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c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 a p l 5 6 0 3 w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . l o w d r o p o u t 6 0 0 m a f i x e d v o l t a g e l i n e a r r e g u l a t o r t h e a p l 5 6 0 3 i s a l o w - p o w e r a n d l o w d r o p o u t l i n e a r r e g u - l a t o r s w h i c h o p e r a t e s f r o m 2 . 9 v t o 6 v i n p u t v o l t a g e a n d d e l i v e r s u p t o 6 0 0 m a o u t p u t c u r r e n t . t y p i c a l d r o p o u t v o l t - a g e i s o n l y 2 2 0 m v ( t y p i c a l ) a t 6 0 0 m a o u t p u t . t h e a p l 5 6 0 3 r e g u l a t o r s w i t h l o w 1 4 0 m a q u i e s c e n t c u r r e n t a r e i d e a l f o r b a t t e r y - p o w e r e d s y s t e m a p p l i a n c e s . t h e a p l 5 6 0 3 r e g u - l a t o r s a r e s t a b l e w i t h a 2 . 2 m f c e r a m i c c a p a c i t o r . t h e f e a - t u r e s o f c u r r e n t l i m i t , s h o r t c i r c u i t c u r r e n t l i m i t , a n d o v e r - t e m p e r a t u r e p r o t e c t i o n s c a n p r e v e n t t h e d e v i c e a g a i n s t c u r r n e t o v e r l o a d a n d o v e r - t e m p e r a t u r e . t h e a p l 5 6 0 3 r e g u l a t o r s a r e a v a i l a b e i n s o t - 2 3 - 5 , s o p - 8 , a n d d f n 3 x 3 - 8 p a c k a g e s . f e a t u r e s g e n e r a l d e s c r i p t i o n a p p l i c a t i o n s cd/dvd-rom, cd-r/w networking system, lan card, adsl/cable modem set-top box pc peripherals battery-powered system o r d e r i n g a n d m a r k i n g i n f o r m a t i o n low dropout voltage: 220mv (typical) @600ma wide 2.9v~6v input voltage low quiescent current: 140 m a (typical) fixed output voltage with 2% accuracy stable with ceramic, 2.2 m f output capacitor short circuit current limit over-temperature protection current limit protection internal soft-start sot-23-5, sop-8, and dfn3x3-8 packages lead free and green devices available (rohs compliant) note 1: anpec lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with rohs. anpec lead-free products meet or exceed the lead-free requirements of ipc/jedec j-std-020c for msl classification at lead-free peak reflow temperature. anpec defines ?green? to mean lead-free (rohs compliant) and halogen free (br or cl does not exceed 900ppm by weight in homogeneous material and total of br and cl does not exceed 1500ppm by weight). n o t e 2 : f o r o t h e r v o l t a g e v e r s i o n s p l e a s e c o n t a c t a n p e c f o r d e t a i l s . voltage code (note 2 ) 12 : 1.2v, 15 : 1.5v, 18 : 1.8v, 25 : 2.5v 28 : 2.8v, 30 : 3.0v, 33 : 3.3v package code b : sot-23-5 k : sop-8 qa : dfn3x3-8 operating ambient temperature range i : -40 to 85 c handling code tr : tape & reel assembly material l : lead free device g : h a l o g e n a n d l e a d f r e e d e v ice apl5603 handling code temperature range package code assembly material voltage code apl5603-18 k : xxxxx - date code 18 - voltage code apl5603 xxxxx 18 apl5603-18 qa : xxxxx - date code 18 - voltage code l5603 18 xxxxx
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 2 a p l 5 6 0 3 marking for sot - 23 - 5 package product name marking product name marking product name marking apl5603 - 12b 63 5x apl5603 - 15b 63 9x apl5603 - 18b 63 cx apl5603 - 25b 63 jx apl5603 - 28b 63 mx apl5603 - 3 0 b 63 ox apl5603 - 33b 63 rx * ? x ? in the marking indicates data c ode. a b s o l u t e m a x i m u m r a t i n g s ( n o t e 3 ) symbol parameter rating unit v in vin supply voltage (vin to gnd) - 0.3 to 6.5 v t j maximum junction temperature 150 o c v out output voltage (vout to gnd) - 0.3 to v in +0.3 v v en en pin voltage (ven to gnd) - 0.3 to 6.5 v t stg storage temperature range - 65 to 150 o c t sdr maximum lead soldering