everlight electronics co.,ltd. everlight electronics co., ltd. http://www.everlight.com rev. 1 page: 1 of 10 devi ce no.: szdse-251-g01 prepared dat e : 18-feb-2005 prepared by : zhang hual i technical data sheet reverse package chip led with inner lens 25-21/ghc-ysu/2a features ? package in 8m m tape on 7 diam eter reel. ? com p atible with autom a tic placem ent equipm ent. ? com p atible with infrared and vapor phase reflow solder process. ? mono-color type. ? pb-free. descriptions ? the 25-21 smd taping is m u ch sm aller than lead fram e type com ponents, thus it enables sm aller board size, higher packing density, reduced storage space and finally sm aller equipm ent to be obtained. ? besides, lightweight m a kes them ideal for m i niature applications, etc. applications ? autom o tive: backlighting in dashboard and switch. ? telecom m unication: indicator and backlighting in telephone and fax. ? flat backlight for lcd, switch and sym bol. ? general use. device selection guide chip part no. m a t e r i a l e m i t t e d c o l o r lens color 25-21/ghc-ysu/2a ingan brilliant green water clear
everlight electronics co.,ltd. 25-21/ghc-ysu/2a everlight electronics co., ltd. http://www.everlight.com rev. 1 page: 2 of 10 devi ce no.: szdse-251-g01 prepared dat e : 18-feb-2005 prepared by : zhang hual i pack age outline dimensions notes: the tolerances unless m e ntioned are 0.1, unit = m m .
everlight electronics co.,ltd. 25-21/ghc-ysu/2a everlight electronics co., ltd. http://www.everlight.com rev. 1 page: 3 of 10 devi ce no.: szdse-251-g01 prepared dat e : 18-feb-2005 prepared by : zhang hual i absolute maximum ratings (ta=25 ) param e t e r s y m b o l r a t i n g unit reverse voltage v r 5 v forward current i f 2 5 m a operating tem p erature topr -40 ~ +85 storage tem p erature tstg -40 ~ +90 soldering tem p erature tsol 260(for 5 seconds) electrostatic discharge esd 150 v power dissipation pd 110 m w peak forward current (duty 1/10 @1khz) i fp 1 0 0 m a electro-optical characteristics (ta=25 ) param e t e r s y m b o l m i n . t y p . m a x . u n i t c o n d i t i o n lum i nous intensity i v 1 8 0 - - - - - 7 1 5 mc d peak w a velength p - - - - 5 1 8 - - - - nm dom i nant w a velength d 5 2 0 - - - - - 5 3 5 nm spectrum radiation bandwidth - - - - - 3 5 - - - - nm viewing angle 2 1 / 2 - - - - - 6 0 - - - - d e g forward voltage v f - - - - - 3 . 5 4 . 3 v i f =20m a reverse current i r - - - - - - - - 5 0 a v r =5v notes: 1.tolerance of luminous intensity 10% 2.tolerance of dominant wavelength 1nm
everlight electronics co.,ltd. 25-21/ghc-ysu/2a everlight electronics co., ltd. http://www.everlight.com rev. 1 page: 4 of 10 device no.: szdse-251-g01 prepared date: 18-feb-2005 prepared by: zhang huali bin range of dom. wavelength groups bin min max unit condition x 520 525 y 525 530 y z 530 535 nm i f =20ma bin range of luminous intensity bin min max unit condition s 180 285 t 285 450 u 450 715 mcd i f =20ma notes: 1.tolerance of luminous intensity 10% 2.tolerance of dominant wavelength 1nm
everlight electronics co.,ltd. 25-21/ghc-ysu/2a everlight electronics co., ltd. http://www.everlight.com rev. 1 page: 5 of 10 devi ce no.: szdse-251-g01 prepared dat e : 18-feb-2005 prepared by : zhang hual i typical electro-optical characteristics curves
everlight electronics co.,ltd. 25-21/ghc-ysu/2a everlight electronics co., ltd. http://www.everlight.com rev. 1 page: 6 of 10 devi ce no.: szdse-251-g01 prepared dat e : 18-feb-2005 prepared by : zhang hual i label explanation cat: luminous intensity rank hue: dom. wavelength rank ref: forw ard voltage rank reel dimensions notes: the tolerances unless m e ntioned are 0.1, unit = m m .
everlight electronics co.,ltd. 25-21/ghc-ysu/2a everlight electronics co., ltd. http://www.everlight.com rev. 1 page: 7 of 10 devi ce no.: szdse-251-g01 prepared dat e : 18-feb-2005 prepared by : zhang hual i carrier tape dimensions: loaded quantity 2000 pcs per reel note: the tolerances unless m e ntioned are 0.1, unit=m m . moisture resistant pack aging label aluminum moisture-proof bag desiccant l abel
everlight electronics co.,ltd. 25-21/ghc-ysu/2a everlight electronics co., ltd. http://www.everlight.com rev. 1 page: 8 of 10 device no.: szdse-251-g01 prepared date: 18-feb-2005 prepared by: zhang huali reliability test items and conditions the reliability of products shall be satisfied with items listed below. confidence level90% ltpd 10% no. items test condition test hours/cycles sample size ac/re 1 reflow soldering temp. : 260 5 min.5 sec. 6 min. 22 pcs. 0/1 2 temperature cycle h : +100 15min 5 min l : -40 15min 300 cycles 22 pcs. 0/1 3 thermal shock h : +100 5min 10 sec l : -10 5min 300 cycles 22 pcs. 0/1 4 high temperature storage temp. : 100 1000 hrs. 22 pcs. 0/1 5 low temperature storage temp. : -40 1000 hrs. 22 pcs. 0/1 6 dc operating life i f = 20 ma 1000 hrs. 22 pcs. 0/1 7 high temperature / high humidity 85 /85%rh 1000 hrs. 22 pcs. 0/1
everlight electronics co.,ltd. 25-21/ghc-ysu/2a everlight electronics co., ltd. http://www.everlight.com rev. 1 page: 9 of 10 devi ce no.: szdse-251-g01 prepared dat e : 18-feb-2005 prepared by : zhang hual i precautions for use 1. over-current-proof custom er m u st apply resistors for protection, ot herwise slight voltage shift will cause big current change ( burn out will happen ). 2. storage 2.1 do not open m o isture proof bag before the products are ready to use. 2.2 before opening the package, the leds should be kept at 30 or less and 90%rh or less. 2.3 the leds should be used within a year. 2.4 after opening the package, the leds should be kept at 30 or less and 70%rh or less. 2.5 the leds should be used within 168 hours (7 days) after opening the package. 2.6 if the m o isture absorbent m a terial (silica gel) has faded away or the leds have exceeded the storage tim e, baking treatm e nt should be perform e d using the following conditions. baking treatm e nt : 60 5 for 24 hours. 3. soldering condition 3.1 pb-free solder tem p erature profile 3.2 reflow soldering should not be done m o re than two tim es. 3.3 w h en soldering, do not put stress on the leds during heating. 3.4 after soldering, do not warp the circuit board. 4.soldering iron each term inal is to go to the tip of soldering iron tem p erature less than 280 for 3 seconds within once in less than the soldering iron capacity 25w . leave two seconds and m o re intervals, and do soldering of each term inal. be careful because the dam a ge of the product is often started at the tim e of the hand solder.
everlight electronics co.,ltd. 25-21/ghc-ysu/2a everlight electronics co., ltd. http://www.everlight.com rev. 1 page: 10 of 10 devi ce no.: szdse-251-g01 prepared dat e : 18-feb-2005 prepared by : zhang hual i 5.repairing repair should not be done after the leds have been soldered. w h en repairing is unavoidable, a double-head soldering iron should be used (as be low figure). it should be confirm e d beforehand whether the characteristics of the leds will or will not be dam a ged by repairing. e verlight electronics co., ltd. tel : 886-2-2267-2000, 2267-9936 of f i ce: n o 25, lane 76, sec 3, c hung yang rd, fax: 886-2267-6244, 2267-6189, 2267-6306 tucheng, taipei 236, taiw an, r.o.c http://www.everlight.com
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