmd2772wa : cpl = (atime_ms againx) / 1.16 lux1 = (c0data - (1.8422 x c1data)) / cpl lux2 = ((0.4106 x c0data) - (0.667 x c1data)) / cpl lux = max(lux1, lux2, 0)
page 20 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? principles of operation proximity detection proximity detection is accomplished by measuring the amount of i r energy, from the internal ir led, reflected off an object to determine its distance. the intern al proximity ir led is driven by the integrated proximity led current driver as shown in figure 25 .the proximity detector will see light reflected from the intended target as well as light reflected through any path. both surfaces of a transparent cover will reflect some of the ir leds energy. an air gap of less the 0.5mm between the top of the module and the cover is recommended. for a detailed explanation of the of the effects of an air gap see ams application note; application note dn58: proximity detection behind glass for a detailed discussi on of optical design considerations. figure 25: proximity detection the led current driver, output on the ldr terminal, provides a regulated current sink that eliminates the need for an external current limiting resistor. the combination of proximity led drive strength (pdrive) and proximity drive level (pdl) determine the drive current. pdri ve sets the drive current to 100%, 50%, 25%, or 12.5% when pdl is not asserted. however, when pdl is asserted, the drive current is reduced by a factor of 9. referring to the detailed state machine figure, the led current driver pulses the ir led as shown in figure 26 during the prox accum state. figure 26 also illustrates that the led on pulse has a fixed width of 7.3s and period of 16.0s. so, in addition to setting the proximity drive curren t, 1 to 255 proximity pulses (ppulse) can be programmed. when deciding on the number
ams datasheet, confidential page 21 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? principles of operation of proximity pulses, keep in mi nd that the signal increases proportionally to ppulse, while noise increases by the square root of ppulse. figure 26: proximity led current driver waveform figure 25 illustrates light rays emitting from the internal ir led, reflecting off an object, and being absorbed by the ch0 and ch1 photodiodes. the proximit y diode selector (pdiode) determines which of the two photodiodes is used for a given proximity measurement. note that neither photodiode is selected when the device first powers up, so pdiode must be set for proximity detection to work. referring again to figure 26 , the reflected ir led and the background energy is integrated during the led on time, then during the led off time, the integrated background energy is subtracted from the led on time energy, leaving the ir led energy to accumulate from pulse to pulse. the proximity gain (pgain) determines the integration rate, which can be programmed to 1, 2, 4, or 8 gain. at power up, pgain defaults to 1 gain, which is recommended for most applications. for reference, pgain equal to 4 is comparable to the tmd2771s 1 gain setting. du ring led on time integration, the proximity saturation bit in the status register (0x13) will be set if the integrator saturates. this condition can occur if the proximity gain is set too high fo r the lighting conditions, such as in the presence of bright sunlight. once asserted, psat will remain set until a special func tion proximity interrupt clear command is received from the host. see command register on page 30. after the programmed number of proximity pulses have been generated, the proximity adc converts and scales the proximity measurement to a 16-bit value, then stores the result in two 8-bit proximity data (pdatax) registers. adc scaling is
page 22 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? principles of operation controlled by the proximity adc conversion time (ptime) which is programmable from 1 to 256 2.73ms time units. however, depending on the application, sc aling the proximity data will equally scale any accumulated noise. therefore, in general, it is recommended to leave ptime at the default value of one 2.73ms adc conversion time (0xff). in many practical proximity appl ications, a number of optical system and environmental conditions can produce an offset in the proximity measurement result. to counter these effects, a proximity offset (poffset) is provided which allows the proximity data to be shifted positive or negative. additional information on the use of the proximity offset feature is provided in available ams application notes. once the first proximity cycle has completed, the proximity valid (pvalid) bit in the status register will be set and remain set until the proximity detection function is disabled (pen). for additional information on using the proximity detection function behind glass and for optical system design guidance, please see available ams application notes. interrupts the interrupt feature simplifies and improves system efficiency by eliminating the need to poll the sensor for light intensity or proximity values outside of a user-defined range. while the interrupt function is always enab led and its status is available in the status register (0x13), th e output of the interrupt state can be enabled using the proxim ity interrupt enable (pien) or als interrupt enable (aien) fields in the enable register (0x00). four 16-bit interrupt threshold registers allow the user to set limits below and above a desired light level and proximity range. an interrupt can be generated when the als ch0 data (c0data) falls outside of the desired light level range, as determined by the values in the als interrupt low threshold registers (ailtx) and als interru pt