temperature, 10 seconds 260 o c p d power dissipation internally limited note 3: stresses beyond the absolute maximum rating may damage the device and exposure to absolute maximum rating conditions for extended peri ods may affect device reliability. p i n c o n f i g u r a t i o n s t h e r m a l c h a r a c t e r i s t i c s ( n o t e 4 , 5 ) symbol parameter package rating unit sot - 23 - 5 260 sop - 8 1 5 0 q ja junction to air t hermal r esistance dfn3x3 - 8 110 q jc junction to case t hermal r esistance sop - 8 3 0 c /w note 4: at elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values. the junction - to - ambient thermal resistance is measured on a pc board mounting with the device soldered down to minimum copper area. if power dissipation causes the junction temperature to exceed spe cified limits, the device will go into thermal shutdown. note 5: the maximum allowable power dissipation at any t a (ambient temperature) is calculated using: p d (max) = (t j ? t a ) / q ja ; t j = 125c. exceeding the maximum allowable power dissipation will res ult in excessive die temperature. o r d e r i n g a n d m a r k i n g i n f o r m a t i o n ( c o n t . ) 7 gnd vout 3 vin 2 nc 4 6 gnd 5 gnd 8 gnd en 1 sop-8 gnd 2 5 vout en 3 4 nc vin 1 sot-23-5 apl5603 top view vout 3 8 en vin 1 vin 2 vout 4 7 nc 5 nc 6 gnd dfn3x3-8
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 3 a p l 5 6 0 3 symbol parameter ra nge unit v in vin to gnd 2.9 to 6 v i out output current 0 to 0.6 a c in input capacitor 0.82 to 470 m f c out output capacitor 1 to 330 m f t j junction temperature - 40 to 125 c t a ambient temperature - 40 to 85 c e l e c t r i c a l c h a r a c t e r i s t i c s refer to the typical application circuit. v in = v out +1v or 2.9v (minimum), whichever is great, v en = v in , i out = 1ma, t j = - 40 to 125 c , t a = - 40 to 85 c , unless otherwise specified. typical values are at t a = 25 c . apl560 3 symbol parameter test conditions min . typ . max . unit supply current v en = 0v - - 1 m a i q quiescent current v in =v en =5v, i out =0ma - 140 200 m a under - voltage - lockout vin uvlo threshold v in rising 2.1 2.5 2.9 v vin uvlo hysteresis - 0.1 5 - v output voltage t a = 25 c - 1 - +1 v out output voltage t a = - 40 to 85 c (t j = - 40 to 125 c ) - 2 - +2 % v out line regulation v in = v out + 1v to 6v - 0.03 0.1 % /v load regulation i out = 1ma to 600ma - 0.6 1.5 %/a v out =2. 8 v, i out =600ma - 240 400 v out = 3.3 v, i out =600ma - 220 310 v drop dropout voltage v out =5v, i out =600ma - 200 320 m v psrr p ower s upply r ipp le r e je ction v in = v out + 2v, f = 1khz - 55 - db soft - start and protection i lim output current limit 700 - - ma thermal shutdown temperature - 150 - c thermal shutdown hysteresis - 40 - c short circuit current limit v out < 0.6v - 250 - ma t ss soft - start time - 130 300 m s logic input en logic input - high level 1.6 - - v en logic input - low level - - 0.4 v en pull - low resistance v en <3v - 2 - m w r e c o m m e n d e d o p e r a t i n g c o n d i t i o n s
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 4 a p l 5 6 0 3 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s v i n t o v o u t d r o p o u t v s . j u n c t i o n t e m p e r a t u r e j u n c t i o n t e m p e r a t u r e , t j ( o c ) power supply ripple rejection f r e q u e n c y ( h z ) e n t h r e s h o l d v s . i n p u t v o l t a g e q u i e s c e n t c u r r e n t v s . i n p u t v o l t a g e i n p u t v o l t a g e , v i n ( v ) i n p u t v o l t a g e , v i n ( v ) quiescent current ( m a) en threshold, v ht-en (v) psrr (db) vin to v out dropout, v drop (v) 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 3 3.5 4 4.5 5 5.5 6 6.5 -80 -70 -60 -50 -40 -30 -20 -10 0 1000 10000 100000 v in =3.3v, v out =1.8v, c in =1 m f, c out =2.2 m f, i out =500ma c u r r e n t l i m i t v s . j u n c t i o n t e m p e r a t u r e current limit, i lim (a) j u n c t i o n t e m p e r a t u r e , t j ( o c ) (refer to the application circuit 1 in the section ?typical application circuits?, v in =5v, v out =3.3v, c out =2.2 m f, unless otherwise specified.) 0 50 100 150 200 250 300 350 -50 -25 0 25 50 75 100 125 150 v out =3.3v i out =600ma i out =400ma i out =200ma v i n t o v o u t d r o p o u t v s . j u n c t i o n t e m p e r a t u r e 0 40 80 120 160 200 0 1 2 3 4 5 6 i out =0ma 0 50 100 150 200 250 300 -50 -25 0 25 50 75 100 125 150 i out =600ma i out =400ma i out =200ma v out =5v j u n c t i o n t e m p e r a t u r e , t j ( o c ) vin to v out dropout, v drop (v) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 -50 -25 0 25 50 75 100 125 150 v in =3.3v v in =5v
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 5 a p l 5 6 0 3 o p e r a t i n g w a v e f o r m s power on ch1 : v in , 2v/div time : 1ms/div 2 1 ch3 : v out , 2 v/div ch4 : i out , 500ma/div v in v out i out 3 2 1 3 power off ch1 : v in , 2v/div time : 200ms/div ch2 : v out , 2 v/div ch3 : i out , 500ma/div v in v set v out i out v in v out i out enable ch1 : v en , 5 v/div time : 1 00 m s/div ch2 : v out , 2 v/div ch3 : i out , 500ma/div v en v out i out 2 1 3 shutdown 2 1 3 v en v out i out ch1 : v en , 5 v/div time : 2 0 m s/div ch2 : v out , 2 v/div ch3 : i out , 500ma/div (refer to the application circuit 1 in the section ?typical application circuits?, v in =5v, v out =3.3v, c out =2.2 m f, unless otherwise specified.)
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 6 a p l 5 6 0 3 o p e r a t i n g w a v e f o r m s ( c o n t . ) ch1 : v out , 100mv/div (offset=3.3v) ch2 : i out , 200mv/div time : 200 m s/div load transient v in =5v, v out =3.3v c in =1 m f, c out =2.2 m f, i out rising/falling time=1 m s 2 1 v out i out current limit and short circuit current limit v in v out i out 2 1 3 ch1 : v in , 5 v/div time : 2 ms/div ch2 : v out , 2v/div ch3 : i out , 1 a/div thermal shutdown ch1 : v in , 5 v/div time : 500 ms/div ch2 : v out , 2v/div ch3 : i out , 5 00ma/div v in v out i out 2 1 3 (refer to the application circuit 1 in the section ?typical application circuits?, v in =5v, v out =3.3v, c out =2.2 m f, unless otherwise specified.) line transient v in =4.5~ 6 v, v in rising/falling=10 m s, i out =300ma ch1 : v in , 2 v/div ch2 : v out , 2 0mv/div (offset=3.3v) time : 200 m s/div 2 1 v out v in
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 7 a p l 5 6 0 3 pin name function vin input supply pin. supply voltage can range from 2. 9 v to 6v. bypass with a 1f capacitor to gnd . vout regulator output . sources up to 600ma. a small capacitor (2.2 m f, typical) is needed from this pin to ground to assure stability. e n shutdown control input. driving the en high turns on the regulator. driving the en pin low puts the regulator into shutdown mode. the en pin is pulled low by an internal resistor. gnd g round. b l o c k d i a g r a m p i n d e s c r i p t i o n t y p i c a l a p p l i c a t i o n c i r c u i t uvlo and soft-start thermal shutdown vin gnd current limit v ref =0.8v short circuit current limit vout en vin en gnd vout apl5603 c2 2.2 m f c1 1 m f v i n v out v en enable shutdown
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 8 a p l 5 6 0 3 f u n c t i o n d e s c r i p t i o n under voltage lockout (uvlo) the apl5603 regulator has a built-in under-voltage lock- out circuit to keep the output shut off until internal cir- cuitry is operating properly. t h e u v l o f u n c t i o n i n i t i a t e s a s o f t - s t a r t p r o c e s s a f t e r i n p u t v o l t a g e e x c e e d s i t s r i s i n g u v l o t h r e s h o l d d u r i n g p o w e r o n . t y p i c a l u v l o t h r e s h - o l d i s 2 . 4 v w i t h 0 . 1 5 v h y s t e r e s i s . soft-start the apl5603 provides an internal soft-start circuitry to control rise rate of the output voltage and limit the cur- rent surge during start-up. approximate 20 m s delay time after the v in is over the uvlo threshold, the output volt- age starts the soft-start. the typical soft-start interval is about 130 m s. current limit the apl5603 provides a current limit circuitry, which monitors and controls p-mos?s gate voltage, limiting the output current to 700ma. for reliable operation, the device should not be operated in current limit for extended period. short circuit current limit when the output voltage drops below 0.6v due to over- load or short circuit, the internal short circuit current limit circuitry limits the output current down to 250ma. the short circuit current limit is used to reduce the power dissipation during short circuit condition. in some high v in -v out conditions, if the junction temperature is over the thermal shutdown temperature, the device will enter the thermal shutdown. please refer to the section on thermal considerations for power dissipation calculations. the short circuit current limit has featured with blanking time after the uvlo threshold is reached, so that it will avoid the output caus ing short circuit current limit protection during sta rt-up; the blanking time is about 600 m s. thermal shutdown a thermal shutdown circuit limits the junction temperature of apl5603. when the junction temperature exceeds +150 o c, the thermal shutdown circuitry disables the output, which allows the device to cool down. the out- put circuitry is enabled again after the junction tem- perature cools down by 40 o c, resulting in a pulsed out- put during continuous thermal overload conditions. ther- mal protection is designed to protect the ic in the event of over temperature conditions. for reliable operation, the junction temperature cannot exceed t j =+125 o c. enable and shutdown driving the en high turns on the regulator, driving the en low puts the regulator into shutdown mode. a logic low also causes the output voltage to discharge to the gnd. the en is pulled low by an internal resistor.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 9 a p l 5 6 0 3 a p p l i c a t i o n i n f o r m a t i o n l a y o u t c o n s i d e r a t i o n f i g u r e 1 i l l u s t r a t e s t h e l a y o u t . b e l o w i s a c h e c k l i s t f o r y o u r l a y o u t : 1 . p l e a s e p l a c e t h e i n p u t c a p a c i t o r s c l o s e t o t h e v i n . 2 . c e r a m i c c a p a c i t o r s f o r l o a d m u s t b e p l a c e d n e a r t h e l o a d a s c l o s e a s p o s s i b l e . 3 . t o p l a c e a p l 5 6 0 3 a n d o u t p u t c a p a c i t o r s n e a r t h e l o a d i s g o o d f o r p e r f o r m a n c e . 4 . l a r g e c u r r e n t p a t h s , t h e b o l d l i n e s i n f i g u r e 1 , m u s t h a v e w i d e t r a c k s . input capacitor the apl5603 requires proper input capacitors to supply surge current during stepping load transients to prevent the input rail from dropping. because the parasitic induc- tor from the voltage sources or other bulk capacitors to the vin limits the slew rate of the surge current, it is nec- essary to place the input capacitors near vin as close as possible. input capacitors should be larger than 0.82 m f. output capacitor the apl5603 needs a proper output capacitor to main- tain circuit stability and to improve transient response over temperature and current. in order to insure the cir- cuit stability, the proper output capacitor value should be larger than 1 m f. with x5r and x7r dielectrics, 2.2 m f is sufficient at all operating temperatures. maximum output capacitor should be less than 330 m f to insure the sys- tem can be powered on effectively. t h e a p l 5 6 0 3 m a x i m u m p o w e r d i s s i p a t i o n d e p e n d s o n t h e t h e r m a l r e s i s t a n c e a n d t e m p e r a t u r e d i f f e r e n c e b e t w e e n t h e d i e j u n c t i o n a n d a m b i e n t a i r . t h e p o w e r d i s - s i p a t i o n p d a c r o s s t h e d e v i c e i s : p d = ( t j - t a ) / c j a w h e r e ( t j - t a ) i s t h e t e m p e r a t u r e d i f f e r e n c e b e t w e e n t h e j u n c t i o n a n d a m b i e n t a i r . c j a i s t h e t h e r m a l r e s i s t a n c e b e t w e e n j u n c t i o n a n d a m b i e n t a i r . a s s u m i n g t h e t a = 2 5 o c a n d m a x i m u m t j = 1 5 0 o c ( t y p i c a l t h e r m a l l i m i t t h r e s h o l d ) , t h e m a x i m u m p o w e r d i s s i p a t i o n i s c a l c u - l a t e d a s : p d ( m a x ) = ( 1 5 0 - 2 5 ) / 2 6 0 = 0 . 4 8 ( w ) f o r n o r m a l o p e r a t i o n , d o n o t e x c e e d t h e m a x i m u m o p e r a t i n g j u n c t i o n t e m p e r a t u r e o f t j = 1 2 5 o c . t h e c a l c u - l a t e d p o w e r d i s s i p a t i o n s h o u l d b e l e s s t h a n : t h e g n d p r o v i d e s a n e l e c t r i c a l c o n n e c t i o n t o g r o u n d a n d c h a n n e l s h e a t a w a y . c o n n e c t t h e g n d t o g r o u n d b y u s i n g a l a r g e p a d o r g r o u n d p l a n e . o p e r a t i o n r e g i o n a n d p o w e r d i s s i p a t i o n f i g u r e 1 p d = ( 1 2 5 - 2 5 ) / 2 6 0 = 0 . 3 8 ( w ) large ground plane is good for heating. opti mum perfor- mance can only be achieved whe n the device is mounted on a pc board according to the board layout diagrams which are shown as figure2, 3 and 4. f i g u r e 2 f i g u r e 3 f i g u r e 4 vin vout gnd apl5603 c in c out v in v out en v en dfn3x3-8 v out v in gnd c in c out for dissipating heat sot-23-5 c in c out v out gnd sop-8 gnd v out v in gnd c in c out for dissipating heat
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 0 a p l 5 6 0 3 p a c k a g e i n f o r m a t i o n s o t - 2 3 - 5 max. 0.057 0.051 0.024 0.006 0.009 0.020 0.012 l 0.30 0 e e1 e1 e d c b 0.08 0.30 0.60 0.012 0.95 bsc 1.90 bsc 0.22 0.50 0.037 bsc 0.075 bsc 0.003 min. millimeters s y m b o l a1 a2 a 0.00 0.90 sot-23-5 max. 1.45 0.15 1.30 min. 0.000 0.035 inches 8 0 8 0 b c e1 0 l view a 0 . 2 5 gauge plane seating plane a a 2 a 1 e d e e 1 see view a 1.40 2.60 1.80 3.00 2.70 3.10 0.122 0.071 0.118 0.102 0.055 0.106 note : 1. follow jedec to-178 aa. 2. dimension d and e1 do not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 1 a p l 5 6 0 3 p a c k a g e i n f o r m a t i o n s o p - 8 s y m b o l min. max. 1.75 0.10 0.17 0.25 0.25 a a1 c d e e1 e h l millimeters b 0.31 0.51 sop-8 0.25 0.50 0.40 1.27 min. max. inches 0.069 0.004 0.012 0.020 0.007 0.010 0.010 0.020 0.016 0.050 0 0.010 1.27 bsc 0.050 bsc a2 1.25 0.049 0 8 0 8 d e e e 1 see view a c b h x 4 5 a a 1 a 2 l view a 0 . 2 5 seating plane gauge plane note: 1. follow jedec ms-012 aa. 2. dimension ? d ? does not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. dimension ? e ? does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 10 mil per side. 3.80 5.80 4.80 4.00 6.20 5.00 0.189 0.197 0.228 0.244 0.150 0.157
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 2 a p l 5 6 0 3 p a c k a g e i n f o r m a t i o n dfn3x3-8 a e d a1 a3 pin 1 corner d 2 e2 l e b min. max. 1.00 0.00 0.25 0.35 1.60 2.50 0.05 1.35 a a1 b d d2 e e2 e l millimeters a3 0.20 ref dfn3x3-8 0.30 0.50 1.75 0.008 ref min. max. inches 0.039 0.000 0.010 0.014 0.063 0.098 0.053 0.012 0.020 0.80 0.069 0.031 0.002 3.00 bsc 0.118 bsc 3.00 bsc 0.118 bsc 0.65 bsc 0.026 bsc s y m b o l
