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zigbit 2.4gh z wireless modules atzb -x0- 256 -3-0-c datasheet features ? c ompact size (33.0 x 20.0 mm ) ? high rx sensitivity ( - 96dbm) ? outperforming link budget (up to 99.6db) ? up to +3.6dbm output power ? very low power consumption: ? 6. 3 ma in rx mode (1) ? 20.5 ma in tx mode (1) ? 0.3 a in sleep mode (2) ? ample memory resources: ? 256kbytes in - system self -p rogrammable flash memory, 4k bytes eeprom, 16k bytes sram ? wide range of interfaces (both analog and digital) : ? 4- wire spi, twi ? isp, jtag ? two a nalog comparator i nput ? uart, usart ? timer, pwm ? four adc lines ? external c lock i nput, i nternal c lock o utput ? up to 3 2 lines configurable as gpio ? preassigned atmel ? mac address that can be used on end product ? capability to use mac address into the internal eeprom ? ieee ? 802.15.4 compliant t ransceiver ? 2.4ghz ism band ? serial bootloader ? high p erformance , l ow power atmel ? avr ? xmega ? 8 /16 - bit microcontroller ? rapid design - in with built - in c hip a ntenna ? rf t est point using ms - 147 rf connector ? small physical footprint and low profile for optimum fit in very small application boards ? mesh networking capability ? easy - to - use low cost development kit ? single source of support for hw and sw ? worldwide license - free operation notes: 1. mcu is in active state with 3v supply, cpu clock @ 16mhz, rx rpc enabled (for rx current), phy_tx_pwr=0x0 (for tx current), all digital outputs pulled high. 2. controller sleep mode : sleep_mode_pwr_down . 42172 b ? wireless ? 03 /201 4
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 2 table of contents 1. introduction ........................................................................................ 3 1.1 summary ........................................................................................................... 3 1.2 applications ....................................................................................................... 3 1.3 abbreviations and acronyms ............................................................................ 3 1.4 related documents ........................................................................................... 5 2. zigbit module overview ..................................................................... 6 2.1 overview ........................................................................................................... 6 3. specification ....................................................................................... 8 3.1 electrical characteristics ................................................................................... 8 3.1.1 absolute maximum ratings ................................................................ 8 3. 1.2 power supply ...................................................................................... 8 3.1.3 rf characteristics .............................................................................. 9 3.1.4 atxmega256a3u microcontroller characteristics .......................... 10 3.1.5 module interfaces characteristics ..................................................... 10 3.2 physical/environmental characteristics and outline ....................................... 10 3.3 pin configuration ............................................................................................. 11 3.4 antenna orientation recommendation ............................................................. 12 3.5 mounting information ...................................................................................... 12 3.6 soldering profile .............................................................................................. 15 3.7 antenna reference designs ........................................................................... 16 4. schematics ...................................................................................... 16 4.1 handling instr uctions ....................................................................................... 17 4.2 general recommendations ............................................................................ 17 5. persistence memory ........................................................................ 17 6. orderin g information ........................................................................ 19 7. agency certifications ....................................................................... 20 7.1 united states (fcc) ........................................................................................ 20 7.2 european union (etsi) ................................................................................... 21 7.3 in dustry canada (ic) compliance statements ................................................ 21 8. revision history ............................................................................... 23
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 3 1. introduction 1.1 summary atzb - x0 - 256 -3-0- c zigbit ? is an ultra- compact and low - power 2.4ghz ieee 802.15.4/zigbee ? oem module from atmel. based on the innovative mixed - signal hardware platform from atmel, this module uses the at xmega256a3u [1] microcontroller and at86rf233 [5] 2.4ghz ism band transceiver. the radio transceive r pr ovides high data rates from 250 kb/s up to 2mb/s, frame handling, outstanding receiver sensitivity and high transmit output power enabling a very robust wireless communication. the module is designed for wireless sensing, monitoring, control, data acqui sition applications, to name a few. this zigbit module eliminates the need for costly and time - consuming rf development, and shortens time - to - market for wireless applications. the module has an ms - 147 rf connector that can be used as an rf test port. the built - in chip antenna is designed and tuned for the zigbit design to enable quick integration of the zigbit into any application. 1.2 applications the zigbit module is compatible with robust ieee 802.15.4/zigbee stack that supports a self - healing, self - organizing mesh network, while optimizing network traffic and minimizing power consumption. for detailed software support information, please visit http://www.atmel.com/products/wireless . the app lication areas include, but are not limited to: ? building automation and monitoring o lighting controls o wireless smoke - and co - detectors o structural integrity monitoring ? hvac monitoring & control ? inventory management ? environmental monitoring ? security ? water metering ? industrial monitoring o machinery condition and performance monitoring o monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc. ? automated meter reading (amr) 1.3 abbreviations and a cronyms adc analog - to - digital converter api application programming interface dc direct current dtr data terminal ready eeprom electrically erasable programmable read - only memory esd electrostatic discharge gpio general purpose input/output haf high frequency
