View CBTL03062BS_6912845.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1. general description the cbtl03062 is a three-channel (?tri?) multiplexer for displayport gen2 applications. it provides one differential channel capable of switching or multiplexi ng (bidirectional and ac-coupled) displayport 1.2 fast aux si gnal, using high-bandwidth pass-gate technology. additionally, it provid es for switching/mult iplexing of the hot plug detect signal as well as the ddc (direct display control) signals, for a total of three channels. a typical application of cbtl03062 is on motherboards where one of two gpu display sources needs to be selected to connect to a display sink device or connector. a controller chip selects which path to use by setting a select signal high or low. due to the non-directional nature of the signal paths (which use high-bandwidth pass-gate technology), the cbtl03062 can also be used in the reverse topology, e.g., to connect one display source device to one of two display sink devices or connectors. cbtl03062 high-performance displayport tri multiplexer rev. 1 ? 25 november 2010 product data sheet fig 1. cbtl03062 application example cbtl03062 002aaf66 5 aux+ aux ? aux1+ aux1 ? aux2+ aux2 ? +3.3 v 2 k 2 : 1 mux gpu1 ddc_clk1 ddc_dat1 2 : 1 mux ddc_clk2 ddc_dat2 2 : 1 mux hpd_1 hpd_2 sel, xsd_n gpu2 ddc_clk ddc_dat hpd gnd +3.3 v 100 k 100 k displayport connector
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 2 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer 2. features and benefits ? 1 : 2 multiplexing of displayport signals ? 1 high-speed differential channel for faux ? 1 channel for ddc clock and data ? 1 channel for hpd ? high-bandwidth analog pass-gate technology ? very low intra-pair differ ential skew (5 ps typical) ? switch/mux position select ? shutdown mode cmos input ? shutdown mode minimizes power consumpt ion while switching all channels off ? very low operation current of 0.2 ma typical ? very low shutdown current of < 10 a ? single 3.3 v power supply ? esd 4 kv hbm, 1 kv cdm ? available in 4 mm 4 mm hvqfn20 package 3. applications ? motherboard applications requiring displayport switching/multiplexing ? docking stations ? notebook computers 4. ordering information [1] total height after printed-circ uit board mounting = 1 mm (maximum). table 1. ordering information type number package name description version CBTL03062BS hvqfn20 plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 4 4 0.85 mm [1] sot917-1
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 3 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer 5. functional diagram 6. pinning information 6.1 pinning fig 2. functional diagram 002aaf6 68 aux+ aux ? aux1+ aux1 ? aux2+ aux2 ? 2 : 1 mux ddc_clk1 ddc_dat1 2 : 1 mux ddc_clk2 ddc_dat2 2 : 1 mux hpd_1 hpd_2 sel, xsd_n ddc_clk ddc_dat hpd fig 3. pin configuration for hvqfn20 002aaf669 CBTL03062BS transparent top view ddc_dat1 hpd sel ddc_clk1 ddc_dat aux2 ? ddc_clk aux2+ aux ? xsd_n v dd hpd_2 ddc_dat2 ddc_clk2 hpd_1 aux+ gnd v dd aux1+ aux1 ? 511 412 313 214 115 6 7 8 9 10 20 19 18 17 16 terminal 1 index area
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 4 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer 6.2 pin description [1] hvqfn20 package die supply ground is connected to both gnd pin and exposed center pad. gnd pin and the exposed center pad must be connected to s upply ground for proper device operation. for enhanced thermal, electrical, and board level performance, t he exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the printed-circuit board in the thermal pad region. table 2. pin description symbol pin type description sel 5 3.3 v cmos single-ended input selects between two mult iplexer/switch paths. xsd_n 15 3.3 v cmos single-ended input shutdown pin. should be driven high or connected to v dd for normal operation. when low, all paths are switched off (non-conducting high-impedance state), and supply current consumption is minimized. aux+ 20 differential i/o high-speed differential pair for aux signals, right-side. aux ? 1 differential i/o ddc_clk 2 differential i/o pair of single-ended terminals for ddc clock and data signals, right-side. ddc_dat 3 differential i/o hpd 4 single-ended i/o single-ended channel for the hpd signal, right-side. aux1+ 17 differential i/o high-speed differential pair for aux signals, path 1, left-side. aux1 ? 16 differential i/o aux2+ 14 differential i/o high-speed differential pair for aux signals, path 2, left-side. aux2 ? 13 differential i/o ddc_clk1 12 differential i/o pair of single-ended terminals for ddc clock and data signals, path 1, left-side. ddc_dat1 11 differential i/o ddc_clk2 9 differential i/o pair of single-ended terminals for ddc clock and data signals, path 2, left-side. ddc_dat2 8 differential i/o hpd_1 10 single-ended i/o single-ended channel for the hpd signal, path 1, left-side. hpd_2 7 single-ended i/o single-ended channel for the hpd signal, path 2, left-side. v dd 6, 18 power supply 3.3 v power supply. gnd [1] 19 ground ground.
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 5 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer 7. functional description refer to figure 2 ? functional diagram ? . the cbtl03062 uses 3.3 v power supply. all signal paths are implemented using high-bandwidth pass-gate technology, are bidirectional and no clock or reset signal is needed for the multiplexer to function. the switch position is selected using the sele ct signal (sel). the detailed operation is described in section 7.1 . 7.1 mux select (sel) function the internal multiplexer switch position is controlled by the logic inputs sel as described below. 7.2 shutdown function the cbtl03062 provides a shutdown function to minimize power consumption when the application is not active but power to the cbtl03062 is provided. pin xsd_n (active low) puts all channels in off mode (non-conducting high-impedance state) while reducing current consumption to near-zero. table 3. mux select control sel path 2 path 1 0 high-impedance active 1 active high-impedance table 4. shutdown function xsd_n state 0 shutdown 1 active
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 6 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer 8. limiting values [1] human body model: ansi/eos/esd-s5.1-1994, standard for esd sensitivity testing, human body model - component level; electrostatic disc harge association, rome, ny, usa. [2] charged-device model: ansi/eos/esd-s5.3-1- 1999, standard for esd sensitivity testing, charged-device model - component level; electr ostatic discharge association, rome, ny, usa. 9. recommended operating conditions table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v dd supply voltage ? 0.3 +5 v t case case temperature for operation within specification ? 40 +85 c v esd electrostatic discharge voltage hbm [1] - 4000 v cdm [2] - 1000 v table 6. recommended operating conditions symbol parameter conditions min typ max unit v dd supply voltage 3.0 3.3 3.6 v v i input voltage - - 3.6 v t amb ambient temperature operating in free air ? 40 - +85 c
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 7 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer 10. characteristics 10.1 general characteristics 10.2 aux channel characteristics 10.3 ddc ports table 7. general characteristics symbol parameter conditions min typ max unit i dd supply current operating mode (xsd_n = high); v dd =3.3v - 0.2 1 ma shutdown mode (xsd_n = low); v dd = 3.3 v - - 10 a p tot total power dissipation operating mode (xsd_n = high); v dd = 3.3 v - - 5 mw t startup start-up time supply voltage valid or xsd_n going high to channel specified operat ing characteristics --10 s t rcfg reconfiguration time sel state change to channel specified operating characteristics --1 s table 8. aux channel characteristics symbol parameter conditions min typ max unit v i input voltage ? 0.3 - +2.6 v v ic common-mode input voltage 0 - 2.0 v v id differential input voltage peak-to-peak - - +1.4 v ddil differential insertion loss channel is on; f = 100 mhz - ? 0.8 - db channel is on; f = 2.5 ghz - ? 3- db channel is off; 0 hz f 1.0 ghz - - ? 30 db ddrl differential return loss channel is on; 0 hz f 1.0 ghz - - ? 10 db ddnext differential near-end crosstalk adjacent channels are on; 0hz f 1.0 ghz -- ? 40 db b bandwidth ? 3.0 db intercept - 2.5 - ghz t pd propagation delay from left-side port to right-side port or vice versa -100-ps t sk(dif) differential skew time intra-pair - 5 - ps table 9. ddc port characteristics symbol parameter conditions min typ max unit v i input voltage ? 0.3 - v dd v t pd propagation delay from left-side port to right-side port or vice versa -100- ps
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 8 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer 10.4 hpd input, hpd output [1] low-speed input changes state on cable plug/unplug. 10.5 mux select input 11. test information 11.1 switch test fixture requirements the test fixture for switch s-parameter me asurement shall be designed and built to specific requirements, as described belo w, to ensure good measurement quality and consistency. ? the test fixture shall be a fr4-based pcb of the microstrip structure; the dielectric thickness or stack-up shall be about 4 mils. ? the total thickness of the test fi xture pcb shall be 1.57 mm (0.62 in). ? the measurement signals shall be launched into the switch from the top of the test fixture, capturing the through-hole stub effect. ? traces between the dut and measurement ports (sma or microprobe) should be uncoupled from each other, as much as possible. therefore, the traces should be routed in such a way that traces will diver ge from each other exiting from the switch pin field. ? the trace lengths between the dut and me asurement port shall be minimized. the maximum trace length shall not exceed 1000 mils. the trace lengths between the dut and measurement port shall be equal. ? all of the traces on the test board and add- in card must be held to a characteristic impedance of 50 with a tolerance of 7%. ? sma connector is recommended for ease of use. the sma launch structure shall be designed to minimize the connection discontinuity from sma to the trace. the impedance range of the sma seen from a tdr with a 60 ps rise time should be within 50 ? 7 . table 10. hpd input and output characteristics symbol parameter conditions min typ max unit v i input voltage [1] ? 0.3 - 3.6 v t pd propagation delay from left-side port to right-side port or vice versa - 100 - ps table 11. sel, xsd_n input characteristics symbol parameter conditions min typ max unit v ih high-level input voltage sel, xsd_n 2.0 - 3.6 v v il low-level input voltage sel, xsd_n 0 - 0.8 v i li input leakage current measured with input at v ih(max) and v il(min) --10 a
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 9 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer 12. package outline fig 4. package outline hvqfn20 (sot917-1) 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 4.1 3.9 d h 2.45 2.15 y 1 4.1 3.9 2.45 2.15 e 1 2 e 2 2 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot917 -1 mo-220 - - - - - - 0.6 0.4 l 0.1 v 0.05 w 0 2.5 5 mm scale sot917 -1 h vqfn20: plastic thermal enhanced very thin quad flat package; no leads; 2 0 terminals; body 4 x 4 x 0.85 mm a (1) max. 05-10-08 05-10-31 e (1) d (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. y y 1 c x c d e b a terminal 1 index area e l e h d h e e 1 b 610 20 16 15 11 5 1 e 2 a c c b v m w m terminal 1 index area detail x a a 1 c
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 10 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer 13. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 13.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 13.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 13.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 11 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer 13.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 5 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and coolin g down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 1 2 and 13 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 5 . table 12. snpb eutectic process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 < 2.5 235 220 2.5 220 220 table 13. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 12 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 14. abbreviations msl: moisture sensitivity level fig 5. temperature profiles for large and small components 001aac84 4 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 14. abbreviations acronym description aux auxiliary channel in displayport definition cdm charged-device model cmos complementary metal-oxide semiconductor ddc direct display control dp displayport dut device under test esd electrostatic discharge faux fast aux gpu graphics processor unit hbm human body model hpd hot plug detect i/o input/output mux multiplexer pcb printed-circuit board sma subminiature, version a (connector) tdr time-domain reflectometry
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 13 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer 15. revision history table 15. revision history document id release date data sheet status change notice supersedes cbtl03062 v.1 20101125 product data sheet - -
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 14 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
cbtl03062 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 25 november 2010 15 of 16 nxp semiconductors cbtl03062 high-performance displayport tri multiplexer non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors cbtl03062 high-performance displayport tri multiplexer ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 25 november 2010 document identifier: cbtl03062 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 2 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 5 7.1 mux select (sel) function . . . . . . . . . . . . . . . . 5 7.2 shutdown function . . . . . . . . . . . . . . . . . . . . . . 5 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 recommended operating conditions. . . . . . . . 6 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 10.1 general characteristics . . . . . . . . . . . . . . . . . . . 7 10.2 aux channel characteristics. . . . . . . . . . . . . . . 7 10.3 ddc ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 10.4 hpd input, hpd output. . . . . . . . . . . . . . . . . . . 8 10.5 mux select input . . . . . . . . . . . . . . . . . . . . . . . 8 11 test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 11.1 switch test fixture requirements . . . . . . . . . . . . 8 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 soldering of smd packages . . . . . . . . . . . . . . 10 13.1 introduction to soldering . . . . . . . . . . . . . . . . . 10 13.2 wave and reflow soldering . . . . . . . . . . . . . . . 10 13.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 10 13.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 11 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 14 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 17 contact information. . . . . . . . . . . . . . . . . . . . . 15 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

▲Up To Search▲

Price & Availability of CBTL03062BS

	To Download CBTL03062BS Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .