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 FEATURES
n n n n n n n n n n n n n
LTC3577/LTC3577-1 Highly Integrated 6-Channel Portable PMIC DESCRIPTION
The LTC(R)3577 is a highly integrated power management IC for single cell Li-Ion/Polymer battery applications. It includes a PowerPath manager with automatic load prioritization, a battery charger, an ideal diode, input overvoltage protection and numerous other internal protection features. The LTC3577 is designed to accurately charge from current limited supplies such as USB by automatically reducing charge current such that the sum of the load current and the charge current does not exceed the programmed input current limit (100mA or 500mA modes). The LTC3577 reduces the battery voltage at elevated temperatures to improve safety and reliability. Efficient high current charging from supplies up to 38V is available using the on-chip Bat-Track controller. The LTC3577 also includes a pushbutton input to control the three synchronous step-down switching regulators and system reset. The onboard LED backlight boost circuitry can drive up to 10 series LEDs and includes versatile digital dimming via I2C input. The I2C input also controls two 150mA LDOs as well as other operating modes and status read back. The LTC3577 is available in a low profile 4mm x 7mm x 0.75mm 44-pin QFN package.
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. PowerPath and Bat-Track are trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents including 6522118, 6700364, 7511390, 5481178, 6580258. Other Patents Pending.
Full Featured Li-Ion/Polymer Charger/PowerPathTM Control with Instant-On Operation Triple Adjustable High Efficiency Step-Down Switching Regulators (800mA, 500mA, 500mA IOUT) 6A Battery Drain Current in Hard Reset Bat-TrackTM Control for External HV Buck DC/DCs I2C Adjustable SW Slew Rates for EMI Reduction High Temperature Battery Voltage Reduction Improves Safety and Reliability Overvoltage Protection for USB (VBUS)/Wall Inputs Provides Protection to 30V Integrated 40V Series LED Backlight Driver with 60dB Brightness Control and Gradation via I2C 1.5A Maximum Charge Current with Thermal Limiting Battery Float Voltage: 4.2V (LTC3577) 4.1V (LTC3577-1) Pushbutton On/Off Control with System Reset Dual 150mA Current Limited LDOs Small 4mm x 7mm 44-Pin QFN Package
APPLICATIONS
n n n n
PNDs, DMB/DVB-H; Digital/Satellite Radio; Media Players Portable Industrial/Medical Products Universal Remotes, Photo Viewers Other USB-Based Handheld Products
TYPICAL APPLICATION
HV SUPPLY 8V TO 38V (TRANSIENTS TO 60V) OPTIONAL USB 100mA/500mA 1000mA EFFICIENCY (%) VOUT OVERVOLTAGE PROTECTION CHARGE 2 0V CC/CV CHARGER LTC3577/LTC3577-1 I2C PORT NTC HIGH VOLTAGE BUCK DC/DC
LED Driver Efficiency 10 LEDs
90 80 70 60 MAX PWM 50 40 30 20 10 0 1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 LED CURRENT (A) 1.E-01 CONSTANT CURRENT
+
SINGLE CELL Li-Ion 0.8V to 3.6V/150mA 0.8V to 3.6V/150mA UP TO 10 LED BOOST 0.8V to 3.6V/800mA 0.8V to 3.6V/500mA 0.8V to 3.6V/500mA
DUAL LDO REGULATORS
LED BACKLIGHT WITH DIGITALLY CONTROLLED DIMMING TRIPLE HIGH EFFICIENCY STEP-DOWN SWITCHING REGULATORS WITH PUSHBUTTON CONTROL
PB
3577 TA01b
3577 TA01a
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LTC3577/LTC3577-1 TABLE OF CONTENTS
FEATURES/APPLICATIONS ..........................................................................................................................................1 ABSOLUTE MAXIMUM RATINGS .................................................................................................................................3 PACKAGE/ORDER INFORMATION ................................................................................................................................3 ELECTRICAL CHARACTERISTICS .......................................................................................................................... 4-10 TYPICAL PERFORMANCE CHARACTERISTICS .................................................................................................... 10-15 PIN FUNCTION ..................................................................................................................................................... 15-18 BLOCK DIAGRAM ......................................................................................................................................................18 PowerPath OPERATION ....................................................................................................................................... 19-29 LOW DROPOUT LINEAR REGULATOR OPERATION ............................................................................................. 29-30 STEP-DOWN SWITCHING REGULATOR OPERATION .......................................................................................... 30-33 LED BACKLIGHT/BOOST OPERATION.................................................................................................................. 33-36 I2C OPERATION ................................................................................................................................................... 37-42 PUSHBUTTON INTERFACE OPERATION ............................................................................................................... 42-46 LAYOUT AND THERMAL CONSIDERATIONS........................................................................................................ 47-48 TYPICAL APPLICATION ........................................................................................................................................ 49-50 PACKAGE DESCRIPTION ............................................................................................................................................51 RELATED PARTS ........................................................................................................................................................52
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LTC3577/LTC3577-1 ABSOLUTE MAXIMUM RATINGS
(Notes 1, 2, 3)
PIN CONFIGURATION
44 CHRG 43 CLPROG 42 VC 41 ACPR 40 VBUS 39 VOUT 38 BAT ILIM0 1 ILIM1 2 LED_FS 3 WALL 4 SW3 5 VIN3 6 FB3 7 OVSENS 8 LED_OV 9 DVCC 10 SDA 11 SCL 12 OVGATE 13 PWR_ON 14 ON 15 45 37 IDGATE 36 PROG 35 NTC 34 NTCBIAS 33 SW1 32 VIN12 31 SW2 30 VINLD02 29 LDO2 28 LDO1 27 LDO1_FB 26 FB1 25 FB2 24 LDO2_FB 23 VINLDO1 UFF PACKAGE 44-LEAD (7mm 4mm) PLASTIC QFN TJMAX = 110C, JA = 45C/W EXPOSED PAD (PIN 45) IS GND, MUST BE SOLDERED TO PCB TOP VIEW
VSW ............................................................ -0.3V to 45V VBUS, VOUT , VIN12, VIN3, VINLDO1, VINLDO2, WALL t < 1ms and Duty Cycle < 1% .................. -0.3V to 7V Steady State............................................. -0.3V to 6V CHRG, BAT, LED_FS, LED_OV, PWR_ON, WAKE, PBSTAT, PG_DCDC, FB1, FB2, FB3, LDO1, LDO1_FB, LDO2, LDO2_FB, DVCC, SCL, SDA ............... -0.3V to 6V NTC, PROG, CLPROG, ON, ILIM0, ILIM1 (Note 4)............................................-0.3V to VCC + 0.3V IVBUS, IVOUT , IBAT ........................................................2A ISW3 (Continuous) ................................................850mA ISW2, ISW1 (Continuous) .......................................600mA ILDO1, ILDO2 (Continuous).....................................200mA ICHRG, IACPR, IWAKE, IPBSTAT, IPG_DCDC ....................75mA IOVSENS...................................................................10mA ICLPROG, IPROG, ILED_FS, ILED_OV ...............................2mA Junction Temperature ........................................... 110C Operating Temperature Range.................. -40C to 85C Storage Temperature Range................... -65C to 125C
ORDER INFORMATION
LEAD FREE FINISH LTC3577EUFF#PBF LTC3577EUFF-1#PBF TAPE AND REEL LTC3577EUFF#TRPBF LTC3577EUFF-1#TRPBF PART MARKING 3577 35771 PACKAGE DESCRIPTION 44-Lead (4mm x 7mm) Plastic QFN 44-Lead (4mm x 7mm) Plastic QFN TEMPERATURE RANGE -40C to 85C -40C to 85C
Consult LTC Marketing for parts specified with wider operating temperature ranges. Consult LTC Marketing for information on non-standard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
PBSTAT 16 WAKE 17 SW 18 SW 19 SW 20 PG_DCDC 21 ILED 22
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LTC3577/LTC3577-1 ELECTRICAL CHARACTERISTICS
SYMBOL VBUS IBUS(LIM) PARAMETER Input Supply Voltage Total Input Current (Note 5) ILIM0 = 0V, ILIM1 = 0V (1x Mode) ILIM0 = 5V, ILIM1 = 5V (5x Mode) ILIM0 = 5V, ILIM1 = 0V (10x Mode) 1x, 5x, 10x Modes ILIM0 = 0V, ILIM1 = 5V (Suspend Mode)
l l l
Power Manager. The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VBUS = 5V, VBAT = 3.8V, ILIM0 = ILIM1 = WALL = 0V, VINLDO1 = VINLDO2 = VIN12 = VIN3 = VOUT, RPROG = 2k, RCLPROG = 2.1k, unless otherwise noted.
CONDITIONS MIN 4.35 80 450 900 90 475 950 0.42 0.042 1000 1x Mode 5x Mode 10x Mode Rising Threshold Falling Threshold 3.5 0.2 1.0 2.0 3.8 3.7 50 -50 200 3.9 100 TYP MAX 5.5 100 500 1000 0.1 UNITS V mA mA mA mA mA mA/mA V V V V V mV mV m Input Power Supply
IBUSQ hCLPROG VCLPROG
Input Quiescent Current, POFF State Ratio of Measured VBUS Current to CLPROG Program Current CLPROG Servo Voltage in Current Limit VBUS Undervoltage Lockout
VUVLO VDUVLO RON_ILIM
VBUS to VOUT Differential Undervoltage Rising Threshold Lockout Falling Threshold Input Current Limit Power FET OnResistance (Between VBUS and VOUT) VBAT Regulated Output Voltage LTC3577 LTC3577, 0 TA 85C LTC3577-1 LTC3577-1, 0 TA 85C
l l l
Battery Charger VFLOAT 4.179 4.165 4.079 4.065 950 465 180 4.200 4.200 4.100 4.100 1000 500 200 7 6 40 90 1.000 0.100 1000 VBAT < VTRKL VBAT Rising VBAT Falling Threshold Voltage Relative to VFLOAT Timer Starts when VBAT = VFLOAT - 50mV VBAT < VTRKL 40 2.5 -75 3.2 0.4 0.085 50 2.85 2.75 -100 4 0.5 0.1 200 110 60 3.0 -125 4.8 0.6 0.11 4.221 4.235 4.121 4.135 1050 535 220 15 27 100 160 V V V V mA mA mA A A A A V V mA/mA mA V V mV Hour Hour mA/mA m C
ICHG
Constant-Current Mode Charge Current RPROG = 1k, Input Current Limit = 2A RPROG = 2k, Input Current Limit = 1A RPROG = 5k, Input Current Limit = 0.4A Battery Drain Current, Hard Reset Battery Drain Current, POFF State Battery Drain Current, PON State LDOs, and LED Backlight Disabled PROG Pin Servo Voltage VBUS = 0V, IOUT = 0A VBAT = 4.3V, Charger Time Out VBUS = 0V VBUS = 0V, IOUT = 0A, No Load on Supplies, Burst Mode Operation (Note 10) VBAT > VTRKL VBAT < VTRKL
IBATQ_HR IBATQ_OFF IBATQ_ON VPROG,CHG
VPROG,TRKL PROG Pin Servo Voltage in Trickle Charge hPROG ITRKL VTRKL VRECHRG tTERM tBADBAT hC/10 RON_CHG TLIM Ratio of IBAT to PROG Pin Current Trickle Charge Current Trickle Charge Rising Threshold Trickle Charge Falling Threshold Recharge Battery Threshold Voltage Safety Timer Termination Period Bad Battery Termination Time Battery Charger Power FET OnResistance (Between VOUT and BAT) Junction Temperature in Constant Temperature Mode
End-of-Charge Indication Current Ratio (Note 6)
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LTC3577/LTC3577-1
Power Manager. The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VBUS = 5V, VBAT = 3.8V, ILIM0 = ILIM1 = WALL = 0V, VINLDO1 = VINLDO2 = VIN12 = VIN3 = VOUT, RPROG = 2k, RCLPROG = 2.1k, unless otherwise noted.