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 4 hvac heating , ventilating, and air conditioning hw hardware i 2 c inter - integrated circuit ieee institute of electrical and electronics engineers irq interrupt request ism industrial, scientific and medical radio band jtag digital interface for debugging of embedded device, also known as ieee 1149.1 standard interface mac medium access control layer mcu microcontroller unit. in this document it also means the processor, which is the core of a zigbit module nre network layer oem original equipment manufacturer ota over - the - air upgrade pa power amplifier pcb printed circuit board per package error ratio ram random access memory rf radio frequency rpc reduced power consumption rts/cts request to send/ clear to send rx receiver sma surface mount assembly soc system on chip spi serial peripheral interface sw software ttm time - to - market tx transmitter uart universal asynchronous receiver/transmitter usart universal synchronous/asynchronous receiver/transmitter usb universal serial bus zigbee, zigbee pro wireless networking standards targeted at low - power applications 802.15.4 the ieee 802.15.4 - 2003 standard applicable to low - rate wireless personal area network
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 5 1.4 related d ocuments [1] atxmega256a3u datasheet in http://www.atmel.com/images/atmel - 8386 -8- and - 16 - bit - avr - microcontroller - atxmega64a3u - 128a3u - 192a3u - 256a3u_datasheet.pdf [2] ms -1 47 series interface rf connector with switch, 3.9mm high, dc to 6ghz http://www.hirose.co.jp/cataloge_hp/e35801505.pdf [3] ieee std 802.15.4 - 2003 ieee standard for information technology - part 15.4 wireless medium access control (mac) and physical layer (phy) specifications for low - rate wireless personal area networks (lr - wpans) [4] zigbee specification. zigbee document 053474r17, october 19, 2007 [5] at86rf233 datasheet in http://www.atmel.com/images/atmel - 8351- mcu_wireless - at86rf233_datasheet.pdf
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 6 2. zigbit module o verview 2.1 overview the atzb - x0 - 256 -3-0- c zigbit is a compact, low - power, high sensitivity ieee 802.15.4/zigbee oem module. based o n a solid combination of the latest atmel mcu wireless hardware platform, 2.4ghz ism band transceiver and atmel studio wireless composer - the zigbit offers an unmatched combination of superior radio performance, ultra- low power con sumption and exceptional ease of integration . figure 2 - 1. atzb -x0- 256 -3-0- c block diagram . this zigbit module contains atmel?s at xmega 256a3u microcontroller and at86rf233 2.4ghz ism band transceiver for zigbee and ieee 802.15.4 [1] . the module features 256kb in-s ystem s elf -p rogrammable f lash memory, 16kb sram and 4kb eeprom. the compact all - in - one board design of mcu and r adio t ransceiver with very minimal components on the rf path to antenna dramatically improves the zigbit?s compact size, range performance on signal transmission and increases its sensitivity. this ensures stable connectivity within a larger coverage area, and helps develop applications on smaller footprint. the ms - 147 connector [2] can be used as an rf test port. zigbit module contains a complete rf/mcu design with all the necessary passive components included. the module can be easily mounted on a simple 2 - layer pcb with a minimum of required external connection. the zigbit module e valuation kit containing the zigbit e xtension board for the atmel xplained pro hw e valuation platform can be used to develop fw using the atmel studio and evaluate using the wireless composer. compared to a custom rf/mcu solution, a module - based solution offers considerable savings in development time and nre cost per unit during the hw/fw design, prototyping, and mass production phases of product development. all zigbits are preloaded with a b ootloader when they are sold as m odules, either in s ingle units or t&r. depending on end - user design requirements, the zigbit can operate as a self - contained sensor node, where it would function as a single mcu, or it can be paired with a host processor driving the module over a serial interface.
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 7 the mac stack running on the host processor can then control data transmission and manages module peripherals. thus very minimal firmware customization is required for successful module design - in. third - party sensors can then be connected directly to the module, thus expanding the existing set of peripheral interfaces. every zigbit module come pre loaded with atmel assigned 64 - bit mac address stored in the signature bytes of the device. this unique ieee mac address can be used as the mac address of the end product, so there is no need to buy a mac address separately for the product using the z igbit.
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 8 3. specification 3.1 electrical c haracteristics 3.1.1 absolute maximum r atings table 3 -1. absolute maximum r atings (1)(2) parameter minimum maximum voltage on any pin, except reset with respect to g round - 0.3v 3.6v (v dd max ) input rf l evel +10dbm current into vcc pins 200ma notes: 1. absolute maximum ratings are the values beyond which damage to the device may occur. under no circumstances must the absolute maximum ratings given in this table be violated. stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. this is a stress rating only. functional operation of the device at these or other conditions, beyond those indicated in the operational sections of this specification, is not implied. exposure to absolute maximum rat ing conditions for extended periods may affect device reliability. 2. attention! zigbit is an esd- sensitive device. precaution should be taken when handling the device in order to prevent permanent damage. 3.1.2 power supply table 3 -2. test c onditions (unless otherwise stated), v cc = 3v, t amb = 25 c. parameter range unit su pply v oltage, v dd 1.8 to 3.6 v active current consumption: rx mode ? busy_rx - receive state 16.5 ma active current consumption: rx mode - rx_on with rpc, mcu active 11.8 ma active current consumption: rx mode - rx_on, mcu active 17.0 ma active current consumption: rx mode - rx_on with rpc, mcu power_down 6.1 ma active current consumption: rx mode - rx_on, mcu power_down 11.3 ma active current c onsumption: tx mode ( 1 ) ? busy_tx ? transmit state 20.5 ma active current consumption: tx mode ? pll_on 5.6 ma current consumption: trx_off, mcu active 5.5 ma current consumption: trx_off, mcu power_down 443 a sleep current c onsumption: trx sleep, mcu power_down (2) 0.3 a sleep current c onsumption: trx sleep, mcu power_save (2) 0.3 a sleep current c onsumption: trx sleep, mcu standby (2) 380 a sleep current c onsumption: trx sleep, mcu extended_standby (2) 380 a sleep current c onsumption: trx deep_sleep, mcu power_down (2) 8.5 a sleep current c onsumption: trx deep_sleep, mcu power_save (2) 8.5 a sleep current c onsumption: trx deep_sleep, mcu standby (2) 388 a sleep current c onsumption: trx deep_sleep, mcu extended_standby (2) 388 a note 1: output tx power (when measuring consumption in tx mode) is +3 dbm.