high threshold registers (aihtx). likewise, an out-of-ran ge proximity interrupt can be generated when the proximity data (pdata) falls below the proximity interrupt low threshold (piltx) or exceeds the proximity interrupt high threshold (pihtx). it is important to note that the thresholds are evaluated in sequence, first the low threshold, then the high threshold. as a result, if the low threshold is set above the high threshold, the high threshold is ignored and only the low threshold is evaluated. to further control when an interrupt occurs, the device provides a persistence filter. the persiste nce filter allows the user to specify the number of consec utive out-of-range als or proximity occurrences before an interrupt is generated. the interrupt register (0x0c) allows the user to set the als persistence filter (apers) and th e proximity persistence filter (ppers) values. see the interrupt register (0x0c) on page 35 for details on the persistence filter values. once the persistence
ams datasheet, confidential page 23 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? principles of operation filter generates an interrupt, it will continue until a special function interrupt clear command is received. see command register on page 30. figure 27: programmable interrupt system state machine timing the system state machine shown in figure 28 provides an overview of the states and state transitions that provide system control of the device. this section highlights the programmable features, which affect the state machine cycle time, and provides details to determine system level timing. when the proximity detection feature is enabled (pen), the state machine transitions through the prox init, prox accum, prox wait, and prox adc states. the prox init and prox wait times are a fixed 2.73 ms, whereas the prox accum time is determined by the number of proximity led pulses (ppulse) and the prox adc time is determined by the integration time (ptime). the formulas to determine the prox accum and prox adc times are given in the associated boxes in figure 28 . if an interrupt is generated as a result of the proximity cycle, it will be asserted at the end of the prox adc state and transition to the sleep state if sai is enabled. when the power management feature is enabled (wen), the state machine will transition in turn to the wait state. the wait time is determined by wlong, which extends normal operation by 12 when asserted, and wtime. the formula to determine
page 24 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? principles of operation the wait time is given in the bo x associated with the wait state in figure 28 . when the als feature is enabled (aen), the state machine will transition through the als init and als adc states. the als init state takes 2.73 ms, while the als adc time is dependent on the integration time (atime). th e formula to determine als adc time is given in the associated box in figure 28 . if an interrupt is generated as a result of the als cycle, it will be asserted at the end of the als adc state and transition to the sleep state if sai is enabled. figure 28: detailed state machine
ams datasheet, confidential page 25 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? principles of operation power management power consumption can be managed with the wait state, because the wait state typically consumes only 90a of i dd current. an example of the power management feature is given below. with the assumptions provided in the example, average i dd is estimated to be 176a. figure 29: power management note(s) and/or footnote(s): 1. prox accum ? led on time = 7.3 s per pulse 4 pulses = 29.3s = 0.029 ms 2. prox accum ? led off time = 8.7 s per pulse 4 pulses = 34.7s = 0.035 ms system state machine state programmable parameter programmed value duration typical current prox init 2.73 ms 0.195 ma prox accum ppulse 0x04 0.064 ms prox accum ? led on 0.029 ms (1) 103 ma prox accum ? led off 0.035 ms (2) 0.195 ma prox wait 2.73 ms 0.195 ma prox adc ptime 0xff 2.73 ms 0.195 ma wait wtime 0xee 49 2 ms 0 090 ma wlong als init 2.73 ms 0.195 ma als adc atime 0xee 49 2 ms 0.195 ma
page 26 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? principles of operation average i dd current = ((0.029 103) + (0.035 x 0.195) + (2.73 0.195) + (49.2 0.090) + (49.2 0.195) + (2.73 0.195 3)) / 109 176 a. keeping with the same programmed values as the example, figure 30 shows how the average i dd current is affected by the wait state time, which is determined by wen, wtime, and wlong. note that the worst-case current occurs when the wait state is not enabled. figure 30: average i dd current wen wtime wlong wait state average i dd current 0n/an/a 0 ms 245 a 1 0xff 0 2.73 ms 238 a 10xee 0 49.2 ms 175 a 1 0x00 0 699 ms 102 a 1 0x00 1 8389 ms 91 a
ams datasheet, confidential page 27 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? principles of operation i2c protocol interface and control are accomplished through an i2c serial compatible interface (standard or fast mode) to a set of registers that provide access to device cont rol functions and output data. the devices support the 7-bit i2c addressing protocol. the i2c standard provides for three types of bus transaction: read, write, and a combined protocol ( figure 31 ). during a write operation, the first byte written is a command byte followed by data. in a combined protocol, the first byte written is the command byte followed by reading a series of bytes. if a read command is issued, the register address from the previous command will be used for data access. likewise, if the msb of the command is not set, the device will write a series of bytes at the address stored in the last valid command with a register address. the command byte contains either control information or a 5-bit register address. the control commands can also be used to clear interrupts. the i2c bus protocol was developed by phillips (now nxp). for a complete description of the i2c protocol, please review the nxp i2c design specification at http://www.i2c?bus.org/references/ figure 31: i2c protocols a acknowledge (0) n not acknowledged (1) p stop condition r read (1) s start condition master-to-slave slave-to-master sr repeated start condition w write (0) ? communication of protocol i 2 c write protocol 11 1 1 8 78 a p command code data byte slave address aa 8 i 2 c read protocol i 2 c read protocol ? combined format 11 88 p data a data 11 1 1 8 77 a command code a a slave address 1 slave address 11 1 1 8 7 a p data slave address data 1 r s w sr a r s a a s w 1 1 1 1 1 1