SYMBOL VCOLD VHOT V2HOT INTC IBAT2HOT VBAT2HOT Ideal Diode VFWD RDROPOUT IMAX VOVCUTOFF VOVGATE IOVSENSQ tRISE Wall Adapter VACPR VW VW IQWALL ACPR Pin Output High Voltage ACPR Pin Output Low Voltage Absolute Wall Input Threshold Voltage Differential Wall Input Threshold Voltage Wall Operating Quiescent Current IACPR = 0.1mA IACPR = 1mA VWALL Rising VWALL Falling VWALL - VBAT Falling VWALL - VBAT Rising IWALL + IVOUT , IBAT = 0mA, WALL = VOUT = 5V ILIM0, ILIM1 ILIM0, ILIM1 ILIM0, ILIM1; VPIN = 1V ICHRG = 10mA VBAT = 4.5V, VCHRG = 5V 1.2 2 0.15 0 0.4 1 VOUT - 0.3 VOUT 0 4.3 3.2 25 75 440 0.3 4.45 V V V V mV mV A Forward Voltage Detection Diode On-Resistance, Dropout Diode Current Limit Overvoltage Protection Threshold OVGATE Output Voltage OVSENS Quiescent Current OVGATE Time to Reach Regulation IOUT = 10mA IOUT = 200mA (Note 7) Rising Threshold, ROVSENS = 6.2k Input Below VOVCUTOFF Input Above VOVCUTOFF VOVSENS = 5V COVGATE = 1nF 6.10 5 15 200 3.6 6.35 1.88 * VOVSENS 0 40 2.5 6.70 12 25 mV m A V V V A ms PARAMETER Cold Temperature Fault Threshold Voltage Hot Temperature Fault Threshold Voltage NTC Discharge Threshold Voltage NTC Leakage Current BAT Discharge Current BAT Discharge Threshold CONDITIONS Rising NTC Voltage Hysteresis Falling NTC Voltage Hysteresis Falling NTC Voltage Hysteresis VNTC = VBUS = 5V VBAT = 4.1V, NTC < VTOO_HOT IBAT < 0.1mA, NTC < VTOO_HOT MIN 75 34 24.5 -50 180 3.9 TYP 76 1.3 35 1.3 25.5 50 MAX 77 36 26.5 50 UNITS %VNTCBIAS %VNTCBIAS %VNTCBIAS %VNTCBIAS %VNTCBIAS mV nA mA V NTC, Battery Discharge Protection
ELECTRICAL CHARACTERISTICS
Overvoltage Protection
3.1 0
100
Logic (ILIM0, ILIM1 and CHRG) VIL VIH IPD VCHRG ICHRG Input Low Voltage Input High Voltage Static Pull-Down Current CHRG Pin Output Low Voltage CHRG Pin Input Current 0.4 V V A V A
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LTC3577/LTC3577-1 ELECTRICAL CHARACTERISTICS
SYMBOL DVCC IDVCC VDVCC,UVLO VIH VIL IIH IIL VOL fSCL tLOW tHIGH tBUF tHD,STA tSU,STA tSU,STO tHD,DATO tHD,DATI tSU,DAT tSP PARAMETER Input Supply Voltage DVCC Supply Current DVCC UVLO Input HIGH Voltage Input LOW Voltage Input HIGH Leakage Current Input LOW Leakage Current SDA Output LOW Voltage SCL Clock Frequency LOW Period of the SCL Clock HIGH Period of the SCL Clock Bus Free Time Between Stop and Start Condition Hold Time After (Repeated) Start Condition Setup Time for a Repeated Start Condition Stop Condition Set-Up Time Output Data Hold Time Input Data Hold Time Data Set-Up Time Input Spike Suppression Pulse Width 1.3 0.6 1.3 0.6 0.6 0.6 0 0 100 50 900 SDA = SCL = DVCC = 5.5V SDA = SCL = 0V, DVCC = 5.5V ISDA = 3mA 30 -1 -1 SCL = 400kHz SCL = SDA = 0kHz
I2C Interface. The l denotes the specifications which apply over the full
MIN 1.6 1 0.4 1.0 50 50 1 1 0.4 400 70 TYP MAX 5.5 UNITS V A A V %DVCC %DVCC A A V kHz s s s s s s ns ns ns ns
operating temperature range, otherwise specifications are at TA = 25C. DVCC = 3.3V, VOUT = 3.8V, unless otherwise noted.
CONDITIONS
Timing Characteristics (Note 8) (All Values are Referenced to VIH and VIL)
Step-Down Switching Regulators. The l denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25C. VOUT = VIN12 = VIN3 = 3.8V, all regulators enabled unless otherwise noted.
SYMBOL VIN12, VIN3 VOUT UVLO PARAMETER Input Supply Voltage VOUT Falling VOUT Rising Oscillator Frequency Pulse-Skipping Mode Input Current Burst Mode Input Current Shutdown Input Current ILIM3 VFB3 IFB3 D3 RP3 RN3 Peak PMOS Current Limit Feedback Voltage FB3 Input Current Max Duty Cycle RDS(ON) of PMOS RDS(ON) of NMOS (Note 7) Pulse-Skipping Mode Burst Mode Operation (Note 10) FB3 = 0V
l l
CONDITIONS (Note 9) VIN12 and VIN3 Connected to VOUT Through Low Impedance. Switching Regulators are Disabled Below VOUT UVLO
l
MIN 2.7 2.5
TYP
MAX 5.5
UNITS V V V MHz A A A
Step-Down Switching Regulators (Buck1, Buck2 and Buck3) 2.7 2.8 1.91 (Note 10) (Note 10) 1000 0.78 0.78 -0.05 100 0.3 0.4 2.25 100 17 0.01 1400 0.8 0.8 1700 0.82 0.824 0.05 2.9 2.59
fOSC IVIN3Q
800mA Step-Down Switching Regulator 3 (Buck3 - Pushbutton Enabled, Third in Sequence)
mA V V A %
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LTC3577/LTC3577-1 ELECTRICAL CHARACTERISTICS
SYMBOL RSW3_PD IVIN12Q PARAMETER SW3 Pull-Down in Shutdown Pulse-Skipping Mode Input Current Burst Mode Input Current Shutdown Input Current ILIM2 VFB2 IFB2 D2 RP2 RN2 RSW2_PD IVIN12Q Peak PMOS Current Limit Feedback Voltage FB2 Input Current Max Duty Cycle RDS(ON) of PMOS RDS(ON) of NMOS SW2 Pull-Down in Shutdown Pulse-Skipping Mode Input Current Burst Mode Input Current Shutdown Input Current ILIM1 VFB1 IFB1 D1 RP1 RN1 RSW1_PD Peak PMOS Current Limit Feedback Voltage FB1 Input Current Max Duty Cycle RDS(ON) of PMOS RDS(ON) of NMOS SW1 Pull-Down in Shutdown (Note 7) Pulse-Skipping Mode Burst Mode Operation (Note 10) FB1 = 0V ISW1 = 100mA ISW1 = -100mA POFF State
l l
Step-Down Switching Regulators. The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VOUT = VIN12 = VIN3 = 3.8V, all regulators enabled unless otherwise noted.
CONDITIONS POFF State (Note 10) (Note 10) (Note 7) Pulse-Skipping Mode Burst Mode Operation (Note 10) FB2 = 0V ISW2 = 100mA ISW2 = -100mA POFF State (Note 10) (Note 10) 650 0.78 0.78 -0.05 100 0.6 0.6 10
l l
MIN
TYP 10 100 17 0.01
MAX
UNITS k A A A
500mA Step-Down Switching Regulator 2 (Buck2 - Pushbutton Enabled, Second in Sequence)
650 0.78 0.78 -0.05 100
900 0.8 0.8
1200 0.82 0.824 0.05
mA V V A % k A A A
0.6 0.6 10 100 17 0.01 900 0.8 0.8 1200 0.82 0.824 0.05
500mA Step-Down Switching Regulator 1 (Buck1 - Pushbutton Enabled, First in Sequence)
mA V V A % k
LDO Regulators. The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VINLDO1 = VINLDO2 = VOUT = VBAT = 3.8V, LDO1 and LDO2 enabled unless otherwise noted.
SYMBOL VINLDO1 VOUT_UVLO IQLDO1_VO IQLDO1_VI IVINLDO1 VLDO1_FB PARAMETER Input Voltage Range VOUT Falling VOUT Rising LD01 VOUT Quiescent Current LD01 VINLDO1 Quiescent Current Shutdown Current LDO1_FB Regulated Feedback Voltage LDO1_FB Line Regulation (Note 11) LDO1_FB Load Regulation (Note 11) ILDO1_FB ILDO1_OC LDO1_FB Input Current Available Output Current CONDITIONS VINLDO1 VOUT + 0.3V LDO1 is Disabled Below VOUT UVLO LDO1 Enabled, PON State, ILDO1 = 0mA LDO1 Enabled, PON State, ILDO1 = 0mA LDO1 Disabled, PON or POFF State ILDO1 = 1mA ILDO1 = 1mA, VIN = 1.65V to 5.5V ILDO1 = 1mA to 150mA LDO1_FB = 0.8V
l l l
MIN 1.65 2.5
TYP
MAX 5.5
UNITS V V V A A A V mV/V V/mA
LDO Regulator 1 (LDO1 - Enabled Via I2C) 2.7 2.8 18 0.1 0.01 0.78 0.8 0.4 5 -50 150 50
2.9 30 2 1 0.82
nA mA
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LTC3577/LTC3577-1 ELECTRICAL CHARACTERISTICS
SYMBOL ILDO1_SC VDROP1 PARAMETER Short-Circuit Output Current Dropout Voltage (Note 12) ILDO1 = 150mA, VINLDO1 = 3.6V ILDO1 = 150mA, VINLDO1 = 2.5V ILDO1 = 75mA, VINLDO1 = 1.8V LDO1 Disabled VINLDO2 VOUT + 0.3V LDO2 is Disabled Below VOUT UVLO LDO2 Enabled, PON State, ILDO2 = 0mA LDO2 Enabled, PON State, ILDO2 = 0mA LDO2 Disabled, PON or POFF State ILDO2 = 1mA ILDO2 = 1mA, VIN = 1.65V to 5.5V ILDO2 = 1mA to 150mA LDO2_FB = 0.8V
l l l
LDO Regulators. The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VINLDO1 = VINLDO2 = VOUT = VBAT = 3.8V, LDO1 and LDO2 enabled unless otherwise noted.
CONDITIONS MIN TYP 270 160 200 170 10 1.65 2.5 2.7 2.8 18 0.1 0.01 0.78 0.8 0.4 5 -50 150 270 ILDO2 = 150mA, VINLDO2 = 3.6V ILDO2 = 150mA, VINLDO2 = 2.5V ILDO1 = 75mA, VINLDO1 = 1.8V LDO2 Disabled 160 200 170 14 260 320 280 50 5.5 2.9 30 2 1 0.82 260 320 280 MAX UNITS mA mV mV mV k V V V A A A V mV/V V/mA nA mA mA mV mV mV k
RLDO1_PD VINLDO2 VOUT_UVLO IQLDO2_VO IQLDO2_VI IVINLDO2 VLDO2_FB
Output Pull-Down Resistance in Shutdown Input Voltage Range VOUT Falling VOUT Rising LDO2 VOUT Quiescent Current LDO2 VINLDO2 Quiescent Current Shutdown Current LDO2_FB Regulated Output Voltage LDO2_FB Line Regulation (Note 11) LDO2_FB Load Regulation (Note 11)
LDO Regulator 2 (LDO2 - Enabled Via I2C)
ILDO2_FB ILDO2_OC ILDO2_SC VDROP2
LDO2_FB Input Current Available Output Current Short-Circuit Output Current Dropout Voltage (Note 12)
RLDO2_PD
Output Pull-Down Resistance in Shutdown
LED Boost Switching Regulator. The l denotes the specifications which apply over the full operating temperature range, otherwise
specifications are at TA = 25C. VIN3 = VOUT = 3.8V, ROV = 10M, RLED_FS = 20k, boost regulator disabled unless otherwise noted.
SYMBOL VIN3, VOUT IVOUT_LED VLED_OV ILIM ILED_FS ILED_DIM RNSWON INSWOFF fOSC VLED_FS ILED_OV DBOOST VBOOSTFB PARAMETER Operating Supply Range Operating Quiescent Current Shutdown Quiescent Current LED_OV Overvoltage Threshold Peak NMOS Switch Current ILED Pin Full-Scale Operating Current ILED Pin Full-Scale Dimming Range RDS(ON) of NMOS Switch NMOS Switch-Off Leakage Current Oscillator Frequency LED_FS Pin Voltage LED_OV Pin Current Maximum Duty Cycle Boost Mode ILED Feedback Voltage RLED_FS = 20k ILED = 0
l l l
CONDITIONS (Note 9) (Notes 10, 14) LED_OV Rising LED_OV Falling
l
MIN 2.7
TYP 560 0.01
MAX 5.5
UNITS V A A
0.6 800 18
1.0 0.85 1000 20 60 240 0.01
1.25 1200 22
V V mA mA dB m
64 Steps VSW = 5.5V 0.95 780 3.8 775
1 1.3 820 4.2 825
A MHz mV A % mV
1.125 800 4 97 800
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LTC3577/LTC3577-1 ELECTRICAL CHARACTERISTICS
SYMBOL VOUT VOUT UVLO VON_TH ION PARAMETER Pushbutton Operating Supply Range VOUT Falling VOUT Rising ON Threshold Rising ON Threshold Falling ON Input Current VON = VOUT VON = 0V Pushbutton Pin (ON) (Note 9) Pushbutton is Disabled Below VOUT UVLO
l
Pushbutton Controller. The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VOUT = 3.8V, unless otherwise noted.
CONDITIONS MIN 2.7 2.5 2.7 2.8 0.8 0.7 -9 0.8 0.7 TYP MAX 5.5 2.9 1.2 1 -14 1.2 1 1 0.1 -1 0.1 -1 0.1 -8 50 900 400 4.2 40 WAKE Low > tPWR_ONBK2 WAKE Low > tPWR_ONBK2 WAKE Low > tPWR_ONBK2 WAKE High > tPWR_ONBK1 WAKE Rising Until PWR_ON Low Recognized WAKE Falling Until PWR_ON High Recognized All Bucks Within PG_DCDC Threshold Voltage All Bucks Disabled 5 50 100 5 50 50 5 1 230 44 Note 3: This IC includes over temperature protection that is intended to protect the device during momentary overload conditions. Junction temperatures will exceed 110C when over temperature protection is active. Continuous operation above the specified maximum operating junction temperature may result in device degradation or failure. 5.8 60 0.4 1 0.4 1 0.4 UNITS V V V V V A A V V A A V A V A V % ms s ms Seconds ms ms s ms ms Seconds Seconds ms s
0.4 -1 -4
Power-On Input Pin (PWR_ON) VPWR_ON IPWR_ON IPBSTAT VPBSTAT IWAKE VWAKE IPG_DCDC VPG_DCDC VTHPG_DCDC tON_PBSTAT1 tON_PBSTAT2 tON_WAKE tON_HR tPBSTAT_PW tWAKE_EXTP tWAKE_DCDC tPWR_ONH tPWR_ONL tPWR_ONBK1 tPWR_ONBK2 tPG_DCDCH tPG_DCDCL PWR_ON Threshold Rising PWR_ON Threshold Falling PWR_ON Input Current PBSTAT Output High Leakage Current PBSTAT Output Low Voltage Wake Output High Leakage Current Wake Low Output Voltage PG_DCDC Output High Leakage Current PG_DCDC Output Low Voltage PG_DCDC Threshold Voltage ON Low Time to PBSTAT Low ON High to PBSTAT High ON Low Time to WAKE High ON Low to Hard Reset PBSTAT Minimum Pulse Width WAKE High from USB or Wall Present WAKE High to Buck1 Enable PWR_ON High to WAKE High PWR_ON Low to WAKE Low PWR_ON Power-Up Blanking PWR_ON Power-Down Blanking Bucks in Regulation to PG_DCDC High Bucks Disabled to PG_DCDC Low VPWR_ON = 3V VPBSTAT = 3V IPBSTAT = 3mA VWAKE = 3V IWAKE = 3mA VPG_DCDC = 3V IPG_DCDC = 3mA (Note 13) WAKE High PBSTAT Low > tPBSTAT_PW WAKE Low > tPWR_ONBK2 Hard Reset = All Supplies Disabled 0.4 -1 -1
Status Output Pins (PBSTAT, WAKE, PG_DCDC)
Pushbutton Timing Parameters
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTC3577E/LTC3577E-1 are guaranteed to meet performance specifications from 0C to 85C. Specifications over the -40C to 85C operating temperature range are assured by design, characterization and correlation with statistical process controls.
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LTC3577/LTC3577-1 ELECTRICAL CHARACTERISTICS
Note 4: VCC is the greater of VBUS, VOUT or BAT. Note 5: Total input current is the sum of quiescent current, IBUSQ, and measured current given by VCLPROG/RCLPROG * (hCLPROG + 1). Note 6: hC/10 is expressed as a fraction of measured full charge current with indicated PROG resistor. Note 7: The current limit features of this part are intended to protect the IC from short term or intermittent fault conditions. Continuous operation above the specified maximum pin current rating may result in device degradation or failure. Note 8: The serial port is tested at rated operating frequency. Timing parameters are tested and/or guaranteed by design. Note 9: VOUT not in UVLO. Note 10: FB high, not switching. Note 11: Measured with the LDO running unity gain with output tied to feedback pin. Note 12: Dropout voltage is the minimum input to output voltage differential needed for an LDO to maintain regulation at a specified output current. When an LDO is in dropout, its output voltage will be equal to VIN - VDROP . Note 13: PG_DCDC threshold is expressed as a percentage difference from the Buck1-3 regulation voltages. The threshold is measured from Buck1-3 output rising. Note 14: IVOUT_LED is the sum of VOUT and VIN3 current due to LED driver. Note 15: The IBATQ specifications represent the total battery load assuming VINLDO1, VINLDO2, VIN12 and VIN3 are tied directly to VOUT.
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25C unless otherwise specified
Input Supply Current vs Temperature
0.8 0.7 0.6 IVBUS (mA) IVBUS (mA) 0.5 0.4 0.3 0.2 0.1 0 -50 -25 0 75 50 25 TEMPERATURE (C) 100 125 0 -50 -25 50 25 0 75 TEMPERATURE (C) 100 125 VBUS = 5V 1x MODE 0.10
Input Supply Current vs Temperature (Suspend Mode)
400 VBUS = 5V
Battery Drain Current vs Temperature
NO LOAD ON SUPPLIES, LDOS AND LED 350 BOOST DISABLED. VBAT = 3.8V, VBUS = 0V PON STATE 300 PULSE-SKIPPING MODE IBAT (A) 250 200 150 100 PON STATE Burst Mode OPERATION POFF STATE HARD RESET STATE 0 -50 -25 50 25 0 75 TEMPERATURE (C) 100 125
0.08
0.06
0.04
0.02 50
3577 G01
3577 G02
3577 G03
Input Current Limit vs Temperature
1200 1100 1000 900 800 IVBUS (mA) RON (m) 700 600 500 400 300 200 100 0 -50 -25 1x MODE 50 25 0 75 TEMPERATURE (C) 100 125 5x MODE VBUS = 5V RCLPROG = 2.1k 300 10x MODE 280 260 240 220 180 160 140 120 100
Input RON vs Temperature
IOUT = 400mA 600 500 VBUS = 4.5V IBAT (mA) VBUS = 5V VBUS = 5.5V 400 300 200 100
Charge Current vs Temperature (Thermal Regulation)
VBUS = 5V 10x MODE RPROG = 2k 50 25 75 0 TEMPERATURE (C) 100 125
0 -50
-25
50 25 0 75 TEMPERATURE (C)
100
125
0 -50 -25
3577 G04
3577 G05
3577 G06
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10
LTC3577/LTC3577-1 TYPICAL PERFORMANCE CHARACTERISTICS TA = 25C unless otherwise specified
Battery Current and Voltage vs Time
600 500 400 IBAT (mA) 300 200 CHRG VBAT 4 3 SAFETY TIMER 2 TERMINATION C/10 IBAT 3 4 TIME (HOUR) 5 6
3577 G07
Battery Regulation (Float) Voltage vs Temperature
6 5 VBAT AND VCHRG (V) 4.24 4.22 4.20 4.18 IBAT (mA) VBAT (V) 4.16 4.14 4.12 4.10 4.08 4.06 0 4.04 -50 -25 0 75 50 25 TEMPERATURE (C) 100 125 LTC3577-1 600 IBAT = 2mA LTC3577
LTC3577 IBAT vs VBAT
RCLPROG = 2.1k RPROG = 2k 500 VBUS = 5V 10x MODE 400 RISING VBAT 300 FALLING VBAT 200 100 0 2.0
1450mAhr CELL 100 VBUS = 5V RPROG = 2k RCLPROG = 2k 0 0 2 1
1
2.4
2.8
3.2 3.6 VBAT (V)
4.0
4.4
3577 G09
3577 G08
LTC3577-1 IBAT vs VBAT
600 RCLPROG = 2.1k RPROG = 2k 500 VBUS = 5V 10x MODE 400 IBAT (mA) VFWD (V) 0.15 300 FALLING VBAT 200 RISING VBAT 100 0 0.05 0.25
Forward Voltage vs Ideal Diode Current (No External FET)
VBUS = 0V TA = 25C 40 VBAT = 3.2V VBAT = 3.6V VFWD (mV) VBAT = 4.2V 35 30 25 20 15 10 5
Forward Voltage vs Ideal Diode Current (with Si2333DS External FET)
VBAT = 3.8V VBUS = 0V TA = 25C
0.20
0.10
2.0
2.4
2.8
3.2 3.6 VBAT (V)
4.0
4.4
3577 G10
0
0 0 0.2 0.4 0.6 IBAT (A) 0.8 1.0 1.2
3577 G11
0
0.2
0.4
0.6 IBAT (A)
0.8
1.0
3577 G12
Input Connect Waveform
VBUS 5V/DIV VOUT 5V/DIV IBUS 0.5A/DIV IBAT 0.5A/DIV VBAT = 3.75V IOUT = 100mA RCLPROG = 2k RPROG = 2k 1ms/DIV
3577 G13
Input Disconnect Waveform
VBUS 5V/DIV VOUT 5V/DIV IBUS 0.5A/DIV IBAT 0.5A/DIV VBAT = 3.75V IOUT = 100mA RCLPROG = 2k RPROG = 2k 1ms/DIV
3577 G14
Switching from 1x to 5x Mode
ILIM0/ILIM1 5V/DIV IBUS 0.5A/DIV IBAT 0.5A/DIV VBAT = 3.75V IOUT = 50mA RCLPROG = 2k RPROG = 2k 1ms/DIV
3577 G15
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11
LTC3577/LTC3577-1 TYPICAL PERFORMANCE CHARACTERISTICS TA = 25C unless otherwise specified
Switching from Suspend Mode to 5x Mode
ILIM0 5V/DIV VOUT 5V/DIV IBUS 0.5A/DIV IBAT 0.5A/DIV VBAT = 3.75V IOUT = 100mA RCLPROG = 2k RPROG = 2k ILIM1 = 5V 100s/DIV
3577 G16
WALL Connect Waveform
WALL 5V/DIV VOUT 5V/DIV IWALL 0.5A/DIV IBAT 0.5A/DIV VBAT = 3.75V IOUT = 100mA RPROG = 2k 1ms/DIV
3577 G17
WALL Disconnect Waveform
WALL 5V/DIV VOUT 5V/DIV IWALL 0.5A/DIV IBAT 0.5A/DIV VBAT = 3.75V IOUT = 100mA RPROG = 2k 1ms/DIV
3577 G18
Oscillator Frequency vs Temperature
2.5 2.4 2.3 2.2 fOSC (MHz) 2.1 2.0 1.9 1.8 1.7 1.6 1.5 -50 -25 50 25 0 75 TEMPERATURE (C) 100 125 VIN = 2.9V VIN = 3.8V EFFICIENCY (%) VIN = 5V 100
Step-Down Switching Regulator 1 3.3V Output Efficiency vs IOUT1
Burst Mode 90 OPERATION 80 PULSE-SKIPPING MODE EFFICIENCY (%) 70 60 50 40 30 20 10 0 0.01 0.1 1 10 IOUT (mA) VOUT1 = 3.3V VIN12 = 3.8V VIN12 = 5V 100 1000
3577 G20
Step-Down Switching Regulator 2 1.8V Output Efficiency vs IOUT2
100 90 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 IOUT (mA) VOUT2 = 1.8V VIN12 = 3.8V VIN12 = 5V 100 1000
3577 G21
Burst Mode OPERATION
PULSE-SKIPPING MODE
VIN = 2.7V
3577 G19
Step-Down Switching Regulator 3 1.2V Output Efficiency vs IOUT3
100 90 80 EFFICIENCY (%) 70 60 50 40 30 20 10 0 0.01 0.1 1 10 IOUT (mA) VOUT3 = 1.2V VIN3 = 3.8V VIN3 = 5V 100 1000
3577 G22
Step-Down Switching Regulator 3 2.5V Output Efficiency vs IOUT3
100 SHORT-CIRCUIT CURRENT (mA) 1500 1400 1300 1200 1100 1000 900 800 700 600 Burst Mode 90 OPERATION 80 EFFICIENCY (%) 70 60 50 40 30 20 10 0 0.01 0.1 1 10 IOUT (mA) VOUT3 = 2.5V VIN3 = 3.8V VIN3 = 5V 100 1000
3577 G23
Step-Down Switching Regulator Short-Circuit Current vs Temperature
Burst Mode OPERATION
800mA BUCK
PULSE-SKIPPING MODE
PULSE-SKIPPING MODE
500mA BUCK
500 -50 -25
VINx = 3.8V VINx = 5V 0 50 75 25 TEMPERATURE (C) 100 125
3577 G24
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12
LTC3577/LTC3577-1 TYPICAL PERFORMANCE CHARACTERISTICS TA = 25C unless otherwise specified
Step-Down Switching Regulator Output Transient (Burst Mode Operation)
VOUT1 50mV/DIV (AC) VOUT2 50mV/DIV (AC) VOUT3 100mV/DIV (AC) IOUT3 500mA 5mA VOUT1 = 3.3V 50s/DIV IOUT1 = 10mA VOUT2 = 1.8V IOUT2 = 20mA VOUT3 = 1.2V VOUT = VBAT = 3.8V IOUT3
3577 G25
Step-Down Switching Regulator Output Transient (Pulse-Skipping Mode)
VOUT1 50mV/DIV (AC) VOUT2 50mV/DIV (AC) VOUT3 100mV/DIV (AC) 500mA 5mA VOUT1 = 3.3V 50s/DIV IOUT1 = 30mA VOUT2 = 1.8V IOUT2 = 20mA VOUT3 = 1.2V VOUT = VBAT = 3.8V
3577 G26
Step-Down Switching Regulator Switch Impedance vs Temperature
0.9 0.8 SWITCH IMPEDANCE () 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -50 -25 0 25 75 50 TEMPERATURE (C) 100 125 800mA PMOS 800mA NMOS 500mA NMOS 500mA PMOS VINX = 3.2V
3577 G27
800mA Step-Down Switching Regulator Feedback Voltage vs Output Current
0.85 0.84 0.83 0.82 FEEDBACK (V) 0.81 0.80 0.79 0.78 0.77 0.76 0.75 0.1 1 10 100 OUTPUT CURRENT (mA) 3.8V 5V 1000
3577 G28
500mA Step-Down Switching Regulator Feedback Voltage vs Output Current
0.85 0.84 0.83 FEEDBACK (V) Burst Mode OPERATION LDO1 50mV/DIV (AC) LDO2 20mV/DIV (AC) 100mA 5mA
LDO Load Step
Burst Mode OPERATION
0.82 0.81 0.80 0.79 0.78 0.77 0.76 0.75 0.1
PULSE-SKIPPING MODE
PULSE-SKIPPING MODE
IOUT1 3.8V 5V 1 10 100 OUTPUT CURRENT (mA) 1000
3577 G29
LDO1 = 1.2V 20s/DIV LDO2 = 2.5V ILDO2 = 40mA VOUT = VBAT = 3.8V
3577 G30
OVP Connection Waveform
VBUS 5V/DIV OVGATE 5V/DIV OVGATE 5V/DIV OVP INPUT VOLTAGE 0V TO 5V STEP 5V/DIV OVP INPUT VOLTAGE 5V TO 10V STEP 5V/DIV 500s/DIV
3577 G31
OVP Protection Waveform
OVP Reconnection Waveform
VBUS 5V/DIV
VBUS 5V/DIV
500s/DIV
3577 G32
OVGATE 5V/DIV OVP INPUT VOLTAGE 10V TO 5V STEP 5V/DIV
500s/DIV
3577 G33
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13
LTC3577/LTC3577-1 TYPICAL PERFORMANCE CHARACTERISTICS TA = 25C unless otherwise specified
OVSENS Quiescent Current vs Temperature
37 VOVSENS = 5V 6.280
Rising Overvoltage Threshold vs Temperature
12
OVGATE vs OVSENS
OVSENS CONNECTED TO INPUT THROUGH 10 6.2k RESISTOR 8
QUIESCENT CURRENT (A)
35 OPV THRESHOLD (V)
6.275
33
6.270
OVGATE (V) -15 35 10 TEMPERATURE (C)
6 4
31
6.265
29
6.260
2 0 60 85
3577 G35
27 -40
-15
35 10 TEMPERATURE (C)
60
85
3577 G34
6.255 -40
0
2
4 6 INPUT VOLTAGE (V)
8
3577 G36
Input and Battery Current vs Load Current
600 500 400 EFFICIENCY (%) CURRENT (mA) ILOAD 300 200 100 0 -100 0 WALL = 0V 100 200 IBAT (DISCHARGING) 400 300 ILOAD (mA) 500 600
3577 G37
LED Driver Efficiency 10 LEDs
90 90 85 80 EFFICIENCY (%) 75 70 65 60 55 50 85 80 75 70 65 60 55 50 0 2 4 6 3V 3.6V 4.2V 4.8V 5.5V 8 10 12 14 16 18 20 ILED (mA)
3577 G38
LED Driver Efficiency 8 LEDs
RPROG = 2k RCLPROG = 2k
IIN
IBAT (CHARGING)
3V 3.6V 4.2V 4.8V 5.5V 0 2 4 6 8 10 12 14 16 18 20 ILED (mA)
35773 G39
LED Driver Efficiency 6 LEDs
90 85 80 EFFICIENCY (%) 75 70 65 60 55 50 0 2 4 6 3V 3.6V 4.2V 4.8V 5.5V 8 10 12 14 16 18 20 ILED (mA)
3577 G40
LED Driver Efficiency 4 LEDs
90 85 CURRENT LIMIT (mA) 80 EFFICIENCY (%) 75 70 65 60 55 50 0 2 4 6 3V 3.6V 4.2V 4.8V 5.5V 8 10 12 14 16 18 20 ILED (mA)
3577 G41
LED Boost Current Limit vs Temperature
1200 1100 1000 900 800 700 600 500 400 300 200 100 0 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C)
3577 G42
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14
LTC3577/LTC3577-1 TYPICAL PERFORMANCE CHARACTERISTICS TA = 25C unless otherwise specified
DAC Code vs LED Current
70 60dB = 20mA 0dB = 20A 60 RLED_FS = 20k 50 CURRENT (dB) 40 30 20 10 0 0 10 20 40 30 DAC CODE 50 60 70
3577 G43
LED Boost Start-Up Transient
96.6 96.5 MAX DUTY CYCLE (%) ILED 10mA/DIV 96.4 96.3 96.2 96.1 96.0 95.9 95.8 2ms/DIV
3577 G44
LED Boost Maximum Duty Cycle vs Temperature
VBOOST 20V/DIV IL 200mA/DIV
95.7 -50
3V 3.6V 4.2V 5.5V -25 25 0 50 75 TEMPERATURE (C) 100 125
3577 G45
LED PWM vs Constant Current Efficiency
