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EN25F32
Purpose
Eon Silicon Solution Inc. (hereinafter called "Eon") is going to provide its products' top marking on ICs with < cFeon > from January 1st, 2009, and without any change of the part number and the compositions of the ICs. Eon is still keeping the promise of quality for all the products with the same as that of Eon delivered before. Please be advised with the change and appreciate your kindly cooperation and fully support Eon's product family.
Eon products' New Top Marking
cFeon Top Marking Example:
cFeon
Part Number: XXXX-XXX Lot Number: XXXXX Date Code: XXXXX
Continuity of Specifications
There is no change to this data sheet as a result of offering the device as an Eon product. Any changes that have been made are the result of normal data sheet improvement and are noted in the document revision summary, where supported. Future routine revisions will occur when appropriate, and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
Eon continues to support existing part numbers beginning with "Eon" and "cFeon" top marking. To order these products, during the transition please specify "Eon top marking" or "cFeon top marking" on your purchasing orders.
For More Information
Please contact your local sales office for additional information about Eon memory solutions.
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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(c)2004 Eon Silicon Solution, Inc.,
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Rev. G, Issue Date: 2009/10/16
EN25F32
EN25F32
32 Megabit Serial Flash Memory with 4Kbytes Uniform Sector
FEATURES
* Single power supply operation - Full voltage range: 2.7-3.6 volt * Serial Interface Architecture - SPI Compatible: Mode 0 and Mode 3 * 32 Mbit Serial Flash - 32 M-bit/4096 K-byte/16384 pages - 256 bytes per programmable page * High performance - 100MHz clock rate * Low power consumption - 12 mA typical active current - 1 A typical power down current * Uniform Sector Architecture: 1024 sectors of 4-Kbyte 64 blocks of 64-Kbyte Any sector or block can be erased individually * Software and Hardware Write Protection: - Write Protect all or portion of memory via software - Enable/Disable protection with WP# pin * High performance program/erase speed Page program time: 1.3ms typical Sector erase time: 90ms typical Block erase time 500ms typical Chip erase time: 25 Seconds typical
* Lockable 512 byte OTP security sector * Minimum 100K endurance cycle * Package Options 8 pins SOP 200mil body width 8 contact VDFN 8 pins PDIP 16 pin SOP 300mil body width All Pb-free packages are RoHS compliant
* Industrial temperature Range
GENERAL DESCRIPTION
The EN25F32 is a 32M-bit (4096K-byte) Serial Flash memory, with advanced write protection mechanisms, accessed by a high speed SPI-compatible bus. The memory can be programmed 1 to 256 bytes at a time, using the Page Program instruction.
The EN25F32 is designed to allow either single Sector/Block at a time or full chip erase operation. The EN25F32 can be configured to protect part of the memory as the software protected mode. The device can sustain a minimum of 100K program/erase cycles on each sector or block.
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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EN25F32
Figure.1 CONNECTION DIAGRAMS
8 - LEAD SOP / DIP
8 - CONTACT VDFN
16 - LEAD SOP
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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EN25F32
Figure 2. BLOCK DIAGRAM
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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EN25F32
SIGNAL DESCRIPTION
Serial Data Input (DI) The SPI Serial Data Input (DI) pin provides a means for instructions, addresses and data to be serially written to (shifted into) the device. Data is latched on the rising edge of the Serial Clock (CLK) input pin. Serial Data Output (DO) The SPI Serial Data Output (DO) pin provides a means for data and status to be serially read from (shifted out of) the device. Data is shifted out on the falling edge of the Serial Clock (CLK) input pin. Serial Clock (CLK) The SPI Serial Clock Input (CLK) pin provides the timing for serial input and output operations. ("See SPI Mode") Chip Select (CS#) The SPI Chip Select (CS#) pin enables and disables device operation. When CS# is high the device is deselected and the Serial Data Output (DO) pin is at high impedance. When deselected, the devices power consumption will be at standby levels unless an internal erase, program or status register cycle is in progress. When CS# is brought low the device will be selected, power consumption will increase to active levels and instructions can be written to and data read from the device. After power-up, CS# must transition from high to low before a new instruction will be accepted. Hold (HOLD#) The HOLD pin allows the device to be paused while it is actively selected. When HOLD is brought low, while CS# is low, the DO pin will be at high impedance and signals on the DI and CLK pins will be ignored (don't care). The hold function can be useful when multiple devices are sharing the same SPI signals. Write Protect (WP#) The Write Protect (WP#) pin can be used to prevent the Status Register from being written. Used in conjunction with the Status Register's Block Protect (BP0, BP1, BP2 and BP3) bits and Status Register Protect (SRP) bits, a portion or the entire memory array can be hardware protected.
Table 1. PIN Names
Symbol CLK DI DO CS# WP# HOLD# Vcc Vss Pin Name Serial Clock Input Serial Data Input Serial Data Output Chip Enable Write Protect Hold Input Supply Voltage (2.7-3.6V) Ground
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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EN25F32
MEMORY ORGANIZATION The memory is organized as: 4,194,304 bytes Uniform Sector Architecture 64 blocks of 64-Kbyte 1024 sectors of 4-Kbyte 16384 pages (256 bytes each) Each page can be individually programmed (bits are programmed from 1 to 0). The device is Sector, Block or Chip Erasable but not Page Erasable.
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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EN25F32
Table 2. Uniform Block Sector Architecture (Continued)
Block 63 Sector 1023 .... 1008 1007 .... 62 992 991 .... 61 976 975 .... 60 960 959 .... 59 944 943 .... 58 928 927 .... 57 912 911 .... 56 896 895 .... 55 880 879 .... 54 864 863 .... 53 848 847 .... 52 832 831 .... 51 816 815 .... 50 800 799 .... 49 784 783 .... 48 768 767 .... 47 752 751 .... 46 736 735 .... 45 720 719 .... 44 704 703 .... 43 688 Address range 3FF000h .... 3F0000h 3EF000h .... 3E0000h 3DF000h .... 3D0000h 3CF000h .... 3C0000h 3BF000h .... 3B0000h 3AF000h .... 3A0000h 39F000h .... 390000h 38F000h .... 380000h 37F000h .... 370000h 36F000h .... 360000h 35F000h .... 350000h 34F000h .... 340000h 33F000h .... 330000h 32F000h .... 320000h 31F000h .... 310000h 30F000h .... 300000h 2FF000h .... 2F0000h 2EF000h .... 2E0000h 2DF000h .... 2D0000h 2CF000h .... 2C0000h 2BF000h .... 2B0000h 3FFFFFh 3F0FFFh 3EFFFFh 3E0FFFh 3DFFFFh 3D0FFFh 3CFFFFh 3C0FFFh 3BFFFFh 3B0FFFh 3AFFFFh 3A0FFFh 39FFFFh 390FFFh 38FFFFh 380FFFh 37FFFFh 370FFFh 36FFFFh 360FFFh 35FFFFh 350FFFh 34FFFFh 340FFFh 33FFFFh 330FFFh 32FFFFh 320FFFh 31FFFFh 310FFFh 30FFFFh 300FFFh 2FFFFFh 2F0FFFh 2EFFFFh 2E0FFFh 2DFFFFh 2D0FFFh 2CFFFFh 2C0FFFh 2BFFFFh 2B0FFFh .... (c)2004 Eon Silicon Solution, Inc., .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... ....