page 28 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? register description the device is controlled and monitored by data registers and a command register accessed throug h the serial interface. these registers provide for a variety of control functions and can be read to determine results of the adc conversions. the register set is summarized in figure 32 . figure 32: register map address register name r/w register function reset value --- command w specifies register address 0x00 0x00 enable r/w enables states and interrupts 0x00 0x01 atime r/w integration time 0xff 0x02 ptime r/w proximity adc time 0xff 0x03 wtime r/w wait time 0xff 0x04 ailtl r/w als interrupt low threshold low byte 0x00 0x05 ailth r/w als interrupt lo w threshold high byte 0x00 0x06 aihtl r/w als interrupt high threshold low byte 0x00 0x07 aihth r/w als interrupt high threshold high byte 0x00 0x08 piltl r/w proximity interrupt low threshold low byte 0x00 0x09 pilth r/w proximity interrupt low threshold high byte 0x00 0x0a pihtl r/w proximity interrupt high threshold low byte 0x00 0x0b pihth r/w proximity interrupt high threshold high byte 0x00 0x0c pers r/w interrupt persistence filters 0x00 0x0d config r/w configuration 0x00 0x0e ppulse r/w proximity pulse count 0x00 0x0f control r/w control register 0x00 0x11 revision r die revision number rev num 0x12 id r device id 0x39 register description
ams datasheet, confidential page 29 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? register description the mechanics of accessing a spec ific register depends on the specific protocol used. see i2c protocol on page 27. in general, the command register is written first to specify the specific control/status register for following read/write operations. 0x13 status r device status 0x00 0x14 c0data r ch0 adc low data register 0x00 0x15 c0datah r ch0 adc high data register 0x00 0x16 c1data r ch1 adc low data register 0x00 0x17 c1datah r ch1 adc high data register 0x00 0x18 pdatal r proximity adc low data register 0x00 0x19 pdatah r proximity adc high data register 0x00 0x1e poffset r/w proximity offset register 0x00 address register name r/w register function reset value
page 30 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? register description command register the command register specifies the address of the target register for future write and read operations. the command register defaults to 0x00 at power-on. figure 33: command register 76543210 command type add field bits description (reset value = 0x00) command 7 select command register . must write as 1 when addressing command register. type 6:5 selects type of transaction to follow in subsequent data transfers: field value description 00 repeated byte protocol transaction 01 auto-increment protocol transaction 10 reserved do not use 11 special function C see description below transaction type 00 will repeatedly read the same register with each data access. transaction type 01 will provide an auto-increment function to read successive register bytes. add 4:0 address field/special function field. depending on the transaction type, see above, this field either specifies a specia l function command or selects the specific control-status-register for following write and read transactions. the field values listed below apply only to special function commands: field value description 00000 normal no action 00101 proximity interrupt clear 00110 als interrupt clear 00111 proximity and als interrupt clear other reserved do not write als/proximity interrupt clear clears an y pending als/proximity interrupt. this special function is self clearing.
ams datasheet, confidential page 31 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? register description enable register (0x00) the enable register is used to power the device on/off, enable functions, and interrupts. figure 34: enable register 765 4 3 210 reserved sai pien aien wen pen aen pon field bits description (reset value = 0x00) reserved 7 reserved. write as 0. sai 6 sleep after interrupt. when asserted, the device will power down at the end of a proximity or als cycle if an interrupt has been generated. pien 5 proximity interrupt mask. when asserted, permits proximity interrupts to be generated. aien 4 als interrupt mask . when asserted, permits als interrupt to be generated. wen 3 wait enable. this bit activates the wait feature. writing a 1 activates the wait timer. writing a 0 disables the wait timer. pen 2 proximity enable . this bit activates the proximity function. writing a 1 enables proximity. writing a 0 disables proximity. aen 1 als enable. this bit activates the two channel adc. writing a 1 activates the als. writing a 0 disables the als. pon 0 power on. this bit activates the internal oscillator to permit the timers and adc channels to operate. writing a 1 activates the oscillator. writing a 0 disables the oscillator.