90 80 70 EFFICIENCY (%) 60 MAX PWM 50 40 30 20 10 0 1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 LED CURRENT (A) 1.E-01
3577 G46
Battery Discharge vs Temperature
200 BATTERY DISCHARGE CURRENT (mA) 175 150 IBAT (mA) 125 100 75 50 25 0 50 VBAT = 4.1V VNTC < VTOO_HOT 5x MODE IVOUT = 0mA 60 70 90 100 80 TEMPERATURE (C) 110 120 VBUS = 0V VBUS = 5V 200 180 160 140 120 100 80 60 40 20 0
Too Hot BAT Discharge
VNTC < VTOO_HOT VBUS = 0V
CONSTANT CURRENT
3.8
3.9
4.0 VBAT (V)
4.1
4.2
3577 G48
3577 G47
PIN FUNCTIONS
ILIM0, ILIM1 (Pins 1, 2): Input Current Control Pins. ILIM0 and ILIM1 control the input current limit. See Table 1 in "USB PowerPath Controller" section. Both pins are pulled low by a weak current sink. LED_FS (Pin 3): A resistor between this pin and ground sets the full-scale output current of the ILED pin. WALL (Pin 4): Wall Adapter Present Input. Pulling this pin above 4.3V will disconnect the power path from VBUS to VOUT . The ACPR pin will also be pulled low to indicate that a wall adapter has been detected. SW3 (Pin 5): Power Transmission (Switch) Pin for StepDown Switching Regulator 3 (Buck 3). VIN3 (Pin 6): Power Input for Step-Down Switching Regulator 3. This pin should be connected to VOUT . FB3 (Pin 7): Feedback Input for Step-Down Switching Regulator 3 (Buck 3). This pin servos to a fixed voltage of 0.8V when the control loop is complete. OVSENSE (Pin 8): Overvoltage Protection Sense Input. OVSENSE should be connected through a 6.2k resistor to the input power connector and the drain of an external
3577f
15
LTC3577/LTC3577-1 PIN FUNCTIONS
N-channel MOS pass transistor. When the voltage on this pin exceeds a preset level, the OVGATE pin will be pulled to GND to disable the pass transistor and protect downstream circuitry. LED_OV (Pin 9): A resistor between this pin and the boosted LED backlight voltage sets the overvoltage limit on the boost output. If the boost voltage exceeds the programmed limit the LED boost converter will be disabled. DVCC (Pin 10): Supply Voltage for I2C Lines. This pin sets the logic reference level of the LTC3577. A UVLO circuit on the DVCC pin forces all registers to all 0s whenever DVCC is <1V. Bypass to GND with a 0.1F capacitor. SDA (Pin 11): I2C Data Input. Serial data is shifted one bit per clock to control the LTC3577. The logic level for SDA is referenced to DVCC. SCL (Pin 12): I2C Clock Input. The logic level for SCL is referenced to DVCC. OVGATE (Pin 13): Overvoltage Protection Gate Output. Connect OVGATE to the gate pin of an external N-channel MOS pass transistor. The source of the transistor should be connected to VBUS and the drain should be connected to the product's DC input connector. In the absence of an overvoltage condition, this pin is connected to an internal charge pump capable of creating sufficient overdrive to fully enhance this transistor. If an overvoltage condition is detected, OVGATE is brought rapidly to GND to prevent damage. OVGATE works in conjunction with OVSENSE to provide this protection. PWR_ON (Pin 14): Logic Input Used to Keep Buck DC/DCs Enabled After Power-Up. May also be used to enable the buck DC/DCs directly (sequence = buck1 buck2 buck3). See "Pushbutton Interface Operation" section for more information. ON (Pin 15): Pushbutton Input. A weak internal pull-up forces ON high when left floating. A normally open pushbutton is connected from ON to ground to force a low state on this pin. PBSTAT (Pin 16): Open-drain output is a de-bounced and buffered version of ON to be used for processor interrupts. WAKE (Pin 17): Open-Drain Output. The WAKE pin indicates the operating state of the buck DC/DCs. If WAKE is Hi-Z, the BUCK DC/DCs are enabled and either up or powering up. A low on WAKE indicates that the buck DC/DCs are either powered down or are powering down. See "Pushbutton Interface Operation" section for more information. SW (Pins 18,19,20): Power Transmission (Switch) Pin for LED Boost Converter. See "LED Backlight/Boost Operation" section for circuit hook-up and component selection. I2C is used to control LED driver enable. I2C default is LED driver off. PG_DCDC (Pin 21): Open-Drain Output. PG_DCDC goes high impedance 230ms after all buck DC/DCs are in regulation (within 8% of final value). ILED (Pin 22): Series LED Backlight Current Sink Output. This pin is connected to the cathode end of the series LED backlight string. The current drawn through the series LEDs can be programmed via a 6-bit 60dB DAC and dimmed via an internal 4-bit PWM function. I2C is used to control LED driver enable, brightness, gradation (soft on/soft off). I2C default is LED driver off, current = 0mA. VINLDO1 (Pin 23): Input Supply of Low Dropout Linear Regulator 1 (LDO1). This pin should be bypassed to ground with a 1F or greater ceramic capacitor. LDO2_FB (Pin 24): Feedback Voltage Input for Low Dropout Linear Regulator 2 (LDO2). LDO2 output voltage is set using an external resistor divider between LDO2 and LDO2_FB. FB2 (Pin 25): Feedback Input for Step-Down Switching Regulator 2 (Buck 2). This pin servos to a fixed voltage of 0.8V when the control loop is complete. FB1 (Pin 26): Feedback Input for Step-Down Switching Regulator 1 (Buck 1). This pin servos to a fixed voltage of 0.8V when the control loop is complete. LDO1_FB (Pin 27): Feedback Voltage Input for Low Dropout Linear Regulator 1 (LDO1). LDO1 output voltage is set using an external resistor divider between LDO1 and LDO1_FB. LDO1 (Pin 28): Output of Low Dropout Linear Regulator 1. This pin must be bypassed to ground with a 1F or greater ceramic capacitor.
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16
LTC3577/LTC3577-1 PIN FUNCTIONS
LDO2 (Pin 29): Output of Low Dropout Linear Regulator 2. This pin must be bypassed to ground with a 1F or greater ceramic capacitor. VINLDO2 (Pin 30): Input Supply of Low Dropout Linear Regulator 2 (LDO2). This pin should be bypassed to ground with a 1F or greater ceramic capacitor. SW2 (Pin 31): Power Transmission (Switch) Pin for StepDown Switching Regulator 2 (Buck 2). VIN12 (Pin 32): Power Input for Step-Down Switching Regulators 1 and 2. This pin will generally be connected to VOUT . SW1 (Pin 33): Power Transmission (Switch) Pin for StepDown Switching Regulator 1 (Buck 1). NTCBIAS (Pin 34): Output Bias Voltage for NTC. A resistor from this pin to the NTC pin will bias the NTC thermistor. NTC (Pin 35): The NTC pin connects to a battery's thermistor to determine if the battery is too hot or too cold to charge. If the battery's temperature is out of range, charging is paused until it drops back into range. A low drift bias resistor is required from NTCBIAS to NTC and a thermistor is required from NTC to ground. PROG (Pin 36): Charge Current Program and Charge Current Monitor Pin. Connecting a resistor from PROG to ground programs the charge current: ICHG = 1000V (A) RPROG either deliver system power to VOUT through the ideal diode or be charged from the battery charger. VOUT (Pin 39): Output Voltage of the PowerPath Controller and Input Voltage of the Battery Charger. The majority of the portable product should be powered from VOUT . The LTC3577 will partition the available power between the external load on VOUT and the internal battery charger. Priority is given to the external load and any extra power is used to charge the battery. An ideal diode from BAT to VOUT ensures that VOUT is powered even if the load exceeds the allotted input current from VBUS or if the VBUS power source is removed. VOUT should be bypassed with a low impedance multilayer ceramic capacitor. VBUS (Pin 40): USB Input Voltage. VBUS will usually be connected to the USB port of a computer or a DC output wall adapter. VBUS should be bypassed with a low impedance multilayer ceramic capacitor. ACPR (Pin 41): Wall Adapter Present Output (Active Low). A low on this pin indicates that the wall adapter input comparator has had its input pulled above its input threshold (typically 4.3V). This pin can be used to drive the gate of an external P-channel MOSFET to provide power to VOUT from a power source other than a USB port. VC (Pin 42): High Voltage Buck Regulator Control Pin. This pin can be used to drive the VC pin of an approved external high voltage buck switching regulator. The VC pin is designed to work with the LT(R)3480, LT3653 and LT3505. Consult factory for additional approved high voltage buck regulators. See "External HV Buck Control through the VC Pin" section for operating information. CLPROG (Pin 43): Input Current Program and Input Current Monitor Pin. A resistor from CLPROG to ground determines the upper limit of the current drawn from the VBUS pin (i.e., the input current limit). A precise fraction of the input current, hCLPROG, is sent to the CLPROG pin. The input PowerPath delivers current until the CLPROG pin reaches 2V (10x mode), 1V (5x mode) or 0.2V (1x mode). Therefore, the current drawn from VBUS will be limited to an amount given by hCLPROG and RCLPROG. In USB applications the resistor RCLPROG should be set to no less than 2.1k.
3577f
If sufficient input power is available in constant current mode, this pin servos to 1V. The voltage on this pin always represents the actual charge current. IDGATE (Pin 37): Ideal Diode Gate Connection. This pin controls the gate of an optional external P-channel MOSFET transistor used to supplement the internal ideal diode. The source of the P-channel MOSFET should be connected to VOUT and the drain should be connected to BAT. It is important to maintain high impedance on this pin and minimize all leakage paths. BAT (Pin 38): Single Cell Li-Ion Battery Pin. Depending on available power and load, a Li-Ion battery on BAT will
17
LTC3577/LTC3577-1 PIN FUNCTIONS
CHRG (Pin 44): Open-Drain Charge Status Output. The CHRG pin indicates the status of the battery charger. If CHRG is high then the charger is near the float voltage (charge current less than 1/10th programmed charge current) or charging is complete and charger is disabled. A low on CHRG indicates that the charger is enabled. For more information see the "Charge Status Indication" section. Exposed Pad (Pin 45): Ground. The exposed package pad is ground and must be soldered to the PC board for proper functionality and for maximum heat transfer.