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 3 a p l 5 6 0 3 application a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 8.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 8.0 ? 0.30 1.75 ? 0.10 3.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 sot - 23 - 5 4.0 ? 0.10 4.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.0 min. 0.6+0.00 - 0.4 0 3.20 ? 0.20 3.10 ? 0.20 1.50 ? 0.20 application a h t1 c d d w e1 f 330.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 sop - 8 4.0 ? 0.10 8.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 6.40 ? 0.20 5.20 ? 0.20 2.10 ? 0.20 application a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 dfn3x3 - 8 4. 0 ? 0.10 8.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 3.30 ? 0.20 3.30 ? 0.20 1.30 ? 0.20 (mm) c a r r i e r t a p e & r e e l d i m e n s i o n s a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 h t1 a d
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 4 a p l 5 6 0 3 package type unit quantity sot - 23 - 5 tape & reel 3000 so p - 8 tape & reel 2500 dfn3x3 - 8 tape & reel 3000 d e v i c e s p e r u n i t t a p i n g d i r e c t i o n i n f o r m a t i o n sot-23-5 user direction of feed sop-8 user direction of feed
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 5 a p l 5 6 0 3 test item method description solderability mil - std - 883d - 2003 245 c, 5 sec holt mil - std - 883d - 1005.7 1000 hrs bias @125 c pct jesd - 22 - b, a102 168 hrs, 100 % rh, 121 c tst mil - std - 883d - 1011.9 - 65 c~150 c, 200 cycles esd mil - std - 883d - 3015.7 vhbm > 2kv, vmm > 200v latch - up jesd 78 10ms, 1 tr > 100ma r e f l o w c o n d i t i o n ( i r / c o n v e c t i o n o r v p r r e f l o w ) t 25 c to peak tp ramp-up t l ramp-down ts preheat tsmax tsmin t l t p 25 t e m p e r a t u r e time critical zone t l to t p r e l i a b i l i t y t e s t p r o g r a m t a p i n g d i r e c t i o n i n f o r m a t i o n ( c o n t . ) dfn3x3-8 user direction of feed
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 6 a p l 5 6 0 3 profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate (t l to t p ) 3 c/second max. 3 c/second max. preheat - temperature min (tsmin) - temperature max (tsmax) - time (min to max) (ts) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 180 seconds time maintained above: - temperature (t l ) - time (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak /classification temperature (tp) see table 1 see table 2 time within 5 c of actual peak temperature (tp) 10 - 30 seconds 20 - 40 seconds ramp - down rate 6 c/sec ond max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. notes: all temperatures refer to topside of the package. measured on the body surface. table 2. pb - free process ? package classification reflow temperatures package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 +0 c* 260 +0 c* 260 +0 c* 1.6 mm ? 2.5 mm 260 +0 c* 250 +0 c* 245 +0 c* 3 2.5 mm 250 +0 c* 245 +0 c* 245 +0 c* * tolerance: the device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means peak reflow temperature +0 c. for example 260 c+0 c) at the rated msl level. c u s t o m e r s e r v i c e a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 2 f , n o . 1 1 , l a n e 2 1 8 , s e c 2 j h o n g s i n g r d . , s i n d i a n c i t y , t a i p e i c o u n t y 2 3 1 4 6 , t a i w a n t e l : 8 8 6 - 2 - 2 9 1 0 - 3 8 3 8 f a x : 8 8 6 - 2 - 2 9 1 7 - 3 8 3 8 table 1. snpb eutectic process ? package peak reflow temperature s package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 240 +0/ - 5 c 225 +0/ - 5 c 3 2.5 mm 225 +0/ - 5 c 225 +0/ - 5 c c l a s s i f i c a t i o n r e f l o w p r o f i l e s

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