page 32 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? register description als time register (0x01) the als time register controls the internal integration time of the als channel adss in 2.73ms increments. time is expressed as a 2s complement number. to calculate the value: 1. determine the number of 2.73ms intervals required 2. take the 2s complement for a 1 x 2.73ms interval, 0xff should be written. for 2 x 2.73ms intervals, 0xfe should be written. the maximum integration time is 699ms (0x00). figure 35: als time register 765 4 3 210 atime field bits description (reset value = 0xff) value cycles time max count atime 7:0 0xff 1 2.73 ms 1024 0xf6 10 27.3 ms 10240 0xdb 37 101 ms 37888 0xc0 64 175 ms 65535 0x00 256 699 ms 65535
ams datasheet, confidential page 33 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? register description proximity time register (0x02) the proximity time register contro ls the integration time of the proximity adc in 2.73 ms increments. time is expressed as a 2s complement number. it is recommended that this register be programmed to a value of 0xff (1 integration cycle). figure 36: proximity time register wait time register (0x03) wait time is set in 2.73 ms in crements unless the wlong bit is asserted in which case the wait times are 12 x longer. wtime is programmed as a 2s complement number. figure 37: wait time register note: the proximity wait time register should be conf igured before pen and/or aen is/are asserted. 765 4 3 210 ptime field bits description (reset value = 0xff) value cycles time max count ptime 7:0 0xff 1 2.73 ms 1023 765 4 3 210 wtime field bits description (reset value = 0xff) register value wait time time (wlong=0) time (wlong=1) wtime 7:0 0xff 1 2.73 ms 0.033 sec 0xb6 74 202 ms 2.4 sec 0x00 256 699 ms 8.4 sec
page 34 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? register description als interrupt threshold register (0x04 ? 0x07) the als interrupt threshold registers provide the values to be used as the high and low trigger points for the comparison function for interrupt generation. if c0data is not between the low and high thresholds and the persistence criteria is met, an interrupt is asserted on the interrupt pin. figure 38: als interrupt threshold registers proximity interrupt threshold register (0x08 ? 0x0b) the proximity interrupt threshold registers provide the values to be used as the high and low trigger points for the comparison function for interrupt generati on. if the value generated by proximity channel is not between the low and high thresholds and the persistence criteria is me t, an interrupt is signaled to the host processor. figure 39: proximity interrupt threshold registers register address bits description (reset value = 0x00) ailtl 0x04 7:0 als low threshold lower byte ailth 0x05 7:0 als low threshold upper byte aihtl 0x06 7:0 als high threshold lower byte aihth 0x07 7:0 als high threshold upper byte register address bits description (reset value = 0x00) piltl 0x08 7:0 proximity low threshold lower byte pilth 0x09 7:0 proximity low threshold upper byte pihtl 0x0a 7:0 proximity high threshold lower byte pihth 0x0b 7:0 proximity high threshold upper byte
ams datasheet, confidential page 35 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? register description interrupt register (0x0c) the interrupt register controls the filtering interrupt capabilities of the device. configurable filtering is provided to allow interrupts to be generated after each adc integration cycle or if the adc integration has produced a result that is outside of the values specified by threshold register for some specified amount of time. separate filtering is provided for proximity and als functions. als interrupts are generated by looking only at the c0data adc integration results. figure 40: interrupt register 765 4 3 210 ppers apers field bits description (reset value = 0x00) ppers 7:4 proximity interrupt persistence filter. controls rate of proximity interrupt to the host processor. field value meaning interrupt persistence 0000 every every proximity cycle generates an interrupt 0001 1 1 proximity value outside of threshold range 0010 2 2 consecutive proximity values out of range 1111 15 15 consecutive proximity values out of range
page 36 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? register description apers 3:0 als interrupt persistence filter. controls rate of interrupt to the host processor. field value persistence interrupt persistence 0000 every every als cycle generates an interrupt 0001 1 1 value outside of threshold range 0010 2 2 consecutive values out of range 0011 3 3 consecutive values out of range 0100 5 5 consecutive values out of range 0101 10 10 consecutive values out of range 0110 15 15 consecutive values out of range 0111 20 20 consecutive values out of range 1000 25 25 consecutive values out of range 1001 30 30 consecutive values out of range 1010 35 35 consecutive values out of range 1011 40 40 consecutive values out of range 1100 45 45 consecutive values out of range 1101 50 50 consecutive values out of range 1110 55 55 consecutive values out of range 1111 60 60 consecutive values out of range field bits description (reset value = 0x00)