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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Table 2. Uniform Block Sector Architecture (Continued)
Block 42 Sector 687 .... 672 671 .... 41 656 655 .... 40 640 639 .... 39 624 623 .... 38 608 607 .... 37 592 591 .... 36 576 575 .... 35 560 559 .... 34 544 543 .... 33 528 527 .... 32 512 511 .... 31 496 495 .... 30 480 479 .... 29 464 463 .... 28 448 447 .... 27 432 431 .... 26 416 415 .... 25 400 399 .... 24 384 383 .... 23 368 367 .... 22 352 Address range 2AF000h .... 2A0000h 29F000h .... 290000h 28F000h .... 280000h 27F000h .... 270000h 26F000h .... 260000h 25F000h .... 250000h 24F000h .... 240000h 23F000h .... 230000h 22F000h .... 220000h 21F000h .... 210000h 20F000h .... 200000h 1FF000h .... 1F0000h 1EF000h .... 1E0000h 1DF000h .... 1D0000h 1CF000h .... 1C0000h 1BF000h .... 1B0000h 1AF000h .... 1A0000h 19F000h .... 190000h 18F000h .... 180000h 17F000h .... 170000h 16F000h .... 160000 2AFFFFh 2A0FFFh 29FFFFh 290FFFh 28FFFFh 280FFFh 27FFFFh 270FFFh 26FFFFh 260FFFh 25FFFFh 250FFFh 24FFFFh 240FFFh 23FFFFh 230FFFh 22FFFFh 220FFFh 21FFFFh 210FFFh 20FFFFh 200FFFh 1FFFFFh 1F0FFFh 1EFFFFh 1E0FFFh 1DFFFFh 1D0FFFh 1CFFFFh 1C0FFFh 1BFFFFh 1B0FFFh 1AFFFFh 1A0FFFh 19FFFF 190FFFh 18FFFFh 180FFFh 17FFFFh 170FFFh 16FFFFh 160FFFh .... (c)2004 Eon Silicon Solution, Inc., .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... ....
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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Table 2. Uniform Block Sector Architecture (Continued)
Block 21 Sector 351 .... 336 335 .... 20 320 319 .... 19 304 303 .... 18 288 287 .... 17 272 271 .... 16 256 255 .... 15 240 239 .... 14 224 223 .... 13 208 207 .... 12 192 191 .... 11 176 175 .... 10 160 159 .... 9 144 143 .... 8 128 127 .... 7 112 111 .... 6 96 95 .... 5 80 79 .... 4 64 63 .... 3 48 47 .... 2 32 Address range 15F000 .... 150000h 14F000h .... 140000h 13F000h .... 130000h 12F000h .... 120000h 11F000h .... 110000h 10F000h .... 100000h 0FF000h .... 0F0000h 0EF000h .... 0E0000h 0DF000h .... 0D0000h 0CF000h .... 0C0000h 0BF000h .... 0B0000h 0AF000h .... 0A0000h 09F000h .... 090000h 08F000h .... 080000h 07F000h .... 070000h 06F000h .... 060000h 05F000h .... 050000h 04F000h .... 040000h 03F000h .... 030000h 02F000h .... 020000h 15FFFFh 150FFFh 14FFFFh 140FFFh 13FFFFh 130FFFh 12FFFFh 120FFFh 11FFFFh 110FFFh 10FFFFh 100FFFh 0FFFFFh 0F0FFFh 0EFFFFh 0E0FFFh 0DFFFFh 0D0FFFh 0CFFFFh 0C0FFFh 0BFFFFh 0B0FFFh 0AFFFFh 0A0FFFh 09FFFFh 090FFFh 08FFFFh 080FFFh 07FFFFh 070FFFh 06FFFFh 060FFFh 05FFFFh 050FFFh 04FFFFh 040FFFh 03FFFFh 030FFFh 02FFFFh 020FFFh .... (c)2004 Eon Silicon Solution, Inc., .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... ....
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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EN25F32
Table 2. Uniform Block Sector Architecture (End)
Block 1 Sector 31 .... 16 15 .... 4 3 2 1 0 Address range 01F000h .... 010000h 00F000h .... 004000h 003000h 002000h 001000h 000000h 01FFFFh 010FFFh 00FFFFh 004FFFh 003FFFh 002FFFh 001FFFh 000FFFh .... (c)2004 Eon Silicon Solution, Inc., ....
0
OPERATING FEATURES
SPI Modes The EN25F32 is accessed through an SPI compatible bus consisting of four signals: Serial Clock (CLK), Chip Select (CS#), Serial Data Input (DI) and Serial Data Output (DO). Both SPI bus operation Modes 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and Mode 3, as shown in Figure 3, concerns the normal state of the CLK signal when the SPI bus master is in standby and data is not being transferred to the Serial Flash. For Mode 0 the CLK signal is normally low. For Mode 3 the CLK signal is normally high. In either case data input on the DI pin is sampled on the rising edge of the CLK. Data output on the DO pin is clocked out on the falling edge of CLK.
Figure 3. SPI Modes
Page Programming To program one data byte, two instructions are required: Write Enable (WREN), which is one byte, and a Page Program (PP) sequence, which consists of four bytes plus data. This is followed by the internal Program cycle (of duration tPP). To spread this overhead, the Page Program (PP) instruction allows up to 256 bytes to be programmed at a time (changing bits from 1 to 0), provided that they lie in consecutive addresses on the same page of memory.
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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Sector Erase, Block Erase and Chip Erase The Page Program (PP) instruction allows bits to be reset from 1 to 0. Before this can be applied, the bytes of memory need to have been erased to all 1s (FFh). This can be achieved a sector at a time, using the Sector Erase (SE) instruction, a block at a time using the Block Erase (BE) instruction or throughout the entire memory, using the Chip Erase (CE) instruction. This starts an internal Erase cycle (of duration tSE tBE or tCE). The Erase instruction must be preceded by a Write Enable (WREN) instruction. Polling During a Write, Program or Erase Cycle A further improvement in the time to Write Status Register (WRSR), Program (PP) or Erase (SE, BE or CE ) can be achieved by not waiting for the worst case delay (tW, tPP, tSE, tBE or tCE). The Write In Progress (WIP) bit is provided in the Status Register so that the application program can monitor its value, polling it to establish when the previous Write cycle, Program cycle or Erase cycle is complete. Active Power, Stand-by Power and Deep Power-Down Modes When Chip Select (CS#) is Low, the device is enabled, and in the Active Power mode. When Chip Select (CS#) is High, the device is disabled, but could remain in the Active Power mode until all internal cycles have completed (Program, Erase, Write Status Register). The device then goes into the Standby Power mode. The device consumption drops to ICC1. The Deep Power-down mode is entered when the specific instruction (the Enter Deep Power-down Mode (DP) instruction) is executed. The device consumption drops further to ICC2. The device remains in this mode until another specific instruction (the Release from Deep Power-down Mode and Read Device ID (RDI) instruction) is executed. All other instructions are ignored while the device is in the Deep Power-down mode. This can be used as an extra software protection mechanism, when the device is not in active use, to protect the device from inadvertent Write, Program or Erase instructions. Status Register. The Status Register contains a number of status and control bits that can be read or set (as appropriate) by specific instructions. WIP bit. The Write In Progress (WIP) bit indicates whether the memory is busy with a Write Status Register, Program or Erase cycle. WEL bit. The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch. BP2, BP1, BP0 bits. The Block Protect (BP3, BP2, BP1, BP0) bits are non-volatile. They define the size of the area to be software protected against Program and Erase instructions. SRP bit / OTP_LOCK bit The Status Register Protect (SRP) bit is operated in conjunction with the Write Protect (WP#) signal. The Status Register Protect (SRP) bit and Write Protect (WP#) signal allow the device to be put in the Hardware Protected mode. In this mode, the non-volatile bits of the Status Register (SRP, BP3, BP2, BP1, BP0) become read-only bits. In OTP mode, this bit is served as OTP_LOCK bit, user can read/program/erase OTP sector as normal sector while OTP_LOCK bit value is equal 0, after OTP_LOCK bit is programmed with 1 by WRSR command, the OTP sector is protected from program and erase operation. The OTP_LOCK bit can only be programmed once. Note : In OTP mode, the WRSR command will ignore any input data and program OTP_LOCK bit to 1, user must clear the protect bits before enter OTP mode and program the OTP code, then execute WRSR command to lock the OTP sector before leaving OTP mode.
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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EN25F32
Write Protection Applications that use non-volatile memory must take into consideration the possibility of noise and other adverse system conditions that may compromise data integrity. To address this concern the EN25F32 provides the following data protection mechanisms: Power-On Reset and an internal timer (tPUW) can provide protection against inadvertent changes while the power supply is outside the operating specification. Program, Erase and Write Status Register instructions are checked that they consist of a number of clock pulses that is a multiple of eight, before they are accepted for execution. All instructions that modify data must be preceded by a Write Enable (WREN) instruction to set the Write Enable Latch (WEL) bit . This bit is returned to its reset state by the following events: - Power-up - Write Disable (WRDI) instruction completion or Write Status Register (WRSR) instruction completion or Page Program (PP) instruction completion or Sector Erase (SE) instruction completion or Block Erase (BE) instruction completion or Chip Erase (CE) instruction completion The Block Protect (BP3, BP2, BP1, BP0) bits allow part of the memory to be configured as readonly. This is the Software Protected Mode (SPM). The Write Protect (WP#) signal allows the Block Protect (BP2, BP1, BP0) bits and Status Register Protect (SRP) bit to be protected. This is the Hardware Protected Mode (HPM). In addition to the low power consumption feature, the Deep Power-down mode offers extra software protection from inadvertent Write, Program and Erase instructions, as all instructions are ignored except one particular instruction (the Release from Deep Power-down instruction).
Table 3. Protected Area Sizes Sector Organization Status Register Content BP3 Bit 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 BP2 Bit 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 BP1 Bit 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 BP0 Bit 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Protect Areas None Block 0 to 62 Block 0 to 61 Block 0 to 59 Block 0 to 55 Block 0 to 47 Block 0 to 31 All None Block 63 to 1 Block 63 to 2 Block 63 to 4 Block 63 to 8 Block 63 to 16 Block 63 to 32 All Memory Content Addresses None 000000h-3EFFFFh 000000h-3DFFFFh 000000h-3BFFFFh 000000h-37FFFFh 000000h-2FFFFFh 000000h-1FFFFFh 000000h-3FFFFFh None 3FFFFFh-010000h 3FFFFFh-020000h 3FFFFFh-040000h 3FFFFFh-080000h 3FFFFFh-100000h 3FFFFFh-200000h 000000h-3FFFFFh Density(KB) None 4032KB 3968KB 3840KB 3584KB 3072KB 2048KB 4096KB None 4032KB 3968KB 3840KB 3584KB 3072KB 2048KB 4096KB Portion None Lower 63/64 Lower 62/64 Lower 60/64 Lower 56/64 Lower 48/64 Lower 32/64 All None Upper 63/64 Upper 62/64 Upper 60/64 Upper 56/64 Upper 48/64 Upper 32/64 All
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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Hold Function The Hold (HOLD) signal is used to pause any serial communications with the device without resetting the clocking sequence. However, taking this signal Low does not terminate any Write Status Register, Program or Erase cycle that is currently in progress. To enter the Hold condition, the device must be selected, with Chip Select (CS#) Low. The Hold condition starts on the falling edge of the Hold (HOLD) signal, provided that this coincides with Serial Clock (CLK) being Low (as shown in Figure 4.). The Hold condition ends on the rising edge of the Hold (HOLD) signal, provided that this coincides with Serial Clock (CLK) being Low. If the falling edge does not coincide with Serial Clock (CLK) being Low, the Hold condition starts after Serial Clock (CLK) next goes Low. Similarly, if the rising edge does not coincide with Serial Clock (CLK) being Low, the Hold condition ends after Serial Clock (CLK) next goes Low. (This is shown in Figure 4.). During the Hold condition, the Serial Data Output (DO) is high impedance, and Serial Data Input (DI) and Serial Clock (CLK) are Don't Care. Normally, the device is kept selected, with Chip Select (CS#) driven Low, for the whole duration of the Hold condition. This is to ensure that the state of the internal logic remains unchanged from the moment of entering the Hold condition. If Chip Select (CS#) goes High while the device is in the Hold condition, this has the effect of resetting the internal logic of the device. To restart communication with the device, it is necessary to drive Hold (HOLD) High, and then to drive Chip Select (CS#) Low. This prevents the device from going back to the Hold condition.
Figure 4. Hold Condition Waveform
INSTRUCTIONS
All instructions, addresses and data are shifted in and out of the device, most significant bit first. Serial Data Input (DI) is sampled on the first rising edge of Serial Clock (CLK) after Chip Select (CS#) is driven Low. Then, the one-byte instruction code must be shifted in to the device, most significant bit first, on Serial Data Input (DI), each bit being latched on the rising edges of Serial Clock (CLK). The instruction set is listed in Table 4. Every instruction sequence starts with a one-byte instruction code. Depending on the instruction, this might be followed by address bytes, or by data bytes, or by both or none. Chip Select (CS#) must be driven High after the last bit of the instruction sequence has been shifted in. In the case of a Read Data Bytes (READ), Read Data Bytes at Higher Speed (Fast_Read), Read Status Register (RDSR) or Release from Deep Power-down, and Read Device ID (RDI) instruction, the shifted-in instruction sequence is followed by a data-out sequence. Chip Select (CS#) can be driven High after any bit of the data-out sequence is being shifted out. In the case of a Page Program (PP), Sector Erase (SE), Block Erase (BE), Chip Erase (CE), Write Status Register (WRSR), Write Enable (WREN), Write Disable (WRDI) or Deep Power-down (DP) instruction, Chip Select (CS#) must be driven High exactly at a byte boundary, otherwise the instruction is rejected, and is not executed. That is, Chip Select (CS#) must driven High when the number of clock pulses after Chip Select (CS#) being driven Low is an exact multiple of eight. For Page Program, if at any time the input byte is not a full byte, nothing will happen and WEL will not be reset.
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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In the case of multi-byte commands of Page Program (PP), and Release from Deep Power Down (RES ) minimum number of bytes specified has to be given, without which, the command will be ignored. In the case of Page Program, if the number of byte after the command is less than 4 (at least 1 data byte), it will be ignored too. In the case of SE and BE, exact 24-bit address is a must, any less or more will cause the command to be ignored. All attempts to access the memory array during a Write Status Register cycle, Program cycle or Erase cycle are ignored, and the internal Write Status Register cycle, Program cycle or Erase cycle continues unaffected.
Table 4. Instruction Set
Instruction Name Write Enable Write Disable / Exit OTP mode Read Status Register Write Status Register Read Data Fast Read Page Program Sector Erase / OTP erase Block Erase Chip Erase Deep Power-down Release from Deep Power-down, and read Device ID Release from Deep Power-down Manufacturer/ Device ID Read Identification Enter OTP mode Byte 1 Code 06h 04h 05h 01h 03h 0Bh 02h 20h D8h C7h/ 60h B9h
(3) dummy dummy dummy (ID7-ID0) (S7-S0)(1) S7-S0 A23-A16 A23-A16 A23-A16 A23-A16 A23-A16 A15-A8 A15-A8 A15-A8 A15-A8 A15-A8 A7-A0 A7-A0 A7-A0 A7-A0 A7-A0 (D7-D0) dummy D7-D0 (Next byte) (D7-D0) Next byte continuous (Next Byte) continuous continuous continuous(2)
Byte 2
Byte 3
Byte 4
Byte 5
Byte 6
n-Bytes
ABh
(4)
90h 9Fh 3Ah
dummy (M7-M0)
dummy (ID15-ID8)
00h 01h (ID7-ID0)
(M7-M0) (ID7-ID0) (5)
(ID7-ID0) (M7-M0)
Notes: 1. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis "( )" indicate data being read from the device on the DO pin. 2. The Status Register contents will repeat continuously until CS# terminate the instruction. 3. The Device ID will repeat continuously until CS# terminate the instruction. 4. The Manufacturer ID and Device ID bytes will repeat continuously until CS# terminate the instruction. 00h on Byte 4 starts with MID and alternate with DID, 01h on Byte 4 starts with DID and alternate with MID. 5. (M7-M0) : Manufacturer, (ID15-ID8) : Memory Type, (ID7-ID0) : Memory Capacity.
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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Table 5. Manufacturer and Device Identification
OP Code ABh 90h 9Fh 1Ch 1Ch 3116h (M7-M0) (ID15-ID0) (ID7-ID0) 15h 15h
Write Enable (WREN) (06h) The Write Enable (WREN) instruction (Figure 5) sets the Write Enable Latch (WEL) bit. The Write Enable Latch (WEL) bit must be set prior to every Page Program (PP), Sector Erase (SE), Block Erase (BE), Chip Erase (CE) and Write Status Register (WRSR) instruction. The Write Enable (WREN) instruction is entered by driving Chip Select (CS#) Low, sending the instruction code, and then driving Chip Select (CS#) High.
Figure 5. Write Enable Instruction Sequence Diagram
Write Disable (WRDI) (04h) The Write Disable instruction (Figure 6) resets the Write Enable Latch (WEL) bit in the Status Register to a 0 or exit from OTP mode to normal mode. The Write Disable instruction is entered by driving Chip Select (CS#) low, shifting the instruction code "04h" into the DI pin and then driving Chip Select (CS#) high. Note that the WEL bit is automatically reset after Power-up and upon completion of the Write Status Register, Page Program, Sector Erase, Block Erase (BE) and Chip Erase instructions.
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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Figure 6. Write Disable Instruction Sequence Diagram
Read Status Register (RDSR) (05h) The Read Status Register (RDSR) instruction allows the Status Register to be read. The Status Register may be read at any time, even while a Program, Erase or Write Status Register cycle is in progress. When one of these cycles is in progress, it is recommended to check the Write In Progress (WIP) bit before sending a new instruction to the device. It is also possible to read the Status Register continuously, as shown in Figure 7.
Figure 7. Read Status Register Instruction Sequence Diagram
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
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Table 6. Status Register Bit Locations S7 SRP
Status Register Protect 1 = status register write disable
S6
S5 BP3
S4 BP2
S3 BP1
S2 BP0
S1 WEL
(Write Enable Latch) 1 = write enable 0 = not write enable volatile bit
S0 WIP
(Write In Progress bit) 1 = write operation 0 = not in write operation volatile bit
OTP_LOCK bit
(note 1) 1 = OTP sector is protected
(Block (Block (Block (Block Protected bits) Protected bits) Protected bits) Protected bits)
Reserved bits
(note 2) (note 2) (note 2) (note 2)
Non-volatile bit
Non-volatile bit Non-volatile bit Non-volatile bit Non-volatile bit
Note 1. In OTP mode, SRP bit is served as OTP_LOCK bit. 2. See the table "Protected Area Sizes Sector Organization".
The status and control bits of the Status Register are as follows: WIP bit. The Write In Progress (WIP) bit indicates whether the memory is busy with a Write Status Register, Program or Erase cycle. When set to 1, such a cycle is in progress, when reset to 0 no such cycle is in progress. WEL bit. The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch. When set to 1 the internal Write Enable Latch is set, when set to 0 the internal Write Enable Latch is reset and no Write Status Register, Program or Erase instruction is accepted. BP3, BP2, BP1, BP0 bits. The Block Protect (BP3, BP2, BP1, BP0) bits are non-volatile. They define the size of the area to be software protected against Program and Erase instructions. These bits are written with the Write Status Register (WRSR) instruction. When one or both of the Block Protect (BP3, BP2, BP1, BP0) bits is set to 1, the relevant memory area (as defined in Table 3.) becomes protected against Page Program (PP) Sector Erase (SE) and , Block Erase (BE), instructions. The Block Protect (BP3, BP2, BP1, BP0) bits can be written provided that the Hardware Protected mode has not been set. The Chip Erase (CE) instruction is executed if, and only if, all Block Protect (BP3, BP2, BP1, BP0) bits are 0. Reserved bit. Status register bit locations 6 is reserved for future use. Current devices will read 0 for these bit locations. It is recommended to mask out the reserved bit when testing the Status Register. Doing this will ensure compatibility with future devices. SRP bit / OTP_LOCK bit. The Status Register Protect (SRP) bit is operated in conjunction with the Write Protect (WP#) signal. The Status Register Write Protect (SRP) bit and Write Protect (WP#) signal allow the device to be put in the Hardware Protected mode (when the Status Register Protect (SRP) bit is set to 1, and Write Protect (WP#) is driven Low). In this mode, the non-volatile bits of the Status Register (SRP, BP3, BP2, BP1, BP0) become read-only bits and the Write Status Register (WRSR) instruction is no longer accepted for execution. In OTP mode, this bit is served as OTP_LOCK bit, user can read/program/erase OTP sector as normal sector while OTP_LOCK bit value is equal 0, after OTP_LOCK bit is programmed with 1 by WRSR command, the OTP sector is protected from program and erase operation. The OTP_LOCK bit can only be programmed once. Note : In OTP mode, the WRSR command will ignore any input data and program OTP_LOCK bit to 1, user must clear the protect bits before enter OTP mode and program the OTP code, then execute WRSR command to lock the OTP sector before leaving OTP mode.
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Write Status Register (WRSR) (01h) The Write Status Register (WRSR) instruction allows new values to be written to the Status Register. Before it can be accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write Enable (WREN) instruction has been decoded and executed, the device sets the Write Enable Latch (WEL). The Write Status Register (WRSR) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code and the data byte on Serial Data Input (DI). The instruction sequence is shown in Figure 8. The Write Status Register (WRSR) instruction has no effect on S6, S1 and S0 of the Status Register. S6 is always read as 0. Chip Select (CS#) must be driven High after the eighth bit of the data byte has been latched in. If not, the Write Status Register (WRSR) instruction is not executed. As soon as Chip Select (CS#) is driven High, the self-timed Write Status Register cycle (whose duration is tW) is initiated. While the Write Status Register cycle is in progress, the Status Register may still be read to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Write Status Register cycle, and is 0 when it is completed. When the cycle is completed, the Write Enable Latch (WEL) is reset. The Write Status Register (WRSR) instruction allows the user to change the values of the Block Protect (BP3, BP2, BP1, BP0) bits, to define the size of the area that is to be treated as read-only, as defined in Table 3.. The Write Status Register (WRSR) instruction also allows the user to set or reset the Status Register Protect (SRP) bit in accordance with the Write Protect (WP#) signal. The Status Register Protect (SRP) bit and Write Protect (WP#) signal allow the device to be put in the Hardware Protected Mode (HPM). The Write Status Register (WRSR) instruction is not executed once the Hardware Protected Mode (HPM) is entered.
NOTE : In the OTP mode, WRSR command will ignore input data and program OTP_LOCK bit to 1.
Figure 8. Write Status Register Instruction Sequence Diagram
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Read Data Bytes (READ) (03h) The device is first selected by driving Chip Select (CS#) Low. The instruction code for the Read Data Bytes (READ) instruction is followed by a 3-byte address (A23-A0), each bit being latched-in during the rising edge of Serial Clock (CLK). Then the memory contents, at that address, is shifted out on Serial Data Output (DO), each bit being shifted out, at a maximum frequency fR, during the falling edge of Serial Clock (CLK). The instruction sequence is shown in Figure 9. The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shifted out. The whole memory can, therefore, be read with a single Read Data Bytes (READ) instruction. When the highest address is reached, the address counter rolls over to 000000h, allowing the read sequence to be continued indefinitely. The Read Data Bytes (READ) instruction is terminated by driving Chip Select (CS#) High. Chip Select (CS#) can be driven High at any time during data output. Any Read Data Bytes (READ) instruction, while an Erase, Program or Write cycle is in progress, is rejected without having any effects on the cycle that is in progress.
Figure 9. Read Data Instruction Sequence Diagram
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Read Data Bytes at Higher Speed (FAST_READ) (0Bh) The device is first selected by driving Chip Select (CS#) Low. The instruction code for the Read Data Bytes at Higher Speed (FAST_READ) instruction is followed by a 3-byte address (A23-A0) and a dummy byte, each bit being latched-in during the rising edge of Serial Clock (CLK). Then the memory contents, at that address, is shifted out on Serial Data Output (DO), each bit being shifted out, at a maximum frequency FR, during the falling edge of Serial Clock (CLK). The instruction sequence is shown in Figure 10. The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shifted out. The whole memory can, therefore, be read with a single Read Data Bytes at Higher Speed (FAST_READ) instruction. When the highest address is reached, the address counter rolls over to 000000h, allowing the read sequence to be continued indefinitely. The Read Data Bytes at Higher Speed (FAST_READ) instruction is terminated by driving Chip Select (CS#) High. Chip Select (CS#) can be driven High at any time during data output. Any Read Data Bytes at Higher Speed (FAST_READ) instruction, while an Erase, Program or Write cycle is in progress, is rejected without having any effects on the cycle that is in progress.
Figure 10. Fast Read Instruction Sequence Diagram
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Page Program (PP) (02h) The Page Program (PP) instruction allows bytes to be programmed in the memory. Before it can be accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL). The Page Program (PP) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code, three address bytes and at least one data byte on Serial Data Input (DI). If the 8 least significant address bits (A7-A0) are not all zero, all transmitted data that goes beyond the end of the current page are programmed from the start address of the same page (from the address whose 8 least significant bits (A7-A0) are all zero). Chip Select (CS#) must be driven Low for the entire duration of the sequence. The instruction sequence is shown in Figure 11. If more than 256 bytes are sent to the device, previously latched data are discarded and the last 256 data bytes are guaranteed to be programmed correctly within the same page. If less than 256 Data bytes are sent to device, they are correctly programmed at the requested addresses without having any effects on the other bytes of the same page. Chip Select (CS#) must be driven High after the eighth bit of the last data byte has been latched in, otherwise the Page Program (PP) instruction is not executed. As soon as Chip Select (CS#) is driven High, the self-timed Page Program cycle (whose duration is tPP) is initiated. While the Page Program cycle is in progress, the Status Register may be read to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Page Program cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset. A Page Program (PP) instruction applied to a page which is protected by the Block Protect (BP3, BP2, BP1, BP0) bits (see Table 3) is not executed.
Figure 11. Page Program Instruction Sequence Diagram
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Sector Erase (SE) (20h) The Sector Erase (SE) instruction sets to 1 (FFh) all bits inside the chosen sector. Before it can be accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL). The Sector Erase (SE) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code, and three address bytes on Serial Data Input (DI). Any address inside the Sector (see Table 2) is a valid address for the Sector Erase (SE) instruction. Chip Select (CS#) must be driven Low for the entire duration of the sequence. The instruction sequence is shown in Figure 12. Chip Select (CS#) must be driven High after the eighth bit of the last address byte has been latched in, otherwise the Sector Erase (SE) instruction is not executed. As soon as Chip Select (CS#) is driven High, the self-timed Sector Erase cycle (whose duration is tSE) is initiated. While the Sector Erase cycle is in progress, the Status Register may be read to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Sector Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset. A Sector Erase (SE) instruction applied to a sector which is protected by the Block Protect (BP3, BP2, BP1, BP0) bits (see Table 3) is not executed.
Figure 12. Sector Erase Instruction Sequence Diagram
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Block Erase (BE) (D8h) The Block Erase (BE) instruction sets to 1 (FFh) all bits inside the chosen block. Before it can be accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL). The Block Erase (BE) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code, and three address bytes on Serial Data Input (DI). Any address inside the Block (see Table 2) is a valid address for the Block Erase (BE) instruction. Chip Select (CS#) must be driven Low for the entire duration of the sequence. The instruction sequence is shown in Figure 13. Chip Select (CS#) must be driven High after the eighth bit of the last address byte has been latched in, otherwise the Block Erase (BE) instruction is not executed. As soon as Chip Select (CS#) is driven High, the self-timed Block Erase cycle (whose duration is tSE) is initiated. While the Block Erase cycle is in progress, the Status Register may be read to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the selftimed Block Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset. A Block Erase (BE) instruction applied to a block which is protected by the Block Protect (BP3, BP2, BP1, BP0) bits (see Table 3) is not executed.
Figure 13 Block Erase Instruction Sequence Diagram
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Chip Erase (CE) (C7h/60h) The Chip Erase (CE) instruction sets all bits to 1 (FFh). Before it can be accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL). The Chip Erase (CE) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code on Serial Data Input (DI). Chip Select (CS#) must be driven Low for the entire duration of the sequence. The instruction sequence is shown in Figure 14. Chip Select (CS#) must be driven High after the eighth bit of the instruction code has been latched in, otherwise the Chip Erase instruction is not executed. As soon as Chip Select (CS#) is driven High, the self-timed Chip Erase cycle (whose duration is tCE) is initiated. While the Chip Erase cycle is in progress, the Status Register may be read to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Chip Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset. The Chip Erase (CE) instruction is executed only if all Block Protect (BP3, BP2, BP1, BP0) bits are 0. The Chip Erase (CE) instruction is ignored if one, or more blocks are protected.
Figure 14. Chip Erase Instruction Sequence Diagram Deep Power-down (DP) (B9h) Executing the Deep Power-down (DP) instruction is the only way to put the device in the lowest consumption mode (the Deep Power-down mode). It can also be used as an extra software protection mechanism, while the device is not in active use, since in this mode, the device ignores all Write, Program and Erase instructions. Driving Chip Select (CS#) High deselects the device, and puts the device in the Standby mode (if there is no internal cycle currently in progress). But this mode is not the Deep Power-down mode. The Deep Power-down mode can only be entered by executing the Deep Power-down (DP) instruction, to reduce the standby current (from ICC1 to ICC2, as specified in Table 8.). Once the device has entered the Deep Power-down mode, all instructions are ignored except the Release from Deep Power-down and Read Device ID (RDI) instruction. This releases the device from this mode. The Release from Deep Power-down and Read Device ID (RDI) instruction also allows the Device ID of the device to be output on Serial Data Output (DO). The Deep Power-down mode automatically stops at Power-down, and the device always Powers-up in the Standby mode. The Deep Power-down (DP) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code on Serial Data Input (DI). Chip Select (CS#) must be driven Low for the entire duration of the sequence. The instruction sequence is shown in Figure 15. Chip Select (CS#) must be driven High after the eighth bit of the instruction code has been latched in, otherwise the Deep Power-down (DP) instruction is not
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executed. As soon as Chip Select (CS#) is driven High, it requires a delay of tDP before the supply current is reduced to ICC2 and the Deep Power-down mode is entered. Any Deep Power-down (DP) instruction, while an Erase, Program or Write cycle is in progress, is rejected without having any effects on the cycle that is in progress.
Figure 15. Deep Power-down Instruction Sequence Diagram Release from Deep Power-down and Read Device ID (RDI) Once the device has entered the Deep Power-down mode, all instructions are ignored except the Release from Deep Power-down and Read Device ID (RDI) instruction. Executing this instruction takes the device out of the Deep Power-down mode. Please note that this is not the same as, or even a subset of, the JEDEC 16-bit Electronic Signature that is read by the Read Identifier (RDID) instruction. The old-style Electronic Signature is supported for reasons of backward compatibility, only, and should not be used for new designs. New designs should, instead, make use of the JEDEC 16-bit Electronic Signature, and the Read Identifier (RDID) instruction. When used only to release the device from the power-down state, the instruction is issued by driving the CS# pin low, shifting the instruction code "ABh" and driving CS# high as shown in Figure 16. After the time duration of tRES1 (See AC Characteristics) the device will resume normal operation and other instructions will be accepted. The CS# pin must remain high during the tRES1 time duration. When used only to obtain the Device ID while not in the power-down state, the instruction is initiated by driving the CS# pin low and shifting the instruction code "ABh" followed by 3-dummy bytes. The Device ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in Figure 17. The Device ID value for the EN25F32 are listed in Table 5. The Device ID can be read continuously. The instruction is completed by driving CS# high. When Chip Select (CS#) is driven High, the device is put in the Stand-by Power mode. If the device was not previously in the Deep Power-down mode, the transition to the Stand-by Power mode is immediate. If the device was previously in the Deep Power-down mode, though, the transition to the Standby Power mode is delayed by tRES2, and Chip Select (CS#) must remain High for at least tRES2 (max), as specified in Table 10. Once in the Stand-by Power mode, the device waits to be selected, so that it can receive, decode and execute instructions. Except while an Erase, Program or Write Status Register cycle is in progress, the Release from Deep Power-down and Read Device ID (RDI) instruction always provides access to the 8bit Device ID of the device, and can be applied even if the Deep Power-down mode has not been entered. Any Release from Deep Power-down and Read Device ID (RDI) instruction while an Erase, Program or Write Status Register cycle is in progress, is not decoded, and has no effect on the cycle that is in progress.
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Figure 16. Release Power-down Instruction Sequence Diagram
Figure 17. Release Power-down / Device ID Instruction Sequence Diagram
Read Manufacturer / Device ID (90h) The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID. The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID instruction. The instruction is initiated by driving the CS# pin low and shifting the instruction code "90h" followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Eon (1Ch) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in Figure 18. The Device ID values for the EN25F32 are listed in Table 5. If the 24-bit address is initially set to 000001h the Device ID will be read first
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Figure 18. Read Manufacturer / Device ID Diagram
Read Identification (RDID) (9Fh) The Read Identification (RDID) instruction allows the 8-bit manufacturer identification to be read, followed by two bytes of device identification. The device identification indicates the memory type in the first byte , and the memory capacity of the device in the second byte . Any Read Identification (RDID) instruction while an Erase or Program cycle is in progress, is not decoded, and has no effect on the cycle that is in progress. The Read Identification (RDID) instruction should not be issued while the device is in Deep Power down mode. The device is first selected by driving Chip Select Low. Then, the 8-bit instruction code for the instruction is shifted in. This is followed by the 24-bit device identification, stored in the memory, being shifted out on Serial Data Output, each bit being shifted out during the falling edge of Serial Clock . The instruction sequence is shown in Figure 19. The Read Identification (RDID) instruction is terminated by driving Chip Select High at any time during data output. When Chip Select is driven High, the device is put in the Standby Power mode. Once in the Standby Power mode, the device waits to be selected, so that it can receive, decode and execute instructions.
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Figure 19. Read Identification (RDID) Enter OTP Mode (3Ah) This Flash has an extra 512 bytes OTP sector, user must issue ENTER OTP MODE command to read, program or erase OTP sector. After entering OTP mode, the OTP sector is mapping to sector 1,023, SRP bit becomes OTP_LOCK bit and can be read with RDSR command. Program / Erase command will be disabled when OTP_LOCK bit is `1' WRSR command will ignore the input data and program OTP_LOCK bit to 1. User must clear the protect bits before enter OTP mode. OTP sector can only be program and erase before OTP_LOCK bit is set to `1' and BP [3:0] = `0000'. In OTP mode, user can read other sectors, but program/erase other sectors only allowed when OTP_LOCK bit equal to `0'. User can use WRDI (04h) command to exit OTP mode. Erase OTP Command (20h) User can use Sector Erase (20h) command only to erase OTP data. Table 7. OTP Sector Address Sector 1023 Sector Size 512 byte Address Range 3FF000h - 3FF1FFh
Note: The OTP sector is mapping to sector 1023
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Figure 20. Enter OTP Mode
Power-up Timing
Figure 21. Power-up Timing
Table 8. Power-Up Timing and Write Inhibit Threshold
Symbol tVSL(1) tPUW(1) VWI(1) VCC(min) to CS# low Time delay to Write instruction Write Inhibit Voltage Parameter Min. 10 1 1 10 2 .5 Max. Unit s ms V
Note: 1.The parameters are characterized only. 2. VCC (max.) is 3.6V and VCC (min.) is 2.7V
INITIAL DELIVERY STATE
The device is delivered with the memory array erased: all bits are set to 1 (each byte contains FFh). The Status Register contains 00h (all Status Register bits are 0).
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Table 9. DC Characteristics
(Ta = - 40C to 85C; VCC = 2.7-3.6V)
Symbol
Parameter
Test Conditions
Min.
Max.
Unit
ILI ILO ICC1 ICC2 ICC3 ICC4 ICC5 ICC6 ICC7 VIL VIH VOL VOH
Input Leakage Current Output Leakage Current Standby Current Deep Power-down Current CS# = VCC, VIN = VSS or VCC CS# = VCC, VIN = VSS or VCC CLK = 0.1 VCC / 0.9 VCC at 100MHz, DQ = open CLK = 0.1 VCC / 0.9 VCC at 75MHz, DQ = open CS# = VCC CS# = VCC CS# = VCC CS# = VCC - 0.5 0.7VCC IOL = 1.6 mA IOH = -100 A VCC-0.2
2 2 20 20 25 20 28 18 25 25 0.2 VCC VCC+0.4 0.4
A A A A mA mA mA mA mA mA V V V V
Operating Current (READ)
Operating Current (PP) Operating Current (WRSR) Operating Current (SE) Operating Current (BE) Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage
Table 10. AC Measurement Conditions
Symbol Parameter Load Capacitance Input Rise and Fall Times Input Pulse Voltages Input Timing Reference Voltages Output Timing Reference Voltages Min. 20/30 5 0.2VCC to 0.8VCC 0.3VCC to 0.7VCC Max. Unit pF ns V V V
CL
VCC / 2
Notes:
1. CL = 20 pF when CLK=100MHz, CL = 30 pF when CLK=75MHz,
Figure 22. AC Measurement I/O Waveform
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Table 11.100MHz AC Characteristics
(Ta = - 40C to 85C; VCC = 2.7-3.6V) Symbol FR fR tCH 1 tCL1 tCLCH
2
Alt fC
Parameter Serial Clock Frequency for: FAST_READ, PP, SE, BE, DP, RES, WREN, WRDI, WRSR Serial Clock Frequency for READ, RDSR, RDID Serial Clock High Time Serial Clock Low Time Serial Clock Rise Time (Slew Rate) Serial Clock Fall Time (Slew Rate)
Min D.C. D.C. 4 4 0.1 0.1 5 5 5 5 100
Typ
Max 100 50
Unit MHz MHz ns ns V / ns V / ns ns ns ns ns ns
tCHCL 2 tSLCH tCHSH tSHCH tCHSL tSHSL tSHQZ 2 tCLQX tDVCH tCHDX tHLCH tHHCH tCHHH tCHHL tHLQZ tHHQX tCLQV tWHSL3 tSHWL3 tDP 2 tRES1 2 tRES2 2 tW tPP tSE tBE tCE
2 2
tCSS
CS# Active Setup Time CS# Active Hold Time CS# Not Active Setup Time CS# Not Active Hold Time
tCSH tDIS tHO tDSU tDH
CS# High Time Output Disable Time Output Hold Time Data In Setup Time Data In Hold Time HOLD# Low Setup Time ( relative to CLK ) HOLD# High Setup Time ( relative to CLK ) HOLD# Low Hold Time ( relative to CLK ) HOLD# High Hold Time ( relative to CLK )
6 0 2 5 5 5 5 5 6 6 8 20 100 3 3 1.8 10 1.3 0.09 0.5 25 15 5 0.3 2 50
ns ns ns ns ns ns ns ns ns ns ns ns ns s s s ms ms s s s
tHZ tLZ tV
HOLD# Low to High-Z Output HOLD# High to Low-Z Output Output Valid from CLK Write Protect Setup Time before CS# Low Write Protect Hold Time after CS# High CS# High to Deep Power-down Mode CS# High to Standby Mode without Electronic Signature read CS# High to Standby Mode with Electronic Signature read Write Status Register Cycle Time Page Programming Time Sector Erase Time Block Erase Time
Chip Erase Time
Note: 1. tCH + tCL must be greater than or equal to 1/ fC
2. Value guaranteed by characterization, not 100% tested in production. 3. Only applicable as a constraint for a Write status Register instruction when Status Register Protect Bit is set at 1.
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Figure 23. Serial Output Timing
Figure 24. Input Timing
Figure 25. Hold Timing
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ABSOLUTE MAXIMUM RATINGS
Stresses above the values so mentioned above may cause permanent damage to the device. These values are for a stress rating only and do not imply that the device should be operated at conditions up to or above these values. Exposure of the device to the maximum rating values for extended periods of time may adversely affect the device reliability.
Parameter Storage Temperature Plastic Packages Output Short Circuit Current1 Input and Output Voltage (with respect to ground) 2 Vcc
Value -65 to +150 -65 to +125 200 -0.5 to +4.0 -0.5 to +4.0
Unit C C mA V V
Notes: 1. No more than one output shorted at a time. Duration of the short circuit should not be greater than one second. 2. Minimum DC voltage on input or I/O pins is -0.5 V. During voltage transitions, inputs may undershoot Vss to -1.0V for periods of up to 50ns and to -2.0 V for periods of up to 20ns. See figure below. Maximum DC voltage on output and I/O pins is Vcc + 0.5 V. During voltage transitions, outputs may overshoot to Vcc + 1.5 V for periods up to 20ns. See figure below.
RECOMMENDED OPERATING RANGES 1
Parameter Ambient Operating Temperature Industrial Devices Operating Supply Voltage Vcc Value -40 to 85 Unit C
Full: 2.7 to 3.6
V
Notes: 1. Recommended Operating Ranges define those limits between which the functionality of the device is guaranteed.
Vcc +1.5V
Maximum Negative Overshoot Waveform
Maximum Positive Overshoot Waveform
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Table 12. DATA RETENTION and ENDURANCE
Parameter Description Data Retention Time Erase/Program Endurance Test Conditions 150C 125C -40 to 85 C Min 10 20 100k Unit Years Years cycles
Table 13. CAPACITANCE
( VCC = 2.7-3.6V) Parameter Symbol CIN COUT Parameter Description Input Capacitance Output Capacitance Test Setup VIN = 0 VOUT = 0 Typ Max 6 8 Unit pF pF
Note : Sampled only, not 100% tested, at TA = 25C and a frequency of 20MHz.
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Rev. G, Issue Date: 2009/10/16
EN25F32
PACKAGE MECHANICAL Figure 26. SOP 200 mil ( official name = 208 mil )
SYMBOL
A A1 A2 D E E1 e b L 0 0 0 0 4 8 Note : 1. Coplanarity: 0.1 mm 2. Max. allowable mold flash is 0.15 mm at the pkg ends, 0.25 mm between leads.
MIN. 1.75 0.05 1.70 5.15 7.70 5.15 --0.35 0.5
DIMENSION IN MM NOR 1.975 0.15 1.825 5.275 7.90 5.275 1.27 0.425 0.65
MAX 2.20 0.25 1.95 5.40 8.10 5.40 --0.50 0.80
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
35
(c)2004 Eon Silicon Solution, Inc.,
www.eonssi.com
Rev. G, Issue Date: 2009/10/16
EN25F32
Figure 27. VDFN8 ( 5x6mm )
Controlling dimensions are in millimeters (mm).
DIMENSION IN MM MIN. NOR MAX A 0.70 0.75 0.80 A1 0.00 0.02 0.04 A2 --0.20 --D 5.90 6.00 6.10 E 4.90 5.00 5.10 D2 3.30 3.40 3.50 E2 3.90 4.00 4.10 e --1.27 --b 0.35 0.40 0.45 L 0.55 0.60 0.65 Note : 1. Coplanarity: 0.1 mm SYMBOL
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
36
(c)2004 Eon Silicon Solution, Inc.,
www.eonssi.com
Rev. G, Issue Date: 2009/10/16
EN25F32
Figure 28. PDIP8
SYMBOL A A1 A2 D E E1 L eB 0
DIMENSION IN INCH MIN. NOR MAX ----0.210 0.015 ----0.125 0.130 0.135 0.355 0.365 0.400 0.300 0.310 0.320 0.245 0.250 0.255 0.115 0.130 0.150 0.310 0.350 0.375 0 7 15
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
37
(c)2004 Eon Silicon Solution, Inc.,
www.eonssi.com
Rev. G, Issue Date: 2009/10/16
EN25F32
Figure 29. 16 LEAD SOP 300 mil
SYMBOL
A A1 A2 C D E E1 e b L 00 50 Note : 1. Coplanarity: 0.1 mm
MIN. --0.10 2.25 0.20 10.10 10.00 7.40 --0.31 0.4
DIMENSION IN MM NOR MAX --2.65 0.20 0.30 --2.40 0.25 0.30 10.30 10.50 --10.65 7.50 7.60 1.27 ----0.51 --1.27 80
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
38
(c)2004 Eon Silicon Solution, Inc.,
www.eonssi.com
Rev. G, Issue Date: 2009/10/16
EN25F32
ORDERING INFORMATION
EN25F32 100 H I P
PACKAGING CONTENT P = RoHS compliant
TEMPERATURE RANGE I = Industrial (-40C to +85C) PACKAGE H = 8-pin 200mil SOP W = 8-pin VDFN Q = 8-pin PDIP F = 16-pin 300mil SOP SPEED 100 = 100 Mhz
BASE PART NUMBER EN = Eon Silicon Solution Inc. 25F = 3V Serial 4KByte Uniform-Sector FLASH 32 = 32 Megabit (4096K x 8)
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
39
(c)2004 Eon Silicon Solution, Inc.,
www.eonssi.com
Rev. G, Issue Date: 2009/10/16
EN25F32
Revisions List Revision No Description
A B Preliminary draft Correct the typo from Sector to Block in Table 3 on page 10. 1. Add Eon products' New top marking "cFeon" information on page 1. 2. Add the description "Serial Interface Architecture "and modify active current (typical) from 5mA to 12mA on page 2. 3. List the Note 4 for 90h command in Table 4 on page 14. 4. Update Table 6. Status Register Bit Locations on page 16. 5. Add Table 7. OTP Sector Address on page 27. 6. Add Note " Vcc (max) is 3.6V and Vcc (min) is 2.7V " in Table 8 on page 28. 7. Modify ICC3 from "Q = open" to " DQ = open " in Table 9 on page 29 8. Modify fR from 66MHz to 50 MHz and correct the typo "tCLH to tCH" "tCLL to tCL""tHHQZ to tHHQX" in Table 11 on page 30 9. Modify Storage Temperature from "-65 to + 125" to "-65 to +150" on page 32 10. Delete Table 12. Latch up Characteristics from version B. 11. Modify official name from 209mil to 208mil and delete dimension " c " in Figure 26 on page 34. Modify the Table 7. OTP Sector Address range from "3FF000h - 3FFFFFh" to "3FF000h - 3FF1FFh" on page 27 Remove the Protected Area Sizes definition of BP2BP1 and BP0 = 001 to 110 in table 3 on page 12. 1. Update Page program, Sector, Block and Chip erase time (typ.) parameter on page 2 and 31. (1). Page program: from 1.5ms to 1.3m (2). Sector erase: from 0.15s to 0.09s (3). Block erase: from 0.8s to 0.5s 2. Update the Protected Area Sizes definition of BP3, BP2BP1 and BP0 in table 3 on page 12. 3. Add the description of OTP erase command on page 14 and page 28. 4. Remove the Block Erase "52h" command on page 14 and 23. 5. Add S5 (BP3 bit) in Table 6. Status Register Bit Locations on page 17. 6. Modify Icc4, Icc5, Icc6 and Icc7 on page 30. (1) Icc4: from 15mA to 28mA (2) Icc5: from 15mA to 18mA (3) Icc6: from 15mA to 25mA (4) Icc7: from 15mA to 25mA Modify Table 9. DC Characteristics ICC1 (Standby) and ICC2 (Deep
Power-down) Current from 5A to 20A on page 30.
Date
2008/08/06 2008/08/25
C
2008/11/07
D E
2008/11/18 2008/12/04
F
2009/05/13
G
2009/10/16
This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
40
(c)2004 Eon Silicon Solution, Inc.,
www.eonssi.com
Rev. G, Issue Date: 2009/10/16

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