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this is information on a product in full production. june 2014 docid022065 rev 3 1/12 sm30ty automotive 3000 w transil? datasheet ? production data features ? peak pulse power: ? 3000 w (10/1000 s) ? up to 28 kw (8/20 s) ? stand off voltage range: from 13 v to 33 v ? unidirectional and bidirectional types ? operating t j max : 150 c ? high power capability at t jmax : ? 2200 w (10/1000 s) ? jedec registered package outline ? resin meets ul 94, v0 ? aec-q101 qualified complies with the following standards ? iso 10605 - c = 150 pf, r = 330 ? : ? 30 kv (air discharge) ? 30 kv (contact discharge) ? iso 10605 - c = 330 pf, r = 330 ? ? 30 kv (air discharge) ? 30 kv (contact discharge) ? iso 7637-2 (a) : ? pulse 1: v s = -100 v ? pulse 2a: v s = +50 v ? pulse 3a: v s = -150 v ? pulse 3b: v s = +100 v description the sm30ty transil series has been designed to protect automotive sensitive circuits against surges defined in iso 7637-2 and against electrostatic discharges according to iso 10605. the planar technology makes it compatible with high-end circuits where low leakage current and high junction temperature are required to provide reliability and stability over time. the sm30ty devices are packaged in smc (smc footprint in accordance with ipc 7531 standard). tm : transil is a trademark of stmicroelectronics k a unidirectional bidirectional smc (jedec do-214ab) a. not applicable to parts with stand-off voltage lower than the average battery voltage (13.5 v) www.st.com
characteristics sm30ty 2/12 docid022065 rev 3 1 characteristics figure 1. electrical characteristics - definitions figure 2. pulse definition for electrical characteristics table 1. absolute maximum ratings (t amb = 25 c ) symbol parameter value unit v pp peak pulse voltage iso10605 (c = 330 pf, r = 330 ? ) contact discharge air discharge iec 61000-4-2 /iso10605 (c = 150 pf, r = 330 ? ) contact discharge air discharge 30 30 30 30 kv p pp peak pulse power dissipation (1) t j initial = t amb 3000 w t stg storage temperature range -65 to + 150 c t j operating junction temperature range -55 to + 150 c t l maximum lead temperature for soldering during 10 s. 260 c 1. for a surge greater than the maximum values, the diode will fail in short-circuit. v cl v br v rm i rm i r i pp v i i rm i r i pp v rm v br v cl v cl v br v rm i rm i r i pp v i i rm i r i pp v rm v br v cl v cl v br v rm i rm i r i pp v i i f v f v cl v br v rm i rm i r i pp v i i f v f unidirectional bidirectional symbol parameter v stand-off voltage v breakdown voltage v clamping voltage i leakage current @ v i peak pulse current t voltage temperature coefficient v forward voltage drop r dynamic resistance rm br cl rm rm pp f d 100 50 0 pulse waveform tr = rise time (s) tp = pulse duration time (s) t %i pp t p t r
docid022065 rev 3 3/12 sm30ty characteristics 12 table 2. electrical characteristics, parameter values (t amb = 25 c) order code i rm max at v rm v br at i r (1) v cl at i pp 10/1000 s r d 10/1000 s v cl at i pp 8/20 s r d 8/20 s ? t (2) min typ max max max max a v v ma v (3) a (4) ? v (3) a (4) ? 10-4/ c sm30t15ay/cay 0.2 13 14.4 15.2 16 1 21.5 140 0.045 25 930 0.011 8.4 sm30t18ay/cay 0.2 15 16.7 17.6 18.5 1 24.4 123.0 0.055 30.0 910 0.014 8.8 sm30t19ay/cay 0.2 16 17.8 18.7 19.6 1 26.0 115.4 0.063 31.5 870 0.015 8.8 sm30t21ay/cay 0.2 18 20 21.1 22.2 1 29.2 102.7 0.079 35.0 790 0.018 9.2 sm30t23ay/cay 0.2 20 22.2 23.4 24.6 1 32.4 92.6 0.097 37.5 730 0.019 9.4 sm30t26ay/cay 0.2 22 24.4 25.7 27.0 1 35.5 84.5 0.116 40.5 680 0.022 9.6 sm30t28ay/cay 0.2 24 26.7 28.1 29.5 1 38.9 77.1 0.140 43.9 630 0.025 9.6 sm30t30ay/cay 0.2 26 28.9 30.4 31.9 1 42.1 71.3 0.164 47.0 600 0.028 9.7 sm30t33ay/cay 0.2 28 31.1 32.7 34.3 1 45.4 66.1 0.192 50.0 560 0.031 9.8 sm30t35ay/cay 0.2 30 33.3 35.1 36.9 1 48.4 62.0 0.215 53.0 530 0.034 9.9 sm30t39ay/cay 0.2 33 36.7 38.6 40.5 1 53.3 56.3 0.261 58.0 490 0.040 10 1. pulse test: t p < 50 ms 2. to calculate maximum clamping voltage at other surge level, use the following formula: v cl max = v cl - r d x (i pp - i ppappli ) where i ppappli is the surge current in the application 3. to calculate v br or v cl versus junction temperature, use the following formulas: v br at t j = v br at 25 c x (1 + t x (t j - 25)) v cl at t j = v cl at 25 c x (1 + t x (t j - 25)) 4. surge capability given for both directions for unidirectional and bidirectional types.