ams datasheet, confidential page 37 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? register description configuration register (0x0d) the configuration register sets the proximity led drive level, wait long time, and als gain level figure 41: configuration register. proximity pulse count register (0x0e) the proximity pulse count register sets the number of proximity pulses that the ldr pin will generate during the prox accum state. the pulses are generated at a 62.5khz rate. figure 42: proximity pulse count register 765 4 3 210 reserved agl wlong pdl field bits description (reset value = 0x00) reserved 7:3 reserved. write as 0. agl 2 als gain level. when asserted, the 1 and 8 als gain (again) modes are scaled by 0.16. otherwise, again is scaled by 1. should be set = 0 anytime again is greater than 8x, or if using a tmd module. wlong 1 wait long. when asserted, the wait cycles are increased by a factor 12x from that programmed in the wtime register. pdl 0 proximity drive level. when asserted, the proximity ldr drive current is reduced by 9. 765 4 3 210 ppulse field bits description ppulse 7:0 proximity pulse count. specifies the number of proximity pulses to be generated.
page 38 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? register description control register (0x0f) the control register provides eight bits of miscellaneous control to the analog block. these bits typically control functions such as gain setti ngs and/or diode selection. figure 43: control register 765 4 3 210 pdrive pdiode pgain again field bits description (reset value = 0x00) pdrive (1) 7:6 proximity led drive strength. field value led strength C pdl=0 led strength C pdl=1 00 100 % 11.1 % 01 50 % 5.6 % 10 25 % 2.8 % 11 12.5 % 1.4 % pdiode 5:4 proximity diode selector. field value diode selection 00 proximity uses neither diode 01 proximity uses the ch0 diode 10 proximity uses the ch1 diode 11 reserved do not write pgain 3:2 proximity gain. field value proximity gain value 00 1x gain 01 2x gain 10 4x gain 11 8x gain
ams datasheet, confidential page 39 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? register description note(s) and/or footnote(s): 1. led strength values are nominal operating values. specific ations can be found in the proximity characteristics table. revision register (0x11) the revision register shows the silicon revision number. it is a read-only register and shows the revision level of the silicon used internally. figure 44: revision register again 1:0 als gain field value als gain value 00 1x gain 01 8x gain 10 16x gain 11 120x gain 765 4 32 1 0 reserved die_rev field bits description (reset value = rev num) reserved 7:4 reserved. die_rev 3:0 die revision number field bits description (reset value = 0x00)
page 40 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? register description id register (0x12) the id register provides the value for the part number. the id register is a read-only register whose value never changes. figure 45: id register 765 4 32 1 0 id field bit description (reset value = id) id 7:0 tmd27721 = 0x30 tmd27723 = 0x39 tmd27725 = 0x30 tmd27727 = 0x39 TMD27721WA = 0x30 tmd27723wa = 0x39
ams datasheet, confidential page 41 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? register description status register (0x13) the status register provides the internal status of the device. this register is read only. figure 46: status register adc channel data registers (0x14 ? 0x17) als data is stored as two 16-bit values. to ensure the data is read correctly, a two-byte read i2c transaction should be used with auto increment protocol bits set in the command register. with this operation, when the lower byte register is read, the upper eight bits are stored in a shadow register, which is read by a subsequent read to the upper byte. the upper register will read the correct value even if additional adc integration cycles end between the reading of the lower and upper registers. figure 47: adc channel data registers 765 4 32 1 0 reserved psat pint aint reserved pvalid avalid field bits description (reset value = 0x00) reserved 7 reserved. bit reads as 0. psat 6 proximity saturation. indicates the proximity measurement saturated. pint 5 proximity interrupt. indicates that the device is asserting a proximity interrupt. aint 4 als interrupt. indicates that the device is asserting an als interrupt. reserved 3:2 reserved. bits read as 0. pvalid 1 proximity valid. indicates that the proximity channel has completed an integration cycle after the pen bit has been asserted. avalid 0 als valid. indicates that the als channels have completed an integration cycle after aen has been asserted. register address bits description (reset value = 0x00) c0data 0x14 7:0 als ch0 data low byte c0datah 0x15 7:0 als ch0 data high byte c1data 0x16 7:0 als ch1 data low byte c1datah 0x17 7:0 als ch1 data high byte
page 42 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? register description proximity data registers (0x18 ? 0x19) proximity data is stored as a 16-bit value. to ensure the data is read correctly, a two-byte read i2c transaction should be utilized with auto increment pr otocol bits set in the command register. with this operation, when the lower byte register is read, the upper eight bits are stored into a shadow register, which is read by a subsequent read to the upper byte. the upper register will read the correct value even if the next adc cycle ends between the reading of the lower and upper registers. figure 48: proximity data registers register address bits description (reset value = 0x00) pdatal 0x18 7:0 proximity data low byte pdatah 0x19 7:0 proximity data high byte