BLOCK DIAGRAM
8 OVSENS OVERVOLTAGE PROTECTON 40 VBUS 13 OVGATE 4 WALL WALL DETECT 41 ACPR 42 VC VC CONTROL VOUT 39
43 34 35 1 2 44
CLPROG NTCBIAS NTC ILIM0 ILIM1 CHRG ILIM LOGIC
BATTERY TEMP MONITOR
OVERTEMP BATTERY SAFETY DISCHARGE HRST UVLO EN 500mA, 2.25MHz BUCK REGULATOR 0.8V
CHRGE STATUS PG 14 17 15 16 PWR_ON WAKE ON PBSTAT DVCC SDA SCL I2C LOGIC PG EN PUSHBUTTON INPUT 500mA, 2.25MHz BUCK REGULATOR
0.8V FB2 VIN3 SW3 0.8V
10 11 12
EN
800mA, 2.25MHz BUCK REGULATOR
21
PG_DCDC 230ms FALLING DELAY LED_OV SW 18,19,20 PG FB3 VINLD01 0.8V 150mA LDO1 DAC ILED LED_FS 0.8V EN 0.8V 150mA LDO2 GND 45
3577 BD
EN 40V LED BACKLIGHT BOOST CONVERTER
21
22 3
18
+ -
INPUT CURRENT LIMIT
CC/CV CHARGER
IDEAL DIODE
+ -
15mV
IDGATE
37
BAT PROG
38 36
VIN12 SW1
32 33
FB1
26
SW2
31
25 6 5
7 23
LDO1 LDO1_FB
28 27
VINLD02
30
LDO2 LDO2_FB
29 24
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LTC3577/LTC3577-1 OPERATION
PowerPath OPERATION Introduction The LTC3577 is a highly integrated power management IC that features: - PowerPath controller - Battery charger - Ideal diode - Input overvoltage protection - Pushbutton controller - Three step-down switching regulators - High voltage buck regulator VC controller - Two low dropout linear regulators - 40V LED backlight controller Designed specifically for USB applications, the PowerPath controller incorporates a precision input current limit which communicates with the battery charger to ensure
FROM AC ADAPTER (OR HIGH VOLTAGE BUCK OUTPUT) 42 4.3V (RISING) 3.2V (FALLING) 4 WALL VC OPTIONAL CONTROL FOR HIGH VOLTAGE BUCK REGS LT3480, LT3481 OR LT3505 ACPR 41
that input current does not violate the USB average input current specification. The ideal diode from BAT to VOUT guarantees that ample power is always available to VOUT even if there is insufficient or absent power at VBUS. The LTC3577 also has the ability to receive power from a wall adapter or other non-current-limited power source. Such a power supply can be connected to the VOUT pin of the LTC3577 through an external device such as a power Schottky or FET as shown in Figure 1. The LTC3577 has the unique ability to use the output, which is powered by an external supply, to charge the battery while providing power to the load. A comparator on the WALL pin is configured to detect the presence of the wall adapter and shut off the connection to the USB. This prevents reverse conduction from VOUT to VBUS when a wall adapter is present. The LTC3577 provides a VC output pin which can be used to drive the VC pin of an external high voltage buck switching regulator such as the LT3480, LT3653 or LT3505 to provide power to the VOUT pin. The VC control circuitry adjusts the regulation point of the switching regulator to
FROM USB
+ -
40 VBUS
75mV (RISING) 25mV (FALLING)
BAT
Figure 1. Simplified PowerPath Block Diagram
3577f
+ -
+ - + -
ENABLE
VOUT
VOUT
39 SYSTEM LOAD
USB CURRENT LIMIT
IDEAL DIODE CONSTANT CURRENT CONSTANT VOLTAGE BATTERY CHARGER
+ -
15mV
IDGATE
37
OPTIONAL EXTERNAL IDEAL DIODE PMOS
BAT
38
+
3577 F01
Li-Ion
19
LTC3577/LTC3577-1 OPERATION
a small voltage above the BAT pin voltage. This control method provides a high input voltage, high efficiency battery charger and PowerPath function. The LTC3577 also includes a pushbutton input to control the three synchronous step-down switching regulators and system reset. The three 2.25MHz constant frequency current mode step-down switching regulators provide 500mA, 500mA and 800mA each and support 100% duty cycle operation as well as Burst Mode operation for high efficiency at light load. No external compensation components are required for the switching regulators. The onboard LED backlight boost circuitry can drive up to 10 series LEDs and includes versatile digital dimming via the I2C input. The I2C input also controls two 150mA low dropout (LDO) linear regulators. All regulators can be programmed for a minimum output voltage of 0.8V and can be used to power a microcontroller core, microcontroller I/O, memory or other logic circuitry. USB PowerPath Controller The input current limit and charge control circuits of the LTC3577 are designed to limit input current as well as control battery charge current as a function of IVOUT . VOUT drives the combination of the external load, the three step-down switching regulators, two LDOs, LED backlight and the battery charger. If the combined load does not exceed the programmed input current limit, VOUT will be connected to VBUS through an internal 200m P-channel MOSFET. If the combined load at VOUT exceeds the programmed input current limit, the battery charger will reduce its charge current by the amount necessary to enable the external load to be satisfied while maintaining the programmed input current. Even if the battery charge current is set to exceed the allowable USB current, the average input current USB specification will not be violated. Furthermore, load current at VOUT will always be prioritized and only excess available current will be used to charge the battery. The current out of the CLPROG pin is a fraction (1/hCLPROG) of the VBUS current. When a programming resistor is connected from CLPROG to GND, the voltage on CLPROG represents the input current: IVBUS =IBUSQ + VCLPROG *h RCLPROG CLPROG
where IBUSQ and hCLPROG are given in the Electrical Characteristics table. The input current limit is programmed by the ILIM0 and ILIM1 pins. The LTC3577 can be configured to limit input current to one of several possible settings as well as be deactivated (USB suspend). The input current limit will be set by the appropriate servo voltage and the resistor on CLPROG according to the following expression: IVBUS =IBUSQ + IVBUS =IBUSQ + IVBUS =IBUSQ + 0.2V RCLPROG 1V RCLPROG 2V RCLPROG * h CLPROG (1x Mode) * h CLPROG ( 5x Mode) * h CLPROG (10x Mode)
Under worst-case conditions, the USB specification for average input current will not be violated with an RCLPROG resistor of 2.1k or greater. Table 1 shows the available settings for the ILIM0 and ILIM1 pins:
Table 1. Controlled Input Current Limit
ILIM1 0 0 1 1 ILIM0 0 1 0 1 IBUS(LIM) 100mA (1x) 1A (10x) Suspend 500mA (5x)
Notice that when ILIM0 is high and ILIM1 is low, the input current limit is set to a higher current limit for increased charging and current availability at VOUT . This mode is typically used when there is a higher power, non-USB source available at the VBUS pin.
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LTC3577/LTC3577-1 OPERATION
Ideal Diode from BAT to VOUT The LTC3577 has an internal ideal diode as well as a controller for an optional external ideal diode. Both the internal and the external ideal diodes respond quickly whenever VOUT drops below BAT. If the load increases beyond the input current limit, additional current will be pulled from the battery via the ideal diodes. Furthermore, if power to VBUS (USB) or VOUT (external wall power or high voltage regulator) is removed, then all of the application power will be provided by the battery via the ideal diodes. The ideal diodes are fast enough to keep VOUT from dropping significantly with just the recommended output capacitor (see Figure 2). The ideal diode consists of a precision amplifier that enables an on-chip P-channel MOSFET whenever the voltage at VOUT is approximately 15mV (VFWD) below the voltage at BAT. The resistance of the internal ideal diode is approximately 200m. If this is sufficient for the application, then no external components are necessary. However, if lower resistance is needed, an external P-channel MOSFET can be added from BAT to VOUT. The IDGATE pin of the LTC3577 drives the gate of the external P-channel MOSFET for automatic ideal diode control. The source of the MOSFET should be connected to VOUT and the drain should be connected to BAT. Capable of driving a 1nF load, the IDGATE pin can control an external P-channel MOSFET having extremely low on-resistance. Using the WALL Pin to Detect the Presence of an External Power Source The WALL input pin can be used to identify the presence of an external power source (particularly one that is not subject to a fixed current limit like the USB VBUS input). Typically, such a power supply would be a 5V wall adapter output or the low voltage output of a high voltage buck regulator (specifically, LT3480, LT3653 or LT3505). When the wall adapter output (or buck regulator output) is connected directly to the WALL pin, and the voltage exceeds the WALL pin threshold, the USB power path (from VBUS to VOUT) will be disconnected. Furthermore, the ACPR pin will be pulled low. In order for the presence of an external power supply to be acknowledged, both of the following conditions must be satisfied: 1. The WALL pin voltage must exceed approximately 4.3V. 2. The WALL pin voltage must be greater than 75mV above the BAT pin voltage. The input power path (between VBUS and VOUT) is reenabled and the ACPR pin is pulled high when either of the following conditions is met: 1. The WALL pin voltage falls to within 25mV of the BAT pin voltage. 2. The WALL pin voltage falls below 3.2V.
4.0V VOUT 3.8V 3.6V 500mA CHARGE IBAT 0 DISCHARGE 1A 0A VBAT = 3.8V VBUS = 5V 5x MODE COUT = 10F 10s/DIV
3577 F02
Each of these thresholds is suitably filtered in time to prevent transient glitches on the WALL pin from falsely triggering an event. External HV Buck Control Through the VC Pin The WALL, ACPR and VC pins can be used in conjunction with an external high voltage buck regulator such as the LT3480, LT3505 or LT3653 to provide power directly to the VOUT pin as shown in Figures 3 to 5 (Consult factory for complete list of approved high voltage buck regulators). When the WALL pin voltage exceeds 4.3V, VC pin control circuitry is enabled and drives the VC pin of the LT3480, LT3505 or LT3653. The VC pin control circuitry is designed so that no compensation components are required on the VC node. The voltage at the VOUT pin is regulated to the larger of (BAT + 300mV) or 3.6V as shown in Figure 6.
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-500mA IVOUT LOAD
Figure 2. Ideal Diode Transient Response
21
LTC3577/LTC3577-1 OPERATION
HVIN 8V TO 38V (TRANSIENTS TO 60V) 4 4.7F 68nF VIN BOOST 2 0.47F 6.8H 499k 22F 100k 150k LT3480 5 3 RUN/SS SW 10 RT 40.2k 1 7 NC BD 8 6 NC FB GND VC 11 9 Si2333DS UP TO 2A VOUT COUT Si2333DS (OPT)
DFLS240L
LT3480 HIGH VOLTAGE BUCK CIRCUITRY
42
4
41
VC WALL ACPR 39 VOUT 37 LTC3577 IDGATE 38 BAT
+
BAT Li-Ion
3577 F03
Figure 3. LT3480 Buck Control Using VC (800kHz Switching)
HVIN 8V TO 36V 1F
3 68nF 150k 4 BZT52C16T 20k 806k
VIN
BOOST
1 0.1F
1N4148 6.8H 49.9k 10F 10.0k
LT3505 2 SW SHDN
MBRM140 7
6 RT GND
FB VC 8
LT3505 HIGH VOLTAGE BUCK CIRCUITRY
5, 9
Si2333DS
UP TO 1.2A VOUT COUT Si2333DS (OPT)
42
4
41
VC WALL ACPR 39 VOUT 37 LTC3577 IDGATE 38 BAT
+
BAT Li-Ion
3577 F04
Figure 4. LT3505 Buck Control Using VC (2.2MHz Switching with Frequency Foldback)
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22
LTC3577/LTC3577-1 OPERATION
HVIN 7.5V TO 30V (TRANSIENTS TO 60V) 1 4.7F 60V VIN BOOST SW LT3653 324k 4 9 ILIM GND 3 HIGH VOLTAGE BUCK CIRCUITRY 42 4 41 ISENSE VOUT 2 UP TO 1.2A VOUT COUT Si2333DS (OPT) 6 5 7 8 0.1F 4.7H 10V DFLS240L
VC HVOK
VC WALL ACPR 39 VOUT 37 LTC3577 IDGATE 38 BAT
+
BAT Li-Ion
3577 F05
Figure 5. LT3653 Buck Control Using VC
5.0
4.5
VOUT (V)
4.0
3.5 IO = 0.0A IO = 0.75A IO = 1.5A BAT 3 3.5 BAT (V) 4 4.5
3577 F06
3.0
2.5 2.5
Figure 6. VOUT Voltage vs Battery Voltage (LT3480)
5.0
4.5
VOUT (V)
4.0
3.5
3.0
IO = 0.0A IO = 0.6A BAT 3 3.5 BAT (V) 4 4.5
3577 F07
2.5 2.5
Figure 7. VOUT Voltage vs Battery Voltage (LT3505)
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23
LTC3577/LTC3577-1 OPERATION
The feedback network of the high voltage buck regulator should be set to generate an output voltage higher than 4.4V (be sure to include the output voltage tolerance of the buck regulator). The VC control of the LTC3577 overdrives the local VC control of the external high voltage buck. Therefore, once the VC control is enabled, the output voltage is set independent of the buck regulator feedback network. This technique provides a significant efficiency advantage over the use of a 5V buck to drive the battery charger. With a simple 5V buck output driving VOUT , battery charger efficiency is approximately: CHARGER = BUCK * VBAT 5V VBUS Undervoltage Lockout (UVLO) and Undervoltage Current Limit (UVCL) An internal undervoltage lockout circuit monitors VBUS and keeps the input current limit circuitry off until VBUS rises above the rising UVLO threshold (3.8V) and at least 50mV above VOUT . Hysteresis on the UVLO turns off the input current limit if VBUS drops below 3.7V or 50mV below VOUT . When this happens, system power at VOUT will be drawn from the battery via the ideal diode. To minimize the possibility of oscillation in and out of UVLO when using resistive input supplies, the input current limit is reduced as VBUS falls below 4.45V (typ). Battery Charger The LTC3577 includes a constant-current/constant-voltage battery charger with automatic recharge, automatic termination by safety timer, low voltage trickle charging, bad cell detection and thermistor sensor input for out of temperature charge pausing. When a battery charge cycle begins, the battery charger first determines if the battery is deeply discharged. If the battery voltage is below VTRKL, typically 2.85V, an automatic trickle charge feature sets the battery charge current to 10% of the programmed value. If the low voltage persists for more than one-half hour, the battery charger automatically terminates. Once the battery voltage is above 2.85V, the battery charger begins charging in full power constant current mode. The current delivered to the battery will try to reach 1000V/RPROG. Depending on available input power and external load conditions, the battery charger may or may not be able to charge at the full programmed rate. The external load will always be prioritized over the battery charge current. The USB current limit programming will always be observed and only additional current will be available to charge the battery. When system loads are light, battery charge current will be maximized. Charge Termination The battery charger has a built-in safety timer. When the battery voltage approaches the float voltage, the charge current begins to decrease as the LTC3577 enters constant voltage mode. Once the battery charger detects that it has entered constant voltage mode, the four hour safety
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where BUCK is the efficiency of the high voltage buck regulator and 5V is the output voltage of the buck regulator. With a typical buck efficiency of 87% and a typical battery voltage of 3.8V, the total battery charger efficiency is approximately 66%. Assuming a 1A charge current, this works out to nearly 2W of power dissipation just to charge the battery! With the VC control technique, battery charger efficiency is approximately: CHARGER = BUCK * VBAT 0.3V + VBAT
With the same assumptions as above, the total battery charger efficiency is approximately 81%. This example works out to just 900mW of power dissipation. For applications, component selection and board layout information beyond those listed here please refer to the respective high voltage buck regulator data sheet. Suspend Mode When ILIM0 is pulled low and ILIM1 is pulled high the LTC3577 enters suspend mode to comply with the USB specification. In this mode, the power path between VBUS and VOUT is put in a high impedance state to reduce the VBUS input current to 50A. If no other power source is available to drive WALL and VOUT , the system load connected to VOUT is supplied through the ideal diodes connected to BAT.
24
LTC3577/LTC3577-1 OPERATION
timer is started. After the safety timer expires, charging of the battery will terminate and no more current will be delivered. Automatic Recharge After the battery charger terminates, it will remain off drawing only microamperes of current from the battery. If the portable product remains in this state long enough, the battery will eventually self discharge. To ensure that the battery is always topped off, a charge cycle will automatically begin when the battery voltage falls below VRECHRG (typically 4.0V for LTC3577-1 and 4.1V for LTC3577). In the event that the safety timer is running when the battery voltage falls below VRECHRG, the timer will reset back to zero. To prevent brief excursions below VRECHRG from resetting the safety timer, the battery voltage must be below VRECHRG for more than 1.3ms. The charge cycle and safety timer will also restart if the VBUS UVLO cycles low and then high (e.g., VBUS, is removed and then replaced). Charge Current The charge current is programmed using a single resistor from PROG to ground. 1/1000th of the battery charge current is delivered to PROG which will attempt to servo to 1.000V . Thus, the battery charge current will try to reach 1000 times the current in the PROG pin. The program resistor and the charge current are calculated using the following equations: RPROG = 1000V 1000V , ICHG = ICHG RPROG Thermal Regulation To prevent thermal damage to the IC or surrounding components, an internal thermal feedback loop will automatically decrease the programmed charge current if the die temperature rises to approximately 110C. Thermal regulation protects the LTC3577 from excessive temperature due to high power operation or high ambient thermal conditions and allows the user to push the limits of the power handling capability with a given circuit board design without risk of damaging the LTC3577 or external components. The benefit of the LTC3577 thermal regulation loop is that charge current can be set according to actual conditions rather than worst-case conditions with the assurance that the battery charger will automatically reduce the current in worst-case conditions. Charge Status Indication The CHRG pin indicates the status of the battery charger. An open-drain output, the CHRG pin can drive an indicator LED through a current limiting resistor for human interfacing or simply a pull-up resistor for microprocessor interfacing. When charging begins, CHRG is pulled low and remains low for the duration of a normal charge cycle. When charging is complete, i.e., the charger enters constant voltage mode and the charge current has dropped to one-tenth of the programmed value, the CHRG pin is released (high impedance). The CHRG pin does not respond to the C/10 threshold if the LTC3577 is in input current limit. This prevents false end-of-charge indications due to insufficient power available to the battery charger. Even though charging is stopped during an NTC fault, the CHRG pin will stay low indicating that charging is not complete. Battery Charger Stability Considerations The LTC3577's battery charger contains both a constantvoltage and a constant-current control loop. The constantvoltage loop is stable without any compensation when a battery is connected with low impedance leads. Excessive lead length, however, may add enough series inductance to require a bypass capacitor of at least 1F from BAT to GND. Furthermore, a 4.7F capacitor in series with a 0.2 to 1 resistor from BAT to GND is required to keep ripple voltage low when the battery is disconnected.
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In either the constant-current or constant-voltage charging modes, the PROG pin voltage will be proportional to the actual charge current delivered to the battery. Therefore, the actual charge current can be determined at any time by monitoring the PROG pin voltage and using the following equation: IBAT = VPROG * 1000 R PROG
In many cases, the actual battery charge current, IBAT , will be lower than ICHG due to limited input current available and prioritization with the system load drawn from VOUT.
25
LTC3577/LTC3577-1 OPERATION
High value, low ESR multilayer ceramic chip capacitors reduce the constant-voltage loop phase margin, possibly resulting in instability. Ceramic capacitors up to 22F may be used in parallel with a battery, but larger ceramics should be decoupled with 0.2 to 1 of series resistance. In constant-current mode, the PROG pin is in the feedback loop rather than the battery voltage. Because of the additional pole created by any PROG pin capacitance, capacitance on this pin must be kept to a minimum. With no additional capacitance on the PROG pin, the battery charger is stable with program resistor values as high as 25k. However, additional capacitance on this node reduces the maximum allowed program resistor. The pole frequency at the PROG pin should be kept above 100kHz. Therefore, if the PROG pin has a parasitic capacitance, CPROG, the following equation should be used to calculate the maximum resistance value for RPROG: RPROG 1 2 * 100kHz * C PROG
NTCBIAS 34 RNOM 100k NTC 35 0.76 * NTCBIAS NTC BLOCK LTC3577
-
TOO_COLD
+
RNTC 100k 0.35 * NTCBIAS
-
TOO_HOT
+
0.26 * NTCBIAS
+
BATTERY OVERTEMP
-
3577 F08
Figure 8. Typical NTC Thermistor Circuit
NTC Thermistor and Battery Voltage Reduction The battery temperature is measured by placing a negative temperature coefficient (NTC) thermistor close to the battery pack. To use this feature connect the NTC thermistor, RNTC, between the NTC pin and ground and a bias resistor, RNOM, from NTCBIAS to NTC. RNOM should be a 1% resistor with a value equal to the value of the chosen NTC thermistor at 25C (R25). The LTC3577 will pause charging when the resistance of the NTC thermistor drops to 0.54 times the value of R25 or approximately 54k (for a Vishay "Curve 1" thermistor, this corresponds to approximately 40C). If the battery charger is in constant voltage (float) mode, the safety timer also pauses until the thermistor indicates a return to a valid temperature. As the temperature drops, the resistance of the NTC thermistor rises. The LTC3577 is also designed to pause charging when the value of the NTC thermistor increases to 3.17 times the value of R25. For a Vishay "Curve 1" thermistor this resistance, 317k, corresponds to approximately 0C. The hot and cold comparators each have approximately 3C of hysteresis to prevent oscillation about the trip point. The typical NTC circuit is shown in Figure 8.
To improve safety and reliability the battery voltage is reduced when the battery temperature becomes excessively high. When the resistance of the NTC thermistor drops to about 0.35 times the value of R25 or approximately 35k (for a Vishay "Curve 1" thermistor, this corresponds to approximately 50C) the NTC enables circuitry to monitor the battery voltage. If the battery voltage is above the battery discharge threshold (about 3.9V) then the battery discharge circuitry is enabled and draws about 140mA from the battery when VBUS = 0V and about 180mA when VBUS = 5V. As the battery voltage approaches the discharge threshold the discharge current is linearly reduced until it reaches 0mA at which point the discharge circuitry is disabled. Reducing the discharge current in this fashion keeps the circuit from causing oscillations on VBAT due to battery ESR. When the charger is disabled an internal watchdog timer samples the NTC thermistor for about 150s every 150ms and will enable the battery monitoring circuitry if the battery temperature exceeds the NTC TOO_HOT threshold. If adding a capacitor to the NTC pin for filtering the time constant must be much less than 150s so that the NTC pin can settle to its final value during the sampling period. A time constant of less than 10s is recommended. Once the battery monitoring circuitry is enabled it will remain enabled and monitoring the battery voltage until the battery
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26
LTC3577/LTC3577-1 OPERATION
temperature falls back below the discharge temperature threshold. The battery discharge circuitry is only enabled if the battery voltage is greater than the battery discharge threshold. Alternate NTC Thermistors and Biasing The LTC3577 provides temperature qualified charging if a grounded thermistor and a bias resistor are connected to NTC. By using a bias resistor whose value is equal to the room temperature resistance of the thermistor (R25) the upper and lower temperatures are pre-programmed to approximately 40C and 0C, respectively (assuming a Vishay "Curve 1" thermistor). The upper and lower temperature thresholds can be adjusted by either a modification of the bias resistor value or by adding a second adjustment resistor to the circuit. If only the bias resistor is adjusted, then either the upper or the lower threshold can be modified but not both. The other trip point will be determined by the characteristics of the thermistor. Using the bias resistor in addition to an adjustment resistor, both the upper and the lower temperature trip points can be independently programmed with the constraint that the difference between the upper and lower temperature thresholds cannot decrease. Examples of each technique follows. NTC thermistors have temperature characteristics which are indicated on resistance-temperature conversion tables. The Vishay-Dale thermistor NTHS0603N011-N1003F used , in the following examples, has a nominal value of 100k and follows the Vishay "Curve 1" resistance-temperature characteristic. In the following explanation, this notation is used. R25 = Value of the thermistor at 25C RNTC|COLD = Value of thermistor at the cold trip point RNTC|HOT = Value of the thermistor at the hot trip point rCOLD = Ratio of RNTC|COLD to R25 rHOT= Ratio of RNTC|HOT to R25 RNOM = Primary thermistor bias resistor (see Figure 9) R1 = Optional temperature range adjustment resistor (see Figure 9)
NTCBIAS 34 RNOM 105k NTC 35 R1 12.7k 0.76 * NTCBIAS NTC BLOCK LTC3577
-
TOO_COLD
+
-
RNTC 100k TOO_HOT 0.35 * NTCBIAS
+
0.26 * NTCBIAS
+
BATTERY OVERTEMP
-
3577 F09
Figure 9. NTC Thermistor Circuit with Additional Bias Resistor
The trip points for the LTC3577's temperature qualification are internally programmed at 0.35 * VNTC for the hot threshold and 0.76 * VNTC for the cold threshold. Therefore, the hot trip point is set when: RNTC|HOT RNOM + RNTC|HOT * NTCBIAS = 0.35 * NTCBIAS
and the cold trip point is set when: RNTC|COLD RNOM + RNTC|COLD * NTCBIAS = 0.76 * NTCBIAS
Solving these equations for RNTC|COLD and RNTC|HOT results in the following: RNTC|HOT = 0.538 * RNOM and RNTC|COLD = 3.17 * RNOM By setting RNOM equal to R25, the above equations result in rHOT = 0.538 and rCOLD = 3.17. Referencing these ratios to the Vishay Resistance-Temperature Curve 1 chart gives a hot trip point of about 40C and a cold trip point of about 0C. The difference between the hot and cold trip points is approximately 40C.
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27
LTC3577/LTC3577-1 OPERATION
By using a bias resistor, RNOM, different in value from R25, the hot and cold trip points can be moved in either direction. The temperature span will change somewhat due to the non-linear behavior of the thermistor. The following equations can be used to easily calculate a new value for the bias resistor: r RNOM = HOT * R25 0.538 r RNOM = COLD * R25 3.17 where rHOT and rCOLD are the resistance ratios at the desired hot and cold trip points. Note that these equations are linked. Therefore, only one of the two trip points can be chosen, the other is determined by the default ratios designed in the IC. Consider an example where a 60C hot trip point is desired. From the Vishay Curve 1 R-T characteristics, rHOT is 0.2488 at 60C. Using the above equation, RNOM should be set to 46.4k. With this value of RNOM, the cold trip point is about 16C. Notice that the span is now 44C rather than the previous 40C. This is due to the decrease in "temperature gain" of the thermistor as absolute temperature increases. The upper and lower temperature trip points can be independently programmed by using an additional bias resistor as shown in Figure 9. The following formulas can be used to compute the values of RNOM and R1: -r r RNOM = COLD HOT * R25 2.714 R1= 0.536 * RNOM - rHOT * R25 For example, to set the trip points to 0C and 45C with a Vishay Curve 1 thermistor choose RNOM = 3.266 - 0.4368 * 100k = 104.2k 2.714 Overvoltage Protection (OVP) The LTC3577 can protect itself from the inadvertent application of excessive voltage to VBUS or WALL with just two external components: an N-channel FET and a 6.2k resistor. The maximum safe overvoltage magnitude will be determined by the choice of the external NMOS and its associated drain breakdown voltage. The overvoltage protection module consists of two pins. The first, OVSENS, is used to measure the externally applied voltage through an external resistor. The second, OVGATE, is an output used to drive the gate pin of an external FET. The voltage at OVSENS will be lower than the OVP input voltage by (IOVSENS * 6.2k) due to the OVP circuit's quiescent current. The OVP input will be 200mV to 400mV higher than OVSENS under normal operating conditions. When OVSENS is below 6V, an internal charge pump will drive OVGATE to approximately 1.88 * OVSENS. This will enhance the N-channel FET and provide a low impedance connection to VBUS or WALL which will, in turn, power the LTC3577. If OVSENS should rise above 6V (6.35V OVP input) due to a fault or use of an incorrect wall adapter, OVGATE will be pulled to GND, disabling the external FET to protect downstream circuitry. When the voltage drops below 6V again, the external FET will be re-enabled. In an overvoltage condition, the OVSENS pin will be clamped at 6V. The external 6.2k resistor must be sized appropriately to dissipate the resultant power. For example, a 1/10W 6.2k resistor can have at most PMAX * 6.2k = 24V applied across its terminals. With the 6V at OVSENS, the maximum overvoltage magnitude that this resistor can withstand is 30V. A 1/4W 6.2k resistor raises this value to 45V. The charge pump output on OVGATE has limited output drive capability. Care must be taken to avoid leakage on this pin, as it may adversely affect operation. Dual Input Overvoltage Protection It is possible to protect both VBUS and WALL from overvoltage damage with several additional components, as shown in Figure 10. Schottky diodes D1 and D2 pass the larger of V1 and V2 to R1 and OVSENS. If either V1 or V2 exceeds 6V plus VF(SCHOTTKY), OVGATE will be pulled to GND and both the WALL and USB inputs will be protected.
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the nearest 1% value is 105k. R1 = 0.536 * 105k - 0.4368 * 100k = 12.6k the nearest 1% value is 12.7k. The final solution is shown in Figure 9 and results in an upper trip point of 45C and a lower trip point of 0C.
28
LTC3577/LTC3577-1 OPERATION
MN1 V1 WALL OVGATE LTC3577 V2 D2 D1 MN2 C1 VBUS R1 500k USB/WALL ADAPTER MP1 D1 R2 6.2k MN1 VBUS C1 LTC3577 OVGATE OVSENS
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R1 OVSENS
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D1: 5.6V ZENER MP1: Si2323DS, BVDSS = 20V VBUS POSITIVE PROTECTION UP TO BVDSS OF MN1 VBUS NEGATIVE PROTECTION UP TO BVDSS OF MP1
Figure 10. Dual Input Overvoltage Protection
Figure 11. Dual Polarity Voltage Protection
Each input is protected up to the drain-source breakdown, BVDSS, of MN1 and MN2. R1 must also be rated for the power dissipated during maximum overvoltage. See the "Overvoltage Protection" section for an explanation of this calculation. Table 2 shows some NMOS FETs that are suitable for overvoltage protection.
Table 2. Recommended Overvoltage FETs
NMOS FET Si1472DH Si2302ADS Si2306BDS Si2316BDS IRLML2502 BVDSS 30V 20V 30V 30V 20V RON 82m 60m 65m 80m 35m PACKAGE SC70-6 SOT-23 SOT-23 SOT-23 SOT-23
VINLDOx LDOxEN 0 1
MP LDOx R1 LDOx_FB 0.8V GND COUT LDOx OUTPUT
R2
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Figure 12. LDO Application Circuit
Reverse Input Voltage Protection The LTC3577 can also be easily protected against the application of reverse voltage as shown in Figure 10. D1 and R1 are necessary to limit the maximum VGS seen by MP1 during positive overvoltage events. D1's breakdown voltage must be safely below MP1's BVGS. The circuit shown in Figure 11 offers forward voltage protection up to MN1's BVDSS and reverse voltage protection up to MP1's BVDSS. LOW DROPOUT LINEAR REGULATOR OPERATION LDO Operation and Voltage Programming The LTC3577 contains two 150mA adjustable output LDO regulators. To enable the LDOs write a 1 to the LDO1EN and/or LDO2EN I2C registers. The LDOs can be disabled three ways: 1) Write a 0 to the LDO1EN and LDO2EN registers; 2) Bring DVCC below the DVCC undervoltage threshold; 3) Enter the power-down pushbutton state.
The LDOs are further disabled if VOUT falls below the VOUT UVLO threshold and cannot be enabled until the UVLO condition is removed. When disabled all LDO circuitry is powered off leaving only a few nanoamps of leakage current on the LDO supply. The LDO outputs are individually pulled to ground through internal resistors when disabled. The power good status bits of LDO1 and LDO2 are available in I2C through the read-back registers PGLDO[1] and PGLDO[2] for LDO1 and LDO2 respectively. The power good comparators for both LDOs are sampled when the I2C port receives the correct I2C read address. Figure 12 shows the LDO application circuit. The fullscale output voltage for each LDO is programmed using a resistor divider from the LDO output (LDO1 or LDO2) connected to the feedback pins (LDO1_FB or LDO2_FB) such that: R1 VLDOx = 0.8V * + 1 R2
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LTC3577/LTC3577-1 OPERATION
For stability, each LDO output must be bypassed to ground with a minimum 1F ceramic capacitor (COUT). LDO Operating as a Current Limited Switch The LDO can be used as a current limited switch by simply connecting the LDOx_FB input to ground. In this case the LDOx output will be pulled up to VINLDOx through the LDO's internal current limit (about 300mA). Enabling the LDO via the I2C interface effectively connects LDOx and VINLDOx, while disabling the LDO disconnected LDOx from VINLDOx. STEP-DOWN SWITCHING REGULATOR OPERATION Introduction The LTC3577 includes three 2.25MHz constant frequency current mode step-down switching regulators providing 500mA, 500mA and 800mA each. All step-down switching regulators can be programmed for a minimum output voltage of 0.8V and can be used to power a microcontroller core, microcontroller I/O, memory or other logic circuitry. All step-down switching regulators support 100% duty cycle operation (low dropout mode) when the input voltage drops very close to the output voltage and are also capable of Burst Mode operation for highest efficiencies at light loads. Burst Mode operation is individually selectable for each step-down switching regulator through the I2C register bits BK1BRST, BK2BRST and BK3BRST. The step-down switching regulators also include soft-start to limit inrush current when powering on, short-circuit current protection, and switch node slew limiting circuitry to reduce EMI radiation. No external compensation components are required for the switching regulators. The regulators are sequenced up and down together through the pushbutton interface (see "Pushbutton Interface" section for more information). It is recommended that the step-down switching regulator input supplies (VIN12 and VIN3) be connected to the system supply pin (VOUT). This is recommended because the undervoltage lockout circuit on the VOUT pin (VOUT UVLO) disables the stepdown switching regulators when the VOUT voltage drops below the VOUT UVLO threshold. If driving the step-down switching regulator input supplies from a voltage other than VOUT the regulators should not be operated outside the specified operating range as operation is not guaranteed beyond this range. Output Voltage Programming Figure 13 shows the step-down switching regulator application circuit. The full-scale output voltage for each step-down switching regulator is programmed using a resistor divider from the step-down switching regulator output connected to the feedback pins (FB1, FB2 and FB3) such that: R1 VOUTx = 0.8V * + 1 R2 Typical values for R1 are in the range of 40k to 1M. The capacitor CFB cancels the pole created by feedback resistors and the input capacitance of the FB pin and also helps to improve transient response for output voltages much greater than 0.8V. A variety of capacitor sizes can be used for CFB but a value of 10pF is recommended for most applications. Experimentation with capacitor sizes between 2pF and 22pF may yield improved transient response.
VIN
EN MODE PWM SLEW CONTROL
MP MN
SWx
L VOUTx CFB R1 COUT
FBx 0.8V GND
R2
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Figure 13. Step-Down Switching Regulator Application Circuit
PG_DCDC Operation The PG_DCDC pin is an open-drain output used to indicate that all step-down switching regulators are enabled and have reached their final regulation voltage. A 230ms delay is included from the time all switching regulators reach 92% of their regulation value to allow a system controller ample time to reset itself. PG_DCDC may be used as a power-on reset to a microprocessor powered by the step-down switching regulators. PG_DCDC is an
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open-drain output and requires a pull-up resistor to an appropriate power source. Optimally the pull-up resistor is connected to one of the step-down switching regulator output voltages so that power is not dissipated while the regulators are disabled. Operating Modes The step-down switching regulators include two possible operating modes to meet the noise/power needs of a variety of applications. In pulse-skipping mode, an internal latch is set at the start of every cycle, which turns on the main P-channel MOSFET switch. During each cycle, a current comparator compares the peak inductor current to the output of an error amplifier. The output of the current comparator resets the internal latch, which causes the main P-channel MOSFET switch to turn off and the N-channel MOSFET synchronous rectifier to turn on. The N-channel MOSFET synchronous rectifier turns off at the end of the 2.25MHz cycle or if the current through the N-channel MOSFET synchronous rectifier drops to zero. Using this method of operation, the error amplifier adjusts the peak inductor current to deliver the required output power. All necessary compensation is internal to the step-down switching regulator requiring only a single ceramic output capacitor for stability. At light loads in pulse-skipping mode, the inductor current may reach zero on each pulse which will turn off the N-channel MOSFET synchronous rectifier. In this case, the switch node (SW1, SW2 or SW3) goes high impedance and the switch node voltage will "ring." This is discontinuous operation, and is normal behavior for a switching regulator. At very light loads in pulse-skipping mode, the step-down switching regulators will automatically skip pulses as needed to maintain output regulation. At high duty cycle (VOUTX approaching VINX) it is possible for the inductor current to reverse at light loads causing the stepped down switching regulator to operate continuously. When operating continuously, regulation and low noise output voltage are maintained, but input operating current will increase to a few milliamps. In Burst Mode operation, the step-down switching regulators automatically switch between fixed frequency PWM operation and hysteretic control as a function of the load current. At light loads the step-down switching regulators control the inductor current directly and use a hysteretic control loop to minimize both noise and switching losses. While operating in Burst Mode operation, the output capacitor is charged to a voltage slightly higher than the regulation point. The step-down switching regulator then goes into sleep mode, during which the output capacitor provides the load current. In sleep mode, most of the switching regulator's circuitry is powered down, helping conserve battery power. When the output voltage drops below a pre-determined value, the step-down switching regulator circuitry is powered on and another burst cycle begins. The sleep time decreases as the load current increases. Beyond a certain load current point (about 1/4 rated output load current) the step-down switching regulators will switch to a low noise constant frequency PWM mode of operation, much the same as pulse-skipping operation at high loads. For applications that can tolerate some output ripple at low output currents, Burst Mode operation provides better efficiency than pulse-skipping at light loads. The step-down switching regulators allow mode transition on-the-fly, providing seamless transition between modes even under load. This allows the user to switch back and forth between modes to reduce output ripple or increase low current efficiency as needed. Burst Mode operation is individually selectable for each step-down switching regulator through the I2C register bits BK1BRST, BK2BRST and BK3BRST. Shutdown The step-down switching regulators are shut down when the pushbutton circuitry is in the power-down, power off or hard reset states. In shutdown all circuitry in the step-down switching regulator is disconnected from the switching regulator input supply leaving only a few nanoamps of leakage current. The step-down switching regulator outputs are individually pulled to ground through internal 10k resistors on the switch pin (SW1, SW2 or SW3) when in shutdown. Dropout Operation It is possible for a step-down switching regulator's input voltage to approach its programmed output voltage (e.g., a battery voltage of 3.4V with a programmed output voltage of 3.3V). When this happens, the PMOS switch duty cycle
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increases until it is turned on continuously at 100%. In this dropout condition, the respective output voltage equals the regulator's input voltage minus the voltage drops across the internal P-channel MOSFET and the inductor. Soft-Start Operation Soft-start is accomplished by gradually increasing the peak inductor current for each step-down switching regulator over a 500s period. This allows each output to rise slowly, helping minimize inrush current required to charge up the switching regulator output capacitor. A soft-start cycle occurs whenever a given switching regulator is enabled. A soft-start cycle is not triggered by changing operating modes. This allows seamless output transition when actively changing between operating modes. Slew Rate Control The step-down switching regulators contain new patent pending circuitry to limit the slew rate of the switch node (SW1, SW2 and SW3). This new circuitry is designed to transition the switch node over a period of a few nanoseconds, significantly reducing radiated EMI and conducted supply noise while maintaining high efficiency. Since slowing the slew rate of the switch nodes causes efficiency loss, the slew rate of the step-down switching regulators is adjustable via the I2C registers SLEWCTL1 and SLEWCTL2. This allows the user to optimize efficiency or EMI as necessary with four different slew rate settings. The power-up default is the fastest slew rate (highest efficiency) setting.
100 90 80 EFFICIENCY (%) 70 60 50 40 30 20 10 0 1.00E-05 1.00E-0.3 IOUT3 (mA) Burst Mode OPERATION VIN = 3.8V SW[1:0] = 00 01 10 11 1.00E-01
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Figures 14 and 15 show the efficiency and power loss graph for Buck3 programmed for 1.2V and 2.5V outputs. Note that the power loss curves remain fairly constant for both graphs yet changing the slew rate has a larger effect on the 1.2V output efficiency. This is mainly because for a given output current the 2.5V output is delivering more than 2x the power than the 1.2V output. Efficiency will always decrease and show more variation to slew rate as the programmed output voltage is decreased. Low Supply Operation An undervoltage lockout circuit on VOUT (VOUT UVLO) shuts down the step-down switching regulators when VOUT drops below about 2.7V. It is recommended that the stepdown switching regulator input supplies (VIN12, VIN3) be connected to the power path output (VOUT) directly. This UVLO prevents the step-down switching regulators from operating at low supply voltages where loss of regulation or other undesirable operation may occur. If driving the step-down switching regulator input supplies from a voltage other than the VOUT pin, the regulators should not be operated outside the specified operating range as operation is not guaranteed beyond this range. Inductor Selection Many different sizes and shapes of inductors are available from numerous manufacturers. Choosing the right inductor from such a large selection of devices can be overwhelming, but following a few basic guidelines will make the selection
100 90 1.00E+00
1.00E+00
1.00e-01 POWER LOSS (W) EFFICIENCY (%)
80 70 60 50 40 30 20 10 Burst Mode OPERATION VIN = 3.8V SW[1:0] = 00 01 10 11 1.00E-0.3 IOUT3 (mA) 1.00E-01
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1.00e-01 POWER LOSS (W)
1.00E-02
1.00E-02
1.00E-03
1.00E-03
1.00E-04
1.00E-04
1.00E-05
0 1.00E-05
1.00E-05
Figure 14. VOUT3 (1.2V) Efficiency and Power Loss vs IOUT3
Figure 15. VOUT3 (2.5V) Efficiency and Power Loss vs IOUT3
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Table 3. Recommended Inductors for Step-Down Switching Regulators
INDUCTOR TYPE DB318C D312C DE2812C CDRH3D16 CDRH2D11 CLS4D09 SD3118 SD3112 SD12 SD10 LPS3015 *Typical DCR L (H) 4.7 3.3 4.7 3.3 4.7 3.3 4.7 3.3 4.7 3.3 4.7 4.7 3.3 4.7 3.3 4.7 3.3 4.7 3.3 4.7 3.3 MAX IDC (A) 1.07 1.20 0.79 0.90 1.15 1.37 0.9 1.1 0.5 0.6 0.75 1.3 1.59 0.8 0.97 1.29 1.42 1.08 1.31 1.1 1.3 MAX DCR () 0.1 0.07 0.24 0.20 0.13* 0.105* 0.11 0.085 0.17 0.123 0.19 0.162 0.113 0.246 0.165 0.117* 0.104* 0.153* 0.108* 0.2 0.13 SIZE in mm (L x W x H) 3.8 x 3.8 x 1.8 3.8 x 3.8 x 1.8 3.6 x 3.6 x 1.2 3.6 x 3.6 x 1.2 3.0 x 2.8 x 1.2 3.0 x 2.8 x 1.2 4 x 4 x 1.8 4 x 4 x 1.8 3.2 x 3.2 x 1.2 3.2 x 3.2 x 1.2 4.9 x 4.9 x 1 3.1 x 3.1 x 1.8 3.1 x 3.1 x 1.8 3.1 x 3.1 x 1.2 3.1 x 3.1 x 1.2 5.2 x 5.2 x 1.2 5.2 x 5.2 x 1.2 5.2 x 5.2 x 1.0 5.2 x 5.2 x 1.0 3.0 x 3.0 x 1.5 3.0 x 3.0 x 1.5 MANUFACTURER Toko www.toko.com
Sumida www.sumida.com
Cooper www.cooperet.com
Coil Craft www.coilcraft.com
process much simpler. The step-down switching regulators are designed to work with inductors in the range of 2.2H to 10H. For most applications a 4.7H inductor is suggested for step-down switching regulators providing up to 500mA of output current while a 3.3H inductor is suggested for step-down switching regulators providing up to 800mA. Larger value inductors reduce ripple current, which improves output ripple voltage. Lower value inductors result in higher ripple current and improved transient response time, but will reduce the available output current. To maximize efficiency, choose an inductor with a low DC resistance. For a 1.2V output, efficiency is reduced about 2% for 100m series resistance at 400mA load current, and about 2% for 300m series resistance at 100mA load current. Choose an inductor with a DC current rating at least 1.5 times larger than the maximum load current to ensure that the inductor does not saturate during normal operation. If output short-circuit is a possible condition, the inductor should be rated to handle the maximum peak current specified for the step-down converters. Different core materials and shapes will change the size/current and price/current relationship of an inductor. Toroid or shielded pot cores in ferrite or Permalloy materials are small and don't radiate much energy, but generally cost more than powdered iron core inductors with similar
electrical characteristics. Inductors that are very thin or have a very small volume typically have much higher core and DCR losses, and will not give the best efficiency. The choice of which style inductor to use often depends more on the price versus size, performance, and any radiated EMI requirements than on what the step-down switching regulators requires to operate. The inductor value also has an effect on Burst Mode operation. Lower inductor values will cause Burst Mode switching frequency to increase. Table 3 shows several inductors that work well with the step-down switching regulators. These inductors offer a good compromise in current rating, DCR and physical size. Consult each manufacturer for detailed information on their entire selection of inductors. Input/Output Capacitor Selection Low ESR (equivalent series resistance) ceramic capacitors should be used at both step-down switching regulator outputs as well as at each step-down switching regulator input supply. Only X5R or X7R ceramic capacitors should be used because they retain their capacitance over wider voltage and temperature ranges than other ceramic types. A 10F output capacitor is sufficient for the step-down switching regulator outputs. For good transient response
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and stability the output capacitor for step-down switching regulators should retain at least 4F of capacitance over operating temperature and bias voltage. Each switching regulator input supply should be bypassed with a 2.2F capacitor. Consult with capacitor manufacturers for detailed information on their selection and specifications of ceramic capacitors. Many manufacturers now offer very thin (<1mm tall) ceramic capacitors ideal for use in height-restricted designs. Table 4 shows a list of several ceramic capacitor manufacturers.
Table 4. Ceramic Capacitor Manufacturers
AVX Murata Taiyo Yuden Vishay Siliconix TDK www.avxcorp.com www.murata.com www.t-yuden.com www.vishay.com www.tdk.com
protection threshold is set by adjusting R1 in Figure 16 such that: BOOST(MAX) = 800mV * R1 +LED_ OV 10 *R2
where LED_OV is about 1.0V. In the case of Figure 16 BOOST(MAX) is set to 40V for a 10-LED string. Capacitor C3 provides soft-start, limiting the inrush current when the boost converter is first enabled. C3 provides feedback to the ILED pin. This feedback limits the rise time of output voltage and the inrush current while the output capacitor, C2, is charging. The boost converter will be operated in either continuous conduction mode, discontinuous conduction mode or pulse-skipping mode depending on the inductor current required for regulation.
C1 22F VOUT LTC3577 18 SW 19 SW 20 SW LED_OV 39 L1 10H LPS4018-103ML D12 ZLLS400 BOOST
LED BACKLIGHT/BOOST OPERATION Introduction The LED driver uses a constant frequency, current mode boost converter to supply power to up to 10 series LEDs. As shown in Figure 16 the series string of LEDs is connected from the output of the boost converter (BOOST) to the ILED pin. Under normal operation the boost converter BOOST output will be driven to a voltage where the ILED pin regulates at 300mV. The ILED pin is a constant-current sink that is programmed via I2C "LED DAC register". The LED can be further controlled using I2C to program brightness levels and soft turn-on/turn-off effects. See the "I2C Interface" section for more information on programming the ILED current. The boost converter also includes an overvoltage protection feature to limit the BOOST output voltage as well as variable slew rate control of the SW pin to reduce EMI. LED Boost Operation The LED boost converter is designed for very high duty cycle operation and can boost from 3V to 40V for load currents up to 20mA. The boost converter also features an overvoltage protection feature to protect the output in case of an open circuit in the LED string. The overvoltage
R1 9 10M R2 20k C2 1F 50V D1 D2 C3 22nF 50V D10 D9 D3 D4 D5
ILED_FS ILED
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3 22
D8
D7
D6
Figure 16. LED Boost Application Circuit
LED Constant Current Sink The LED driver uses a precision current sink to regulate the LED current up to 20mA. The current sink is programmed via I2C "LED DAC Register" and utilizes a 6-bit 60dB exponential DAC. This DAC provides accurate current control from 20A to 20mA with approximately 1dB per step for ILED(FS) = 20mA. The LED current can be approximated by the following equations: ILED =ILED(FS) * 10
DAC - 63 3 * 63
0.8V ILED(FS) = * 500 R2
(1)
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where DAC is the decimal value programmed into the I2C "LED DAC register". For example with ILED(FS) = 20mA and DAC[5:0] = 000000 (0 decimal) ILED equates to 20A, while DAC[5:0] = 111111 (63 decimal) ILED equates to 20mA. As a final example DAC[5:0] = 101010 is 42 decimal and equates to ILED = 2mA for ILED(FS) = 20mA. The DAC approximates the Equation 1 using the nominal values in Table 5. The differences between the approximation equation and the table are due to design of the DAC using eight linear segments that approximate the exponential function.
Table 5. LED DAC Codes to Output Current
DAC Codes 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Output Current 20.0A 23.5A 27.0A 30.5A 34.0A 37.6A 41.1A 44.6A 48.1A 56.5A 65.0A 73.4A 81.9A 90.3A 98.7A 107A 116A 136A 156A 177A 197A 217A 237A 258A 278A 327A 376A 424A 473A 522A 571A 620A DAC Codes 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 Output Current 668A 786A 903A 1.02mA 1.14mA 1.26mA 1.37mA 1.49mA 1.61mA 1.89mA 2.17mA 2.45mA 2.74mA 3.02mA 3.30mA 3.58mA 3.86mA 4.54mA 5.22mA 5.90mA 6.58mA 7.26mA 7.93mA 8.61mA 9.29mA 10.8mA 12.4mA 13.9mA 15.4mA 17.0mA 18.5mA 20.0mA
The full-scale LED current is set using a resistor (R2 in Figure 16) connected between the LED_FS pin and ground. Typically R2 should be set to 20k to give 20mA of LED current at full-scale. The resistance may be increased to decrease the current or the resistance may be decreased to increase the LED current. The DAC has been optimized for best performance at 20mA full-scale. The full-scale current may be adjusted but the accuracy of the output current will be degraded the further it is programmed from 20mA. The LED_FS pin is current limited and will only source about 80A. This protects the pin and limits the ILED current in a case where LED_FS is shorted to ground, it is not recommended to program the LED current above 25mA. LED Gradation The LED driver features an automatic gradation circuit. The gradation circuit ramps the LED current up when the LED driver is enabled and ramps the current down when the LED driver is disabled. The DAC is enabled and disabled with the EN bit of the I2C "LED control register." The gradation function is automatic when enabling and disabling the LED driver; only the gradation speed needs to be programmed to use this function. The gradation speed is set by the GR1 and GR2 bits of the I2C "LED control register" which allows transitions times of approximately 15ms, one-half second, one second and two seconds. See the "I2C Interface" section for more information. The gradation function allows the LEDs to turn on and off gradually as opposed to an abrupt step. LED PWM vs Constant Current Operation The LED driver provides both linear LED current mode as well as PWM LED current mode. These modes are selected through the MD1 and MD2 bits of the I2C "LED control register." When both bits are 0 the LED boost converter is in constant current (CC) mode and the ILED current sink is constant whose value is set by the DAC[5:0] bits of the I2C "LED DAC register." Setting MD1 to 0 and MD2 to 1 selects the LED PWM mode. In this mode the LED driver is pulsed using an internally generated PWM signal. The PWM mode may be used to reduce the LED intensity for a given programmed current.
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When dimming via PWM the LED driver and boost converter are both turned on and off together. This allows some degree of additional control over the LED current, and in some cases may offer a more efficient method of dimming since the boost could be operated at an optimal efficiency point and then pulsed for the desired LED intensity. The PWM mode, if enabled, is set up using 3 values; PWMNUM[3:0] and PWMDEN[3:0] in the I2C "LED PWM Register" and PWMCLK, set by PWMC2 and PWMC1 in the I2C "LED Control Register." PWMNUM PWMDEN PWMCLK Frequency = PWMDEN Duty Cycle =
Table 6. PWM Clock Frequency
PWMC2 0 0 1 1 PWMC1 0 1 0 1 PWMCLK 8.77kHz 4.39kHz 2.92kHz 2.19kHz
When PWM mode is enabled, a small (2A) standby current source is always enabled on the ILED pin. The purpose of this is to have some current flowing in the LEDs at all times. This helps to reduce the magnitude of the voltage swing on the ILED pin as the current is pulsed on and off. Fixed Boost Output Setting MD1 to 1 and MD2 to 0 selects the fixed high voltage boost mode. This mode can be used to generate output voltages at or greater than VOUT . When configured as a boost converter the ILED pin becomes the feedback pin, and will regulate the output voltage such that the voltage on the ILED pin is 800mV. Figure 17 shows a fixed 12V output generated using the boost converter in the fixed high voltage boost mode. Any output voltage up to 40V may be programmed by selecting appropriate values for the R1 and R2 voltage divider from the equation: R1 VBOOST = 0.8V * + 1 R2 Values for R2 should be kept below 24.3k to keep the pole at ILED beyond cross over. The boost is designed primarily as a high voltage, high duty cycle converter. When operating with a lower boost ratio, a larger output capacitor, 10F should be used. Operating , with a very low duty cycle will cause cycle skipping which will increase ripple.
C1 22F VOUT ILED_FS LTC3577 SW SW SW ILED LED_OV
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Using the PWM control, a 4-bit internally generated PWM is possible as additional dimming. Using these control bits a number of PWM duty cycles and frequencies are available in the 100Hz to 500Hz range. This range was selected to be below the audio range and above the frequency where the PWM is visible. For example, given PWMC2 = 1, PWMC1 = 0, PWMNUM[3:0] = 0111 and PWMDEN[3:0] = 1100 then the duty cycle will be 58.3% and PWM frequency will be 243Hz. If PWMNUM is set to 0 then the duty cycle will be 0% and the current sink will effectively be off. If PWMNUM is programmed to a value larger than PWMDEN the duty cycle will be 100% and the current sink will effectively be constant. PWMDEN and PWMNUM may both be changed to result in 73 different duty cycle possibilities and 41 different PWM frequencies between 8.77kHz and 100Hz.
39 3
18 19 20 22
L4 10H LPS4018-103ML D12 ZLLS400 R1 301k R2 21.5k BOOST C2 10F 10V
800mV VREF
9
Figure 17. Fixed 12V/75mA Boost Output Application
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To keep the average steady-state inductor current below 300mA the maximum output current is reduced as programmed output voltage increases. The output current available is given by: IBOOST(MAX) = 300mA * VOUT(MIN) VBOOST Diode Selection When boosting to increasingly higher voltages, parasitic capacitance at the switch pin becomes an increasing large component of the switching loses. For this reason it is important to minimize the capacitance on the switch node. The diode selected should be sized to handle the peak inductor current and the average output current. At high boost voltages a diode with the lowest possible junction capacitance will often result in a more efficient solution than one with a lower forward drop. I2C OPERATION I2C Interface The LTC3577 may communicate with a bus master using the standard I2C 2-wire interface. The Timing Diagram shows the relationship of the signals on the bus. The two bus lines, SDA and SCL, must be high when the bus is not in use. External pull-up resistors or current sources, such as the LTC1694 SMBus accelerator, are required on these lines. The LTC3577 is both a slave receiver and slave transmitter. The I2C control signals, SDA and SCL are scaled internally to the DVCC supply. DVCC should be connected to the same power supply as the bus pull-up resistors. The I2C port has an undervoltage lockout on the DVCC pin. When DVCC is below approximately 1V , the I2C serial port is cleared, the LTC3577 is set to its default configuration of all zeros.
Table 7. Recommended Inductors for Boost Switching Reguators
INDUCTOR TYPE DB62LCB