? 2000 california micro devices corp. all rights reserved. 6/2/2000 215 topaz street, milpitas, california 95035 tel: (408) 263-3214 fax: (408) 263-7846 www.calmicro.com 1 california micro devices ncc bussed resistor network california micro devices resistor arrays are the hybrid equivalent to the bussed resistor networks available in surface-mount packages. the resistors are spaced on ten mil centers resulting in reduced real estate. these c0970500 standard network schematic diagram chips are manufactured using advanced thin film processing techniques and are 100% electrically tested and visually inspected. r1 r4 r2 r5 r7 r3 r6 r8 60 90 n o i t a n g i s e d r e b m u n t r a p c c n 3 0 0 5fa g w p s e i r e se u l a ve c n a r e l o tr c ts d a p d n o bg n i k c a b o i t a r e c n a r e l o t e r a s t i g i d 3 t s r i f% 5 . 0 = dm p p 0 0 1 = r e t t e l o nd l o g = gd l o g = w% 1 = r e t t e l o n . e u l a v t n a c i f i n g i s% 1 = fm p p 0 5 = am u n i m u l a = r e t t e l o nd e p p a l = l% 5 . 0 = p - s e r p e r t i g i d t s a l% 2 = gm p p 5 2 = br e h t i e = r e t t e l o n f o r e b m u n s t n e s% 5 = j s e t a c i d n i r . s o r e z% 0 1 = k . t n i o p l a m i c e d% 0 2 = m s n o i t a c i f i c e p s l a c i r t c e l e r e t e m a r a p s n o i t i d n o c t s e t r c tc 5 2 1 o t c 5 5 Cc / m p p 0 0 1 x a m e g a t l o v g n i t a r e p oc 5 2 1 o t c 5 5 Cc d v 0 5x a m ) r o t s i s e r r e p ( g n i t a r r e w o p ) c 0 5 1 @ 0 o t y l r a e n i l e t a r e d ( c 0 7 @w m 0 5x a m k c o h s l a m r e h tf 2 0 2 - d t s - l i m 7 0 1 d o h t e m@ % 5 2 . 0 d rx a m e r u s o p x e e r u t a r e p m e t h g i ht n e i b m a c 0 5 1 @ s r h 0 0 1% 5 2 . 0 d rx a m e r u t s i o mf 2 0 2 - d t s - l i m 6 0 1 d o h t e m% 5 . 0 d rx a m e f i l ) r h 0 0 0 1 / c 5 2 1 ( f 2 0 2 - d t s - l i m 8 0 1 d o h t e m% 5 . 0 d rx a m e s i o nf 2 0 2 - d t s - l i m 8 0 3 d o h t e mb d 5 3 Cx a m 3 k 0 5 2 w b d 0 3 Cx a m d a o l r e v o e m i t t r o h s1 0 4 3 8 - r - l i m% 5 2 . 0x a m e c n a t s i s e r n o i t a l u s n ic 5 2 @0 1 x 1 2 1 w . n i m s n o i t a c i f i c e p s l a c i n a h c e m e t a r t s b u sk c i h t s l i m 2 0 1 n o c i l i s r e y a l n o i t a l o s in i m , k c i h t ? 0 0 0 , 0 1 2 0 i s g n i k c a b) l a n o i t p o d l o g ( d e p p a l n o i t a z i l a t e mn i m , k c i h t ? 0 0 0 , 0 1 m u n i m u l a ) l a n o i t p o d l o g ? 0 0 0 , 5 1 ( n o i t a v i s s a pe d i r t i n n o c i l i s s e u l a v 0 0 1 m o r f s r o t s i s e r 8 w k 0 0 5 o t w g n i g a k c a p . d r a d n a t s s i m u m i x a m s p i h c 6 9 1 f o s y a r t e r a u q s h c n i o w t s e t o n . r e h t o n a o t e u l a v e n o m o r f y r a v y a m n r e t t a p r o t s i s e r . 1 formats die size: 903 x 603 mils bonding pads: 5x7 mils typical
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