ams datasheet, confidential page 43 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? register description proximity offset register (0x1e) the 8-bit proximity offset register provides compensation for proximity offsets caused by devic e variations, optical crosstalk, and other environmental factors. proximity offset is a sign-magnitude value where the sign bit, bit 7, determines if the offset is negative (bit 7 = 0) or positive (bit 7 = 1). the magnitude of the offset compensation depends on the proximity gain (pgain), proximit y led drive strength (pdrive), and the number of proximity pulses (ppulse). because a number of environmental factors contribute to proximity offset, this register is best suited for use in an adaptive closed-loop control system. see available ams application notes for proximity offset regist er application information. the default value on power up is factory trimmed to provide a typical proximity offset of 100. th is is achieved with no glass or reflective object above the sensor, and ppulse=08, pgain=10, pdrive=00. if the value is changed during use but power is removed it will return to the default value on power up. figure 49: proximity offset register 765 4 32 1 0 sign magnitude field bits description (reset value = trimmed value) sign 7 proximity offset sign. the offset sign shifts the proximity data negative when equal to 0 and positive when equal to 1. magnitude 6:0 proximity offset magnitude. the offset magnitude shifts the proximity data positive or negative , depending on the proximity offset sign. the actual amount of the shift depends on the proximity gain (pgain), proximity led drive strength (pdrive), and the number of proximity pulses (ppulse).
page 44 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? application information led driver pin with proximity detection in a proximity sensing system, the included ir led can be pulsed with more than 100 ma of rapidly switching current, therefore, a few design considerations must be kept in mind to get the best performance. the key goal is to reduce the power supply noise coupled back into the device during the led pulses. averaging of multiple proximity samples is recommended to reduce the proximity noise. the first recommendation is to use two power supplies; one for the device v dd and the other for the ir led. in many systems, there is a quiet analog supply and a noisy digital supply. by connecting the quiet supply to the v dd pin and the noisy supply to the leda pin, the key goal can be met. place a 1f low-esr decoupling capacitor as close as possible to the v dd pin and another at the leda pin, and at least 10f of bulk capacitance to supply the 100ma current surge. this may be distributed as two 4.7f capacitors. figure 50: proximity sensing using separate power supplies if it is not possible to provide two separate power supplies, the device can be operated from a si ngle supply. a 22 resistor in series with the v dd supply line and a 1f low esr capacitor effectively filter any power supply noise. the previous capacitor placement considerations apply. application information 1f v bus r p r p r pi 1f voltage regulator voltage regulator tmd2772 or tmd2772wa v dd gnd ldr int scl sda leda ledk
ams datasheet, confidential page 45 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? application information figure 51: proximity sensing using single power supply v bus in the above figures refers to the i2c bus voltage which is either v dd or 1.8v. be sure to apply the specified i2c bus voltage shown in the available options table for the specific device being used. the i2c signals and the interrupt are open-drain outputs and require pull-up resistors. the pull-up resistor (rp) value is a function of the i2c bus speed, the i2c bus voltage, and the capacitive load. the ams evm running at 400 kbps, uses 1.5k resistors. a 10k pull-up resist or (rpi) can be used for the interrupt line. 1f v bus r p r p r pi 1f voltage regulator per regulator datasheet 22 tmd2772 or tmd2772wa v dd gnd ldr int scl sda leda ledk
page 46 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? pcb pad layout suggested pcb pad layout guidelines for the surface mount module are shown below. flash gold is recommended surface finish for the landing pads. this footprint is recommended for both the tmd2772 and the tmd2772wa. figure 52: suggested module pcb layout note(s) and/or footnote(s): 1. all linear dimensions are in millimeters. 2. dimension tolerances are 0.05mm unless otherwise noted. 3. this drawing is subject to change without notice. pcb pad layout
ams datasheet, confidential page 47 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? packaging mechanical data figure 53: tmd2772 module dimensions note(s) and/or footnote(s): 1. all linear dimensions are in millimeters. 2. dimension tolerance is 0.05 mm unless otherwise noted. 3. contacts are copper with nipdau plating. 4. this package contains no lead (pb). 5. this drawing is subject to change without notice. packaging mechanical data green rohs