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 9 note 2: a) all interfaces are set to the default state (see pin assignment table). b) jtag is not connected. c) cpu clock configured when doing this measurement ? 16mhz for all modes except power save and power down modes current consumption depends on multiple factors, including but not limited to, the board design and materials, protocol settings, network activity, eeprom read/write operations. it also depends on mcu load and/or peripherals used by an application . 3.1.3 rf c haracteristics table 3 -3. rf c haracteristics (1) . parameter condition typical values unit frequency band 2.4000 to 2.4835 ghz numbers of channels 16 channel spacing 5 mhz transmitter output power adjusted in 16 steps - 17 to + 4 dbm receiver sensitivity per = 1% -96 dbm on - air data rate 250 , upto 2000 kbps tx output/ rx input nominal impedance for balanced 50 range open field, los, elevated 48 ? 178 # m note # range measured is line of sight and at 10ft elevation from ground at different combinations of orientations of transmitter and receiver, with special conditions were there is minimal or no rf interference from other sources. for best case orientation o f the zigbits to achieve maximum range, refer to section 3.4 table 3 -4. tx power settings phy_tx_pwr 3:0 register value power register setting [dbm] typical output power [dbm] ( values at rf connector) 0 +4 +3 1 +3.7 +2. 9 2 +3.4 + 2. 7 3 +3 +2. 6 4 +2.5 +2. 5 5 +2 +0.4 6 +1 - 0.3 7 0 -1 8 -1 -2 9 -2 - 3.0 10 -3 -4. 11 -4 -5. 7 12 -6 - 7.5 13 -8 - 9.8 14 -12 - 13.0 15 -17 - 17.9 note 1: for detailed characteristics, refer to [2] .
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 10 3.1.4 atxmega256a3u microcontroller c haracteristics table 3 -5. at xmega256a3u c haracteristics. parameter range unit on - chip flash memory size 256 k bytes on - chip ram size 16 k bytes on - chip eeprom size 4k bytes operation frequency 16 mhz 3.1.5 module interfaces c haracteristics table 3 -6. module interfaces c haracteristics (1) . parameters condition range unit uart maximum baud rate 115.2 kbps adc conversion time (latency) (res+2)/2+(gain !=0) res (resolution) = 8 or 12 5-8 clk adc cycles adc input resistance static load resistor of input signal 4.0 k adc reference voltage (vref) 1. 0 to av cc ? 0.6 v adc input voltage 0 - avdd v twi maximum clock 400 khz gpio high level input voltage vcc = 2.7 - 3.6v 2 to vcc+0.3 v gpio low level input voltage vcc = 2.7 - 3.6v - 0.3 to 0.3 v dd v gpio high level output voltage v oh vcc = 3.0 - 3.6v 2.4 to 0.94vcc v gpio low level output voltage v ol vcc = 3.0 - 3.6v 0.05vcc typ max 0.4 v real - time oscillator frequency 32.768 khz note 1: for detailed characteristics, refer to [1] . 3.2 physical/ e nvironmental c haracteristics and o utline table 3 -7. physical characteristics. parameters value comments size 33.0 x 20.0 mm operating temperature range - 40c to +85c - 40c to +85c operational
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 11 3.3 pin c onfiguration table 3 -8. atzb -x0- 256 -3-0- c pinout description pin out pin descriptions function 1 avss analog ground 2 avss analog ground 3 devdd digital power input pin 4 devdd digital power input pin 5 rset/pdi_clock reset 6 pd4/ss spi 7 pd5/mosi/xck1 spi 8 pd6/miso/rxd1/d - spi 9 pd7/sck/txd1/d+ spi 10 pa5 gpio / adc / analog comp+ 11 pa4 gpio/adc/analog comp - 12 dvss digital ground 13 pd2/sync/async/oc0c/ uart 14 pd3/sync/txd0/oc0d uart 15 pd1/scl/int/oc0b usart 16 pdi_data pwm/tc 17 pa6 gpio/adc 18 pa7 gpio/adc 19 pb3 gpio/adc/dac1 20 pb2 gpio/adc/dac/intwkup 21 pf1/oc0b/int/xck0 int/pwm/gpio 22 pf2/oc0c/int/rxd0 int/pwm/gpio 23 pf3/oc0d/int/txd0 int/pwm/gpio 24 pb0/iaref/int adc ref 25 pa0/adc0/int adc/ gpio 26 pa1/adc1/int adc/ gpio 27 pa2/adc2/int adc/ gpio 28 pa3/adc3/int adc/ gpio 29 dvss digital ground 30 pb6/tck/int jtag 31 pb4/tms/int jtag 32 pb7/tdo/int jtag 33 pb5/tdi/int jtag 34 pe3/txd gpio/output counter 35 pe2/rxd wakeup int 36 pe1/xck twi/int/gpio 37 pe0 twi/int/gpio 38 pe5/oc1b/int gpio/tc 39 pe4/sync/oc1a master clock out put
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 12 pin out pin descriptions function 40 pf0 gpio/timer 41 dvss digital ground 42 dvss digital ground 3.4 antenna orientation recommendation the antenna in this module is designed to provide the best possible los range in the direction indicated in this illustration. 3.5 mounting i nformation the figure s below show s the pcb layout recommended for a zigbit module. neither via - holes nor wires are allowed on the pcb upper layer in the area occupied by the module. as a critical requirement, rf_gnd pins should be grounded via several via - holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and losses.
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 13 figure 3 - 1. atzb -x0- 256 -3-0- c dimensions figure 3 - 2. atzb -x0- 256 -3-0- c pinout
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 14 figure 3 - 3. atzb -x0- 256 -3-0-c foot print dimensions figure 3 - 4. atzb -x0- 256 -3-0- c mounting information (preferred placement)
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 15 figure 3 - 5. figure 3 - 4. atzb -x0- 256 -3-0- c mounting information ( alternative placement) the zigbit?s location and orientation on the carrier board is illustrated in the above mounting information drawing. the recommended placement of zigbit on carrier board needs to be accurately followed to ensure performance on the end application please note the areas in the mounting information drawing for copper and component keep out to ensure superior performance of the zigbits on your end application. copper keep out recommended in the drawing applies for all layers of the carrier board the dimension a of the carrier board should be equal to or greater than 20mm. similarly, the dimension b should be equal to or greater than 33mm 3.6 soldering p rofile the j - std - 020c - compliant soldering profile is recommended according to table 3 -9 . table 3 -9. soldering profile (1) profile feature green package average ramp - up rate (217c to peak) 3c/s max preheat temperature 175c 25c 180s max temperature maintained above 217c 60s to 150s time within 5c of actual peak temperature 20s to 40s peak temperature range 260c ramp - down rate 6c/s max
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 16 profile feature green package time within 25c to peak temperature 8 minutes note: 1. the package is backward compatible with pb/sn soldering profile. 3.7 antenna r eference d esigns multiple factors affect proper antenna match, hence, affecting the antenna pattern. the particular factors are the board material and thickness, shields, the material used for enclosure, the board neighborhood, and other components adjacent to antenna. following guidelines need to be followed when designing the base board for the zigbit. general recommendations: ? metal enclosure should not be used. using low profile enclosure might also affect antenna tuning. ? placing high profile components next to antenna should be avoided. ? having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges also distorting antenna pattern. ? zigbit module should not be placed next to consumer electronics which might interfere with zigbit?s rf band frequency. the board design should prevent propagation of microwave field inside the board material. electromagnetic waves of high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna pattern. to eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges. 4. s chematics the following schematic drawings for the atzb - x0 - 256 -3-0- c are in the following order: ? top level schematics ? connector schematics ? atxmeg a256a3bu schematics ? at86rf233 schematics
colabel1 copcb200 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 d d c c b b a a * xmega_233_toplevel.schdoc 1 4 4/5/2013 4:38:22 pm atzb-x0-256-3-0-c atmel r&d rmz millenia perungudi chennai page: of title: document number: revision: 4 date: ojs msk * a b spi i nterface gpi o/adc gpi o/adc/anal ogcomp gpi o/adc/dac i nt/pwm/gpi o jtag uart/usart pdi /gpi o twi connector xm eg a_233_connector.schdoc trx_i /f spi i nterface gpi o/adc gpi o/adc/anal ogcomp gpi o/adc/dac i nt/pwm/gpi o jtag uart/usart pdi /gpi o twi xmega233 xm eg a_233_mcu.schdoc trx_i /f rf xm eg a_233_rf.schdoc z ig bit xm eg a 2.4ghz board pcb pcb200 product num ber/revision serial num ber l abel z ig bit shield l abel 1
piz20001 piz20002 piz20003 piz20004 piz20005 piz20006 piz20007 piz20008 piz20009 piz200010 piz200011 piz200012 piz200013 piz200014 piz200015 piz200016 piz200017 piz200018 piz200019 piz200020 piz200021 piz200022 piz200023 piz200024 piz200025 piz200026 piz200027 piz200028 piz200029 piz200030 piz200031 piz200032 piz200033 piz200034 piz200035 piz200036 piz200037 piz200038 piz200039 piz200040 piz200041 piz200042 coz200 piz20101 piz20102 piz20103 piz20104 coz201 pogpio0adc pogpio0adc0aref pogpio0adc0pa0 pogpio0adc0pa1 pogpio0adc0pa2 pogpio0adc0pa3 pogpio0adc0pa6 pogpio0adc0pa7 pogpio0adc0analogcomp pogpio0adc0analogcomp0pa4 pogpio0adc0analogcomp0pa5 pogpio0adc0dac pogpio0adc0dac0pb2 pogpio0adc0dac0pb3 point0pwm0gpio point0pwm0gpio0pf1 point0pwm0gpio0pf2 point0pwm0gpio0pf3 pojtag pojtag0nrst pojtag0pb4 pojtag0pb5 pojtag0pb6 