characteristics sm30ty 4/12 docid022065 rev 3 figure 3. peak pulse power dissipation versus initial junction temperature (typical value) figure 4. peak pulse power versus exponential pulse duration (t j initial = 25 c) p(w) pp 0 500 1000 1500 2000 2500 3000 3500 0 25 50 75 100 125 150 175 t (c) j 10/1000 s p (kw) pp 0.1 1.0 10.0 100.0 1000.0 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 t initial = 25 c j t( ) p ms figure 5. clamping voltage versus peak pulse current (exponential waveform, maximum values) figure 6. junction capacitance versus reverse applied voltage for unidirectional types (typical values) i(a) pp 0.1 1.0 10.0 100.0 1000.0 10 100 10/1000 s 8/20 s v(v) cl t initial = 25 c j sm30t39ay/cay sm30t18ay/cay sm30t26ay/cay c(nf) 0.1 1.0 10.0 1 10 100 sm30t18ay sm30t39ay f = 1 mhz v = 30 mv t = 25 c osc rms j v(v) r figure 7. junction capacitance versus reverse applied voltage for bidirectional types (typical values) figure 8. leakage current versus junction temperature (typical values) 0.1 1.0 10.0 1 10 100 c(nf) sm30t18cay sm30t39cay f = 1 mhz v = 30 mv t = 25 c osc rms j v(v) r 1.e+00 1.e+01 1.e+02 1.e+03 25 50 75 100 125 150 v=v rrm i (na) r t (c) j
docid022065 rev 3 5/12 sm30ty characteristics 12 figure 11. thermal resistance junction to ambient versus copper surface under each lead figure 9. peak forward voltage drop versus peak forward current (typical values) figure 10. relative variation of thermal impedance, junction to ambient, versus pulse duration i(a) fm 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 t = 150 c j t = 25 c j v(v) fm z/r th(j-a) th(j-a) 0.01 0.10 1.00 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 recommended pad layout single pulse t (s) p epoxy printed board, fr4 copper thickness = 35 m 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 r (c/w) th(j-a) s (cm ) cu 2 epoxy printed board, fr4 copper thickness = 35 m
characteristics sm30ty 6/12 docid022065 rev 3 figure 12. iso7637-2 pulse 1 response (vs = -100 v) figure 13. iso7637-2 pulse 2 response (vs = 50 v)
docid022065 rev 3 7/12 sm30ty characteristics 12 figure 14. iso7637-2 pulse 3a response (vs = -150 v) figure 15. iso7637-2 pulse 3b response (vs = 100 v) note: iso7637-2 pulses responses are not applicable for product with a stand off voltage lower than the average battery voltage (13.5 v).
application and design guidelines sm30ty 8/12 docid022065 rev 3 2 application and design guidelines more information is available in the application note an2689 ?protection of automotive electronics from electrical hazards, guidelines for design and component selection?.
docid022065 rev 3 9/12 sm30ty package information 12 3 package information ? case: jedec do-214ab molded plastic over planar junction ? terminals: solder plated, solderable as per mil-std-750, method 2026 ? polarity: for unidirectional types the band indicates cathode ? flammability: epoxy is rated ul 94, v0 ? rohs package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 16. ipak dimension definitions table 3. smc dimension values ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 2.90 3.20 0.114 0.126 c 0.15 0.40 0.006 0.016 d 5.55 6.25 0.218 0.246 e 7.75 8.15 0.305 0.321 e1 6.60 7.15 0.260 0.281 e2 4.40 4.70 0.173 0.185 l 0.75 1.50 0.030 0.059 e c l e2 e1 d a1 a2 b
package information sm30ty 10/12 docid022065 rev 3 figure 17. smc footprint dimensions in mm (inches) figure 18. marking layout (1) 1. marking layout can vary according to assembly location. table 4. marking order code marking order code marking sm30t15ay 3aagy sm30t15cay 3bagy sm30t18ay 3aahy sm30t18cay 3bahy sm30t19ay 3aaiy sm30t19cay 3baiy sm30t21ay 3aajy sm30t21cay 3bajy sm30t23ay 3aaky sm30t23cay 3baky sm30t26ay 3aaly sm30t26cay 3baly sm30t28ay 3aaey sm30t28cay 3baey sm30t30ay 3aamy sm30t30cay 3bamy sm30t33ay 3aany sm30t33cay 3bany sm30t35ay 3aaoy sm30t35cay 3baoy sm30t39ay 3aapy sm30t39cay 3bapy 8.19 1.54 5.11 1.54 (0.061) (0.201) (0.322) (0.124) (0.061) 3.14 y w w z x x x ecopack compliance xxx: marking z: manufacturing location y: year ww: week cathode bar ( unidirectional devices only )
docid022065 rev 3 11/12 sm30ty ordering information 12 4 ordering information figure 19. ordering information scheme 5 revision history table 5. ordering information order code marking package weight base qty delivery mode sm30txxay/cay (1) 1. where xxx is nominal value of v br and a or ca indicates unidirectional or bidirectional version. see tab le 2 for list of available devices and their order codes see table 4 on page 10 smc 0.25 g 2500 tape and reel sm 30t xx ca y surface mount surge rating 30 = 3000 w transil in smc breakdown voltage type a = unidirectinal ca = bidirectional automotive grade table 6. document revision history date revision changes 28-jul-2011 1 initial release. 27-mar-2012 2 updated footnote on page 1. removed table 2. thermal parameter. 23-jun-2014 3 updated : features , table 2 , table 4 and reformatted to current standard.
sm30ty 12/12 docid022065 rev 3 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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