page 48 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? packaging mechanical data figure 54: tmd2772wa module dimensions note(s) and/or footnote(s): 1. all linear dimensions are in millimeters. 2. dimension tolerance is 0.05 mm unless otherwise noted. 3. contacts are copper with nipdau plating. 4. this package contains no lead (pb). 5. this drawing is subject to change without notice. green rohs
ams datasheet, confidential page 49 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? carrier tape & reel information figure 55: tmd2772 module carrier tape note(s) and/or footnote(s): 1. all linear dimensions are in millimeters. dime nsion tolerance is 0.10mm unless otherwise noted. 2. the dimensions on this drawing are for illustrative purpos es only. dimensions of an actual carrier may vary slightly. 3. symbols on drawing a o , b o , and k o are defined in ansi eia standard 481?b 2001. 4. each reel is 330 millimeters in diameter and contains 2500 parts. 5. ams packaging tape and reel conform to the requirements of eia standard 481?b. 6. in accordance with eia standard, device pin 1 is located next to the sprocket holes in the tape. 7. this drawing is subject to change without notice. carrier tape & reel information
page 50 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? carrier tape & reel information figure 56: tmd2772wa module carrier tape note(s) and/or footnote(s): 1. all linear dimensions are in millimeters. dime nsion tolerance is 0.10mm unless otherwise noted. 2. the dimensions on this drawing are for illustrative purpos es only. dimensions of an actual carrier may vary slightly. 3. symbols on drawing a o , b o , and k o are defined in ansi eia standard 481?b 2001. 4. each reel is 330 millimeters in diameter and contains 2500 parts. 5. ams packaging tape and reel conform to the requirements of eia standard 481?b. 6. in accordance with eia standard, device pin 1 is located next to the sprocket holes in the tape. 7. this drawing is subject to change without notice.
ams datasheet, confidential page 51 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? manufacturing information the module has been tested an d has demonstrated an ability to be reflow soldered to a pcb substrate. the solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a pcb. temperature is measured on top of component. the components should be limited to a maximum of three passes through this solder reflow profile. figure 57: solder reflow profile figure 58: solder reflow profile graph parameter reference device average temperature gradient in preheating 2.5c/sec soak time t soak 2 to 3 minutes time above 217c (t 1 )t 1 max 60 sec time above 230c (t 2 )t 2 max 50 sec time above 250c t 3 max 10 sec peak temperature in reflow t peak 260c temperature gradient in cooling max ?5c/sec manufacturing information
page 52 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? storage information moisture sensitivity optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previous ly absorbed into the package. to ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. shelf life the calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions: ? shelf life: 12 months ? ambient temperature: < 40 c ? relative humidity: < 90% rebaking of the devices will be required if the devices exceed the 12 month shelf life or the humidity indicator card shows that the devices were exposed to conditions beyond the allowable moisture region. floor life the module has been assigned a moisture sensitivity level of msl 3. as a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions: ? floor life: 168 hours ? ambient temperature: 30 c ? relative humidity: < 60% if the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. rebaking instructions when the shelf life or floor life limits have been exceeded, rebake at 50 c for 12 hours. storage information
ams datasheet, confidential page 53 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? ordering & contact information figure 59: configuration and ordering information note(s) and/or footnote(s): 1. contact factory for availability. buy our products or get free samples online at: www.ams.com/icdirect technical support is available at: www.ams.com/technical-support provide feedback about this document at: www.ams.com/document-feedback for further information and requests, e-mail us at: ams_sales@ams.com for sales offices, distributors and representatives, please visit: www.ams.com/contact headquarters ams ag tobelbaderstrasse 30 8141 unterpremstaetten austria, europe tel: +43 (0) 3136 500 0 website: www.ams.com device address angular response package ? leads interface description ordering number tmd27721 0x39 25 module ? 8 i2c v bus = v dd interface tmd27721 tmd27723 0x39 25 module ? 8 i2c v bus = 1.8v interface tmd27723 tmd27725 (1) 0x29 25 module ? 8 i2c v bus = v dd interface tmd27725 tmd27727 (1) 0x29 25 module ? 8 i2c v bus = 1.8v interface tmd27727 TMD27721WA (1) 0x39 50 module ? 8 i2c v bus = v dd interface TMD27721WA tmd27723wa 0x39 50 module ? 8 i2c v bus = 1.8v interface tmd27723wa ordering & contact information