pojtag0pb7 popdi0gpio popdi0gpio0pdi popdi0gpio0pe4 popdi0gpio0pe5 popdi0gpio0pf0 pospi interface pospi interface0pd4 pospi interface0pd5 pospi interface0pd6 pospi interface0pd7 potwi potwi0pe0 potwi0pe1 potwi0pe2 potwi0pe3 pouart0usart pouart0usart0pd1 pouart0usart0pd2 pouart0usart0pd3 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 d d c c b b a a * xmega_233_connector.schdoc 2 4 4/5/2013 4:38:23 pm atzb-x0-256-3-0-c atmel norway vestre rosten 79 n-7075 tiller norway page: of title: document number: revision: a date: ojs msk * pa3_adc3_i nt pb6_tck_i nt pb7_tdo_i nt pb5_tdi _i nt pb4_tms_i nt pb3 pb2 pa6 pa0_adc0_i nt pa1_adc1_i nt pa2_adc2_i nt pf1_oc0b_i nt_xck0 pa5 pa4 pa7 vcc_3v3 gnd gnd pd4_ss pd5_mosi _xck1 usbd_p usbd_n gnd vcc_3v3 gnd gnd gnd gnd 1 gnd 2 vdd 3 vdd 4 rset/pdi_clock 5 pd4/ss 6 pd5/mosi/xck1 7 pd6/miso/rxd1/d- 8 pd7/sck/txd1/d+ 9 pa5 10 pa4 11 gnd 12 pd2/rxd0 13 pd3/txd0 14 pd1/xck0 15 pdi_data 16 pa6 17 pa7 18 pb3 19 pb2 20 pf1/oc0b/int/xck0 21 pf2/oc0c/int/rxd0 22 pf3/oc0d/int/txd0 23 pb0/iaref/int 24 pa0/adc0/int 25 pa1/adc1/int 26 pa2/adc2/int 27 pa3/adc3/int 28 pb6/tck/int 30 pb4/tms/int 31 pb7/tdo/int 32 pb5/tdi/int 33 pe3 34 pe2/async 35 pe1/scl 36 pe0/sda 37 pe5/oc1b/int 38 gnd 41 gnd 29 pe4/sync/oc1a 39 gnd 42 pf0 40 atz b- x- 0- 256- 3- 0- c z 200 pf2_oc0c_i nt_rxd0 pf3_oc0d_i nt_txd0 pd4 pd5 pd6 pd7 spi i nterface pa0 pa1 pa2 pa3 pa6 pa7 aref gpi o/adc pb2 pb3 gpi o/adc/dac pf1 pf2 pf3 i nt/pwm/gpi o pa4 pa5 gpi o/adc/anal og comp pb5 pb4 pb6 pb7 nrst jtag pd4_ss pd5_mosi _xck1 usbd_n usbd_p pa0_adc0_i nt pa1_adc1_i nt pa2_adc2_i nt pa3_adc3_i nt pa6 pa7 pb2 pb3 pa4 pa5 pb4_tms_i nt pb5_tdi _i nt pb6_tck_i nt pb7_tdo_i nt pf1_oc0b_i nt_xck0 pf2_oc0c_i nt_rxd0 pf3_oc0d_i nt_txd0 gpio/adc/analogcomp gpio/adc/dac gpio/adc spi interface jtag int/pwm/gpio nrst nrst pb0_aref_i nt pb0_aref_i nt pe4_sync_oc1a pe5_oc1b_i nt pdi _data pf0 1 2 3 4 emi shield z 201 b a pe4_sync_oc1a pe5_oc1b_i nt pf0 pdi _data pf0 pdi pe4 pe5 pdi /gpi o pdi/gpio pe2 pe1 pe3 pe0 twi pe1_scl pe2_async pe3_gpi o twi pe0_sda pe2_async pe3_gpi o pd1_xck0 pd2_rxd0 pd3_txd0 pe1_scl pe0_sda pd2 pd1 pd3 uart/usart pd1_xck0 pd2_rxd0 pd3_txd0 uart/usart
pic20001 pic20002 coc200 pic20101 pic20102 coc201 pic20201 pic20202 coc202 pic20301 pic20302 coc203 pic20401 pic20402 coc204 pic20501 pic20502 coc205 pic20601 pic20602 coc206 pic20701 pic20702 coc207 pic20801 pic20802 coc208 pil20001 pil20002 col200 pil20101 pil20102 col201 pir20001 pir20002 cor200 piu20001 piu20002 piu20003 piu20004 piu20005 piu20006 piu20007 piu20008 piu20009 piu200010 piu200011 piu200012 piu200013 piu200014 piu200015 piu200016 piu200017 piu200018 piu200019 piu200020 piu200021 piu200022 piu200023 piu200024 piu200025 piu200026 piu200027 piu200028 piu200029 piu200030 piu200031 piu200032 piu200033 piu200034 piu200035 piu200036 piu200037 piu200038 piu200039 piu200040 piu200041 piu200042 piu200043 piu200044 piu200045 piu200046 piu200047 piu200048 piu200049 piu200050 piu200051 piu200052 piu200053 piu200054 piu200055 piu200056 piu200057 piu200058 piu200059 piu200060 piu200061 piu200062 piu200063 piu200064 piu200065 cou200 pixc20001 pixc20002 coxc200 pogpio0adc pogpio0adc0aref pogpio0adc0pa0 pogpio0adc0pa1 pogpio0adc0pa2 pogpio0adc0pa3 pogpio0adc0pa6 pogpio0adc0pa7 pogpio0adc0analogcomp pogpio0adc0analogcomp0pa4 pogpio0adc0analogcomp0pa5 pogpio0adc0dac pogpio0adc0dac0pb2 pogpio0adc0dac0pb3 point0pwm0gpio point0pwm0gpio0pf1 point0pwm0gpio0pf2 point0pwm0gpio0pf3 pojtag pojtag0nrst pojtag0pb4 pojtag0pb5 pojtag0pb6 pojtag0pb7 popdi0gpio popdi0gpio0pdi popdi0gpio0pe4 popdi0gpio0pe5 popdi0gpio0pf0 pospi interface pospi interface0pd4 pospi interface0pd5 pospi interface0pd6 pospi interface0pd7 potrx0i0f potrx0i0f0clkm potrx0i0f0slp0tr potrx0i0f0trx0dig2 potrx0i0f0trx0irq potrx0i0f0trx0miso potrx0i0f0trx0mosi potrx0i0f0trx0nrst potrx0i0f0trx0nsel potrx0i0f0trx0sck potwi potwi0pe0 potwi0pe1 potwi0pe2 potwi0pe3 pouart0usart pouart0usart0pd1 pouart0usart0pd2 pouart0usart0pd3 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 d d c c b b a a * xmega_233_mcu.schdoc 3 4 4/5/2013 4:38:23 pm atzb-x0-256-3-0-c atmel india rmz millenia mgr road chennai page: of title: document number: revision: 4 date: ojs msk * vcc_3v3 gnd gnd gnd vcc_3v3 vcc_3v3 n r s t pc0_trx_nrst vcc_3v3 vcc_3v3 nrst gnd gnd gnd vcc_3v3 vcc_3v3 i pcb rule i pcb rule p d 3 _ t x d 0 p d 1 _ x c k 0 pe4_sync_oc1a pa5 pa4 pb3 pb2 pa6 pa7 pa3_adc3_i nt p a 0 _ a d c 0 _ i n t p a 1 _ a d c 1 _ i n t p a 2 _ a d c 2 _ i n