1/4 rev. c structure silicon monolithic integrated circuit product series system motor driver for portable md type BD6607KN features ? operates at low power supply voltage (vcc=1.8v min.) ? incorporates two, 3-phase half-bridge driver circuits (low on resistance power dmos 0.85 ? typ.) ? incorporates two h-bridge driver circuits (low on resistance power dmos 0.70 ? typ.) ? incorporates two comparator circuits for motor bemf voltage detection ? incorporates a standby circuit (current at standby 0 a) ? incorporates thermal shutdown circuit absolute maximum ratings (ta=25c) parameter symbol limits unit power supply voltage for control circuit vcc 7 v power supply voltage for driver vm 7 v power supply voltage for pre-driver circuit vg 15 v input voltage vin 0 vcc v driver output current iomax. *1000 ma power dissipation pd **1250 mw operating temperature range topr -25 +75 storage temperature range tstg -55 +150 junction temperature tjmax 150 must not exceed pd or aso, tjmax=150 . reduced by 10mw/c over ta=25c, when mounted on a glass epoxy board (70mmx70mmx1.6mm). operating conditions (ta= -25 +75c) parameter symbol min. typ. max. unit power supply voltage for control circuit vcc 1.8 2.4 5.0 v power supply voltage for driver vm 0.9 1.2 5.0 v power supply voltage for pre-driver circuit vg vm+5 - 12 v input voltage for logic signal *1 vil 0 - vcc v input voltage for analog signal *2 via 0 - vm v *1 : 1 stall, st1, st2, fi1, ri1, fi2, ri2, ui1, vi1, wi1, pwm1, ui2, vi2, wi2, pwm2 pins *2 : cpui1, cpuvi1, cpwi1, cpcom1, cpui2, cpvi2, cpwi2, cpcom2 pins this product described in this specification is not judged whether it applies to cocom regulations. please confirm in case of export. this product is not designed for pr otection against radioactive rays.
2/4 rev. c electrical c haracteristics (unless otherwise specified, ta=25c, vcc=2.4v, vm=1.2v, vg=6.8v) parameter symbol limit unit conditions min. typ. max. control circuit current at standby iccst - - 1 a stall=l(*1) driver power supply current at standby imst - - 1 a stall=l(*1) pre-driver power supply current at standby igst - - 1 a stall=l(*1) power supply current of control circuit at no signal iccn - 4 10 a stall=l(*1) power supply current of pre-driver at no signal ign - 100 160 a stall=l(*1) power supply current of control circuit at operation icc - 8 15 a stall=h,st1=st2=l(*2) power supply current of pre-driver at operation ig - 0.7 0.95 ma stall=h,st1=st2=l(*2) logic input logic h level input voltage vih vcc x0.8 - - v logic l level input voltage vil - - vcc x0.2 v logic h level input current iih - - 1 a fi, ri, ui, vi, wi, pwm pins logic l level input current iil -1 - - a fi, ri, ui, vi, wi, pwm pins st pin pull-down resistance rst 0.33 0.6 1.0 m ? applied to stall, st1,st2 pins bemf voltage detection comparator comparator input offset voltage vos -5 - 5 mv comparator input current icp -1 - 1 a comparator h level output voltage voh vcc x0.8 - - v isource=500 a comparator l level output voltage vol - - vcc x0.2 v isink=500a power mos h-bridge output on resistance ron1,2 - 0.7 1.30 ? upper and lower on resistance in total half-bridge output on resistance ronu,v,w - 0.85 1.55 ? upper and lower on resistance in total 1 : each input pin=l or h 2 : pwm1, pwm2 pins=176.4khz, each h-bridge input pin= 88.2khz, each 3-phase half-bridge input pin=100hz
3/4 rev. c package outlines block diagram no. pin name no. pin name 1 wi1 33 fo2 2 pgndw1 34 pgnd2 3 wo1 35 ro2 4 st1 36 ro2 5 vmvw1 37 vmr2 6 vo1 38 vmu2 7 vo1 39 uo2 8 pgnduv1 40 uo2 9 uo1 41 pgnduv2 10 uo1 42 vo2 11 vmu1 43 vo2 12 vmr1 44 vmvw2 13 ro1 45 st2 14 ro1 46 wo2 15 pgnd1 47 pgndw2 16 fo1 48 wi2 17 fo1 49 vi2 18 vmf1 50 ui2 19 fi1 51 pwm2 20 ri1 52 cpuo2 21 com1 53 cpvo2 22 cpui1 54 cpwo2 23 cpvi1 55 stall 24 cpwi1 56 gnd 25 cpwi2 57 vcc 26 cpvi2 58 vg 27 cpui2 59 cpwo1 28 com2 60 cpvo1 29 ri2 61 cpuo1 30 fi2 62 pwm1 31 vmf2 63 ui1 32 fo2 64 vi1 uqfn64 outlines (unit mm) pin no./pin name pre drive pre drive + + + pre drive + + + decode r decode r stand-by pre drive vcc(57) stall(55) st2(45) st1(4) pgnd2(34) fi2(30) fo2(32,33) vmf2(31) vmr2(37) ro2(35,36 ) ri2(29) vg(58) pgnd1(15 ) fi1(19) fo1(16,17) vmf1(18) vmr1(12) ro1(13,14) ri1(20) pgndw2(47) pgnduv2(41) uo2(39,40) vmu2(38) vmvw2(44) v o2 ( 42,43 ) wo2 ( 46 ) cpuo2(52) cpvo2(53) cpwo2(54) com2 ( 28 ) cpui2(27) cpvi2(26) cpwi2(25) pgndw1(2) pgnduv1 ( 8 ) vmu1(11) vmvw 1(5) uo1(9,10) vo1(6,7) wo1(3) cpuo1(61) cpvo1(60) cpwo1(59) g nd ( 56 ) pwm2(51) ui2(50) vi2(549) wi2(48) pwm1(62 ) ui1 ( 63 ) vi1 ( 64 ) wi1(1 ) cpwi1(24) c pvi1 ( 23 ) c pui1 ( 22 ) com1(21) bemf comp2 bemf comp1 BD6607KN lot no. type
4/4 rev. c notes on the use (1) absolute maximum ratings if the input voltage or the operating temperature range ex ceeds absolute maximum rati ngs, ic may be damaged. no destruction mode (e.g., short- circuiting or open) can be specified in that case. if such special mode as will exceed absolute maximum ratings is assumed, take the physical safety measures, such as a fuse. (2) power supply lines the regenerated current by bemf of the motor will return. theref ore, take measures, such as the insertion of a capacitor between the power supply and gnd as the pass of the regenerated current. determine the capacitance in full consideration of all the characteristics of the electrolytic capacitor, because t he electrolytic capacitor may loose some capacitance at low temperatures. if the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage of the power supply line to rise, which the pr oduct and its peripheral circuit may exceed the absolute maximum ratings . it is recommended to implement physic al safety measures such as the insertion of a voltage clamp diode bet ween the power supply and gnd pins. (3) ground potential ensure a minimum gnd pin potenti al in all operating conditions. (4) design for heat use the design for heat that allows for a sufficient margin in light of the power dissipation (pd) in actual using conditions. (5) operation in strong magnetic field use caution when using the ic in the strong magnetic field as doing so may cause the ic to malfunction. (6) aso when using the ic, make settings so that the output transistors for the motor will not be used under conditions in excess of the absolute maximum ratings and aso. (7) thermal shutdown circuit this ic incorporates thermal shutdown circuit(tsd circuit). when the chip temperature becomes the one shown in below , tsd circuit operates and makes the coil output to motor open. it is designed to shut the ic off from runaway thermal operation. it is not designed to protect the ic or guarantee its operation. do not continue to use the ic after operati ng this circuit or use the ic in an environment where the operation of this circuit is assumed. tsd on temperature[ ] (typ.) hysteresis temperature [ ] (typ.) 175 25 (8) ground wiring pattern when having both small signal and large current gnd, it is recommended to isolate the two gnd patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause voltage variations of the sm all signal gnd. be careful not to change the gnd wiring pattern of any external parts, either.
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