page 54 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? rohs compliant & ams green statement rohs: the term rohs compliant means that ams ag products fully comply with current rohs directives. our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, rohs compliant products are suitable for use in specif ied lead-free processes. ams green (rohs compliant and no sb/br): ams green defines that in addition to rohs compliance, our products are free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material). important information: the information provided in this statement represents ams ag knowledge and belief as of the date that it is provided. ams ag bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are unde rway to better integrate information from third parties. ams ag has taken and continues to take reasonable steps to prov ide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams ag and ams ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. rohs compliant & ams green statement
ams datasheet, confidential page 55 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? copyrights & disclaimer copyright ams ag, tobelbader strasse 30, 8141 unterpremstaetten, austria-europe. trademarks registered. all rights reserved. the material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. devices sold by ams ag are covered by the warranty and patent indemnification provisions appe aring in its general terms of trade. ams ag makes no warranty, express, statutory, implied, or by description regarding th e information set forth herein. ams ag reserves the right to ch ange specifications and prices at any time and without notice. therefore, prior to designing this product into a system, it is necessary to check with ams ag for current information. this product is intended for use in commercial applications. applications requiring extended temperature range, unusual environmental requirements, or high reliability applications , such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams ag for each application. this product is provided by ams ag as is and any express or implied wa rranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams ag shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. no obligation or liability to recipient or any th ird party shall arise or flow out of ams ag rendering of technical or other services. copyrights & disclaimer
page 56 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? document status document status product status definition product preview pre-development information in this datasheet is based on product ideas in the planning phase of development. all specifications are design goals without any warranty and are subject to change without notice preliminary datasheet pre-production information in this datasheet is based on products in the design, validation or qualif ication phase of development. the performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice datasheet production information in this datashee t is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams ag standard warranty as given in the general terms of trade datasheet (discontinued) discontinued information in this datasheet is based on products which conform to specifications in accordance with the terms of ams ag standard warranty as given in the general terms of trade, but these products have been superseded and should not be used for new designs document status
ams datasheet, confidential page 57 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? revision information note(s) and/or footnote(s): 1. page numbers for the previous version may diff er from page numbers in the current revision. changes from 1-03 (2013-oct) to current revision 1-20 (2014-jul-21) page (1) content was updated to the latest ams design updated lux equation section 19 revision information
page 58 ams datasheet, confidential document feedback [v1-20] 2014-jul-21 tmd2772/ tmd2772wa ? content guide 1 general description 1 key benefits & features 2 applications 3 block diagram 4 pin assignment 5absolute maximum ratings 6 electrical characteristics 11 timing characteristics 11 timing diagrams 12 typical operating characteristics 15 detailed description 17 principles of operation 17 system state machine 18 photodiodes 18 als operation 19 lux equation 20 proximity detection 22 interrupts 23 system state machine timing 25 power management 27 i2c protocol 28 register description 30 command register 31 enable register (0x00) 32 als time register (0x01) 33 proximity time register (0x02) 33 wait time register (0x03) 34 als interrupt threshold register (0x04 ? 0x07) 34 proximity interrupt threshold register (0x08 ? 0x0b) 35 interrupt register (0x0c) 37 configuration register (0x0d) 37 proximity pulse count register (0x0e) 38 control register (0x0f) 39 revision register (0x11) 40 id register (0x12) 41 status register (0x13) 41 adc channel data registers (0x14 ? 0x17) 42 proximity data registers (0x18 ? 0x19) 43 proximity offset register (0x1e) content guide
ams datasheet, confidential page 59 [v1-20] 2014-jul-21 document feedback tmd2772/ tmd2772wa ? content guide 44 application information 44 led driver pin with proximity detection 46 pcb pad layout 47 packaging mechanical data 49 carrier tape & reel information 51 manufacturing information 52 storage information 52 moisture sensitivity 52 shelf life 52 floor life 52 rebaking instructions 53 ordering & contact information 54 rohs compliant & ams green statement 55 copyrights & disclaimer 56 document status 57 revision information

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