t pb6_tck_i nt pb7_tdo_i nt pb5_tdi _i nt pb4_tms_i nt p d 4 _ s s p d 5 _ m o s i _ x c k 1 pe5_oc1b_i nt pf1_oc0b_i nt_xck0 pf2_oc0c_i nt_rxd0 p f 3 _ o c 0 d _ i n t _ t x d 0 p c 1 _ t r x _ d i g 2 p c 2 _ t r x _ i r q p c 3 _ t r x _ s l p _ t r p c 4 _ t r x _ s p i _ s s p c 7 _ t r x _ s p i _ s c k p c 5 _ t r x _ s p i _ m o s i p c 6 _ t r x _ s p i _ m i s o tosc1 tosc2 trx_nsel trx_sck trx_mosi trx_mi so trx_nrst trx_i rq trx_di g2 sl p_tr cl km trx_i /f pc4_trx_spi _ss pc7_trx_spi _sck trx_i/f pc5_trx_spi _mosi pc6_trx_spi _mi so pc1_trx_di g2 pc2_trx_i rq pc3_trx_sl p_tr pc0_trx_nrst tosc1 tosc2 10 pf c200 10 pf c207 100k r200 usbd_p u s b d _ n fc- 135 32.768 k hz xc200 an_vcc_3v3 vcc_3v3 bl m15bb221sn1 l 200 gnd gnd gnd gnd vcc_3v3 gnd gnd_rf bl m15bb221sn1 l 201 gnd 1 0 0 n c 2 0 2 1 0 0 n c 2 0 3 1 0 0 n c 2 0 4 1 0 0 n c 2 0 5 + 4 . 7 u f / 1 0 v c 2 0 1 gnd 100n c208 gnd 1 0 0 n c 2 0 6 gnd vcc_3v3 pa7(adca7/aca7) 5 pb0(adcb0/acb0/arefb) 6 pb1(adcb1/acb1) 7 pb2(adcb2/acb2/dacb0) 8 pb3(adcb3/acb3/dacb1) 9 pb4(adcb4/acb4/tms) 10 p c 4 ( s s / o c 1 a / o c 0 c l s ) 2 0 p c 5 ( x c k 1 / m o s i / o c 1 b / o c 0 c h s ) 2 1 p c 6 ( r x d 1 / m i s o / o c 0 d l s ) 2 2 p c 7 ( t x d 1 / s c k / o c 0 d h s ) 2 3 p d 1 ( x c k 0 / o c 0 b ) 2 7 p d 0 ( o c 0 a ) 2 6 p d 3 ( t x d 0 / o c 0 d ) 2 9 p d 4 ( s s / o c 1 a ) 3 0 p d 5 ( m o s i / x c k 1 / o c 1 b ) 3 1 p d 6 ( m i s o / r x d 1 / d - ) 3 2 (d+/txd1/sck)pd7 33 g n d 2 4 v c c 2 5 (oc0a)pf0 46 (oc0b/xck0)pf1 47 (oc0c/rxd0)pf2 48 ( o c 0 d / t x d 0 ) p f 3 4 9 ( o c 0 a ) p f 4 5 0 p f 5 5 1 p f 6 5 4 p f 7 5 5 vcc 45 gnd 44 ( a c a 2 / a d c a 2 ) p a 2 6 4 ( a c a 1 / a d c a 1 ) p a 1 6 3 ( a r e f a / a c a 0 / a d c a 0 ) p a 0 6 2 a v c c 6 1 g n d 6 0 ( x t a l 1 ) p r 1 5 9 ( x t a l 2 ) p r 0 5 8 p d i _ c l k / r e s e t 5 7 pa3(adca3/aca3) 1 pa4(adca4/aca4) 2 pa5(adca5/aca5) 3 pa6(adca6/aca6) 4 pb5(adcb5/acb5/tdi) 11 pb6(adcb6/acb6/tck) 12 pb7(adcb7/acb7/tdo) 13 gnd 14 vcc 15 pc0(sda/oc0a/oc0als) 16 p c 1 ( s c l / x c k 0 / o c 0 b / o c 0 a h s ) 1 7 p c 2 ( r x d 0 / o c 0 c / o c 0 b l s ) 1 8 p c 3 ( t x d 0 / o c 0 d / o c 0 b h s ) 1 9 gnd 34 vcc 35 p d 2 ( r x d 0 / o c 0 c ) 2 8 (oc0a/sda)pe0 36 (oc0b/xck0/scl)pe1 37 (oc0c/rxd0)pe2 38 (oc0d/txd0)pe3 39 (oc1a)pe4 40 (oc1b)pe5 41 pe6 42 pe7 43 v c c 5 3 g n d 5 2 p d i _ d a t a 5 6 p a d _ g n d 6 5 atx m eg a256a3u- mh u200 gnd pf1 pf2 pf3 i nt/pwm/gpi o pe2 pe1 pe3 pe0 twi pb5 pb4 pb6 pb7 nrst jtag pd2 pd1 pd3 uart/usart pe1_scl pe2_async pe3_gpi o pb4_tms_i nt pb5_tdi _i nt pb6_tck_i nt pb7_tdo_i nt pd1_xck0 pf1_oc0b_i nt_xck0 pf2_oc0c_i nt_rxd0 pf3_oc0d_i nt_txd0 jtag int/pwm/gpio pd4 pd5 pd6 pd7 spi i nterface pa0 pa1 pa2 pa3 pa6 pa7 aref gpi o/adc pb2 pb3 gpi o/adc/dac pa4 pa5 gpi o/adc/anal og comp pd4_ss pd5_mosi _xck1 usbd_n usbd_p pa0_adc0_i nt pa1_adc1_i nt pa2_adc2_i nt pa3_adc3_i nt pa6 pa7 pb2 pb3 pa4 pa5 gpio/adc/analogcomp gpio/adc/dac gpio/adc spi interface nrst p d 2 _ r x d 0 pe4_sync_oc1a pe5_oc1b_i nt pb0_aref_i nt pb0_aref_i nt pf0 pdi _data pf0 p d i _ d a t a twi pf0 pdi pe4 pe5 pdi /gpi o pdi/gpio pe1_scl pe2_async pe3_gpi o c l k m cl km pe0_sda pd2_rxd0 pd3_txd0 uart/usart pe0_sda place x tal circuit closer to mcu. i solate f rom dig ital sig nals. place de- coupling closer to mcu place 4.7uf closer to vcc input f or m odule
pia101 pia102 pia103 pia104 coa1 pib10001 pib10002 pib10003 pib10004 pib10005 pib10006 cob100 pic101 pic102 coc1 pic201 pic202 coc2 pic301 pic302 coc3 pic401 pic402 coc4 pic801 pic802 coc8 pic901 pic902 coc9 pic1001 pic1002 coc10 pic1101 pic1102 coc11 pij101 pij102 pij103 pij104 coj1 pil101 pil102 col1 pil201 pil202 col2 piq101 piq102 piq103 piq104 coq1 pir101 pir102 cor1 piu101 piu102 piu103 piu104 piu105 piu106 piu107 piu108 piu109 piu1010 piu1011 piu1012 piu1013 piu1014 piu1015 piu1016 piu1017 piu1018 piu1019 piu1020 piu1021 piu1022 piu1023 piu1024 piu1025 piu1026 piu1027 piu1028 piu1029 piu1030 piu1031 piu1032 piu1033 cou1 potrx0i0f potrx0i0f0clkm potrx0i0f0slp0tr potrx0i0f0trx0dig2 potrx0i0f0trx0irq potrx0i0f0trx0miso potrx0i0f0trx0mosi potrx0i0f0trx0nrst potrx0i0f0trx0nsel potrx0i0f0trx0sck 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 d d c c b b a a * xmega_233_rf.schdoc 4 4 4/5/2013 4:38:23 pm atzb-x0-256-3-0-c atmel india rmz millenia mgr road chennai page: of title: document number: revision: 4 date: ojs msk * irq nsel mosi sclk miso slp_tr reset_n dig2 trx_i/f trx_nsel trx_sck trx_mosi trx_mi so trx_nrst trx_i rq trx_di g2 sl p_tr cl km trx_i /f clkm i pcb rule i pcb rule gnd_rf gnd reset_n slp_tr dig3 dig4 irq nsel mosi sclk miso dig2 dig1 gnd gnd dig4 2 avss 3 rfp 4 rfn 5 avss 6 dvss 7 rstn 8 d i g 1 9 d i g 2 1 0 s l p _ t r 1 1 d v s s 1 2 d v d d 1 3 d v d d 1 4 d e v d d 1 5 d v s s 1 6 clkm 17 dvss 18 sclk 19 miso 20 dvss 21 mosi 22 sel 23 irq 24 x t a l 2 2 5 x t a l 1 2 6 a v s s 2 7 e v d d 2 8 a v d d 2 9 a v s s 3 0 a v s s 3 1 a v s s 3 2 a t 8 6 r f 2 3 3 m l f 3 2 dig3 1 d i e 3 3 at86rf233- z u u1 gnd gnd_rf gnd_rf gnd_rf gnd_rf gnd gnd_rf vcc_3v3 an_vcc_3v3 gnd_rf gnd_rf gnd 2.2 pf c3 100n c9 1 0 0 n c 1 1uf c10 1 u f c 2 10 pf c8 10 pf c11 gnd_rf gnd_rf gnd_rf gnd_rf 50ohm 1 g n d 2 bal 3 bal 4 g n d 5 g n d 6 2450bm15a0015e b100 rf_p rf_n gnd_rf 680r r1 clkm rf_in 1 rf_out 2 g n d 3 g n d 4 ms147 j1 feed point 1 nc 2 3 4 2450at42b100 a1 1 3 2 4 16.0mhz q1 3.3nh l 2 3.3nh l 1 3 pf c4 place de- coupling closer to trx place de- coupling closer to trx place x tal circuit closer to trx . i solate f rom dig ital sig nals. tune the v alues f or antenna m atching
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 17 4.1 handling instructi o ns the zigbit modules are fixed with an emi shield to ensure compliance to emission and immunity rules. this shield is galvanic and not air tight. so cleaning of the module with ipa / other similar agents is not advised. humidity protection coating (conformal) will cause deviated rf behavior and coating material being trapped inside emi shield. so this should be avoided. for products requiring conformal coating, it is advised to suitably mask the zigbit before applying the coating to rest of the zigbit carrier board. to protect zigbit from humidity, the housing of the product should ensure suitable ingress protection standards are complied with. the ms - 147 connector should never be exposed to v ar nish / similar conformal coating material which will affect electrical connection on the surfaces of connector. the in - built chip antenna has been tuned for the particular design 4.2 general r ecommendations ? metal enclosure should not be used. using low profile enclosure might also affect antenna tuning ? placing high profile components next to antenna should be avoided ? having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges also distorting antenna pattern ? zigbit module should not be placed next to consumer electronics which might interfere with zigbit rf frequency band 5. persistence memory a dedicated memory space is allocated to store product specific information and called the persistence memory. the organi zation of the persistence memory is as follows: table 5 -1. persistence memory data size structure revision 2 bytes mac address (1) 8 bytes board information overall 49 bytes board information ? pcba name 30 bytes board information ? pcba serial number 10 bytes board information ? pcba atmel part number 8 bytes board information ? pcba revision 1 byte reserved 3 bytes x tal calibration value 1 byte reserved 7 bytes reserved 4 bytes crc 2 byte s in atzb - x0 - 256 -3-0- c, the persistence memory is stored in user signature row of atxmega256a3u microcontroller starting from address 0x0000. this section is not erased by chip erase and requires a dedicated erase command.
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 18 the user signature row is a separate memory section that is fully accessibl e (read and write) from application software and external programmers. see section ?read user signature row / production signature row? under section ? nvm flash commands ? in xmega au manual [1] for details in reading the user signature data from application software note: 1. the mac address stored inside the mcu is a uniquely assigned id for each zigbit and owned by atmel. user of the zigbit application can use this unique mac id to address the zigbit in end - applications. the mac id can be read from the zigbit using the performance analyzer application that is supplied through atmel studio gallery extension.
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 19 6. ordering i nformation part number description atzb - x0 -256 -3-0-c 2.4ghz ieee802.15.4/zigbee oem module based on atxmega256a3u mcu and at86rf233 transceiver with ms - 147 test connector and chip antenna, single unit atzb - x0 -256 -3-0-cr (1) 2.4ghz ieee802.15.4/zigbee oem module based on atxmega256a3u mcu and at86rf233 transceiver w ith ms - 147 test connector and chip antenna, tape & reel note: 1. tape and reel quantity: 200 .
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 20 7. agency certifications 7.1 united states (fcc) this equipment complies with part 15 of the fcc rules and regulations. to fulfill fcc certification requirements, an oem man ufacturer must comply with the following regulations: 1. the atzb - x0 - 256 -3-0- c modular transmitter must be labeled with its own fcc id number, and, if the fcc id is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. this exterior label can use wording such as the following: contains fcc id: vw4a09173 1 the enclosed device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (i.) this device may not cause harmful interference and (ii.) this device must accept any interference received, including interference that may cause undesired operation. any similar wording that expresses the same meaning may be used. important : this equipment complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation (fcc 15.19). the internal antenna used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons and must not be colocated or operating in conjunction with any other antenna or transmitter. installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying rf exposure compliance. this device is approved as a mobile device with respect to rf exposure compliance, and may only be marketed to oem installers. use in portable exposure conditions (fcc 2.1093) requires separate equipment authorization. important : modifications not expressly approved by this company could void the user's authority to operate this equipm ent (fcc section 15.21). important : this equipment has been tested and found to comply with the limits for a class a digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interfere nce when the equipment is operated in a commercial environment. this equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense (fcc section 15.105).
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 21 7.2 european union (etsi) the atzb - x0 - 256 -3-0- c modu le has been certified for use in european union countries. if these modules are incorporated into a product, the manufacturer must ensure compliance of the final product to the european harmonized emc and lowvoltage/safety standards. a declaration of conformity must be issued for each of these standards and kept on file as described in annex ii of the r&tte directive. furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user manual. if any of these specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all required st andards. important : the 'ce' marking must be affixed to a visible location on the oem product. the ce mark shall consist of the initials "ce" taking the following form: the ce marking must have a height of at least 5mm except where this is not possible on account of the nature of the apparatus. the ce marking must be affixed visibly, legibly, and indelibly. more detailed information about ce marking requirements you can find at "directive 1999/5/ec of the european parliament and of the council" on 9 march 1 999 at section 12. 7.3 industry canada (ic) compliance statements this device complies with industry canada licence - exempt rss standard(s). operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. le prsent appareil est conforme aux cnr d'industrie canada applicables aux appareils radio exempts de licence. l'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. this equipment complies with radio frequency exposure limits set forth by industry canada for an uncontrolled environment. this equipment should be installed and operated with minimum distance 20 cm between the device and the user or bystanders. cet quipement est conforme aux limites d'exposition aux radiofrquences dfinies par industrie canada pour un environnement non contr?l. cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre le dispositif et l'utilisateur ou des tiers caution: a ny changes or modifications not expressly approved by the party responsible for compliance could void the user?s authority to operate the equipment. the oem integrator is still responsible for testing their end - product for any additional compliance requirements required with this module installed (for example, digital device emissions, pc peripheral requirements, etc.). this module is labelled with its own ic id. if the ic id certification number is not visible while installed inside another device, then the device should display the label on it referring the enclosed module. in that case, the final end product must be labelled in a visible area with the following: ?contains transmitter module ic:11019a - 091731? or ?contains ic: 11019a - 091731 ?
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 22 ce module est tiquet avec son propre id ic. si le numro de certification ic id n'est pas visible lorsqu'il est install l'intrieur d'un autre appareil, l'appareil doit afficher l'tiquette sur le module de rfrence ci - joint. dans ce cas, le produit final doit tre tiquet dans un endroit visible par le texte suivant: ?contains transmitter module ic: 11019a - 091731? or ?contains ic: 11019a - 091731 ?
atzb - x0 - 256 -3-0-c zigbit 2.4gh z wireless modules [ datasheet ] 42172b ? wireless ? 03/201 4 23 8. r evision h istory doc. rev. date comments 42172 b 04 /201 4 removed a table note below table 3 -8 42172a 11/2013 initial revision.
atmel corporation 1600 technology drive san jose, ca 95110 usa tel: (+1)(408) 441 - 0311 fax: (+1)(408) 487 - 2600 www.atmel.com atmel asia limited unit 01 - 5 & 16, 19f bea tower, millennium city 5 418 kwun tong road kwun tong, kowloon hong kong tel: (+852) 2245 - 6100 fax: (+852) 2722 - 1369 atmel munich gmbh business campus parkring 4 d - 85748 garching b. munich germany tel: (+49) 89 - 31970 -0 fax: (+49) 89 - 3194621 atmel japan g.k. 16f shin - osaki kangyo building 1 -6- 4 osaki , shinagawa-ku tokyo 141 - 0032 japan tel: (+81)(3) 6417 - 0300 fax: (+81)(3) 6417 - 03 70 ? 201 4 atmel corporation. all rights reserved. / rev.: 42172b ? wireless ? 03/2014 atmel ? , atmel logo and combinations thereof , enabling unlimited possibilities ? , avr ? , zigbit ? , xmega ? , and others are registered trademarks or trademarks of atmel corporation or its subsidiaries. other terms and product names may be trademarks of others. disclaimer: the information in this document is provided in connection with atmel products. no license, express or implied, b y estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of atmel pro ducts. except as set forth in the atmel terms and conditions of sales located on the atmel website, atmel assumes no liability whatsoever and disclaims any express, implied or statutory warranty relating to its products including, but not limited to, the i mplied warranty of merchantability, fitness for a particular purpose , or non - infringement. in no event shall atmel be liable for any direct, indirect, consequential, punitive, special or incidental damages (including, without limitation, damages for loss a nd profits, business interruption, or loss of information) arising out of the use or inability to use this document, even if atmel has been advised of the possibility of s uch damages. atmel makes no representations or warranties with respect to the accurac y or completeness of the contents of this document and reserves the right to make changes to specifications and products desc riptions at any time without notice. atmel does not make any commitment to update the information contained herein. unless specific ally provided otherwise, atmel products are not suitable for, and shall not be used in, automotive applications. atmel products are not intended, authorized, or warranted for use as components in applications inte nded to support or sustain life.

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