? semiconductor components industries, llc, 2005 september, 2005 ? rev. 3 1 publication order number: nup4301mr6t1/d nup4301mr6t1 low capacitance diode array for esd protection in four data lines nup4301mr6t1 is a microintegration device designed to provide protection for sensitive components from possible harmful electrical transients; for example, esd (electrostatic discharge). features ? low capacitance (1.5 pf maximum between i/o lines) ? single package integration design ? provides esd protection for jedec standards jesd22 machine model = class c human body model = class 3b ? protection for iec61000?4?2 (level 4) 8.0 kv (contact) 15 kv (air) ? ensures data line speed and integrity ? fewer components and less board space ? direct the transient to either positive side or to the ground ? pb?free package is available applications ? usb 1.1 and 2.0 data line protection ? t1/e1 secondary ic protection ? t3/e3 secondary ic protection ? hdsl, idsl secondary ic protection ? video line protection ? microcontroller input protection ? base stations ? i 2 c bus protection maximum ratings (each diode) (t j = 25 c unless otherwise noted) rating symbol value unit reverse voltage v r 70 vdc forward current i f 200 madc peak forward surge current i fm(surge) 500 madc repetitive peak reverse voltage v rrm 70 v average rectified forward current (note 1) (averaged over any 20 ms period) i f(av) 715 ma repetitive peak forward current i frm 450 ma non?repetitive peak forward current t = 1.0 s t = 1.0 ms t = 1.0 s i fsm 2.0 1.0 0.5 a maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. fr?5 = 1.0 0.75 0.062 in. marking diagram 64 = device code m = date code* = pb?free package http://onsemi.com device package shipping ? ordering information nup4301mr6t1 tsop?6 3000/tape & ree l NUP4301MR6T1G tsop?6 (pb?free) 3000/tape & ree l ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. 64m 1 6 i/o 5 v p 4 i/o i/o 1 v n 2 1/o 3 pin configuration and schematic tsop?6 case 318f plastic 1 6 2 5 3 4 (note: microdot may be in either location. *date code orientation may vary depending upon manufacturing location.
nup4301mr6t1 http://onsemi.com 2 thermal characteristics characteristic symbol max unit thermal resistance, junction?to?ambient r ja 556 c/w lead solder temperature, maximum 10 seconds duration t l 260 c junction temperature t j ?40 to +85 c storage temperature t stg ?55 to +150 c electrical characteristics (t j = 25 c unless otherwise noted) (each diode) characteristic symbol min typ max unit off characteristics reverse breakdown voltage (i (br) = 100 a) v (br) 70 ? ? vdc reverse voltage leakage current (v r = 70 vdc) (v r = 25 vdc, t j = 150 c) (v r = 70 vdc, t j = 150 c) i r ? ? ? ? ? ? 2.5 30 50 adc capacitance (between i/o pins) (v r = 0 v, f = 1.0 mhz) c d ? 0.8 1.5 pf capacitance (between i/o pin and ground) (v r = 0 v, f = 1.0 mhz) c d ? 1.6 3 pf forward voltage (i f = 1.0 madc) (i f = 10 madc) (i f = 50 madc) (i f = 150 madc) v f ? ? ? ? ? ? ? ? 715 855 1000 1250 mv dc 2. alumina = 0.4 0.3 0.024 in. 99.5% alumina. 100 0.2 0.4 v f , forward voltage (volts) 0.6 0.8 1.0 1.2 10 1.0 0.1 t a = 85 c 10 0 v r , reverse voltage (volts) 1.0 0.1 0.01 0.001 10 20 30 40 50 1.75 0 v r , reverse voltage (volts) 1.5 1.25 1.0 0.75 c d , diode capacitance (pf) 2468 i f , forward current (ma) figure 1. forward voltage figure 2. leakage current figure 3. capacitance t a = ?40 c t a = 25 c t a = 150 c t a = 125 c t a = 85 c t a = 55 c t a = 25 c i r , reverse current ( a) curves applicable to each cathode
nup4301mr6t1 http://onsemi.com 3 package dimensions tsop?6 case 318f?05 issue l 23 4 5 6 d 1 e b e a1 a 0.05 (0.002) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 318f?01, ?02, ?03 obsolete. new standard 318f?04. c l h e dim a min nom max min millimeters 0.90 1.00 1.10 0.035 inches a1 0.01 0.06 0.10 0.001 b 0.25 0.37 0.50 0.010 c 0.10 0.18 0.26 0.004 d 2.90 3.00 3.10 0.114 e 1.30 1.50 1.70 0.051 e 0.85 0.95 1.05 0.034 0.20 0.40 0.60 0.008 0.039 0.043 0.002 0.004 0.015 0.020 0.007 0.010 0.118 0.122 0.059 0.067 0.037 0.041 0.016 0.024 nom max 2.50 2.75 3.00 0.099 0.108 0.118 h e ? ? l 0 10 0 10 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.95 0.037 1.9 0.075 mm inches scale 10:1 1.0 0.039 2.4 0.094 0.7 0.028 0.95 0.037
nup4301mr6t1 http://onsemi.com 4 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 nup4301mr6t1/d microintegration is a trademarks of semiconductor components industries, llc (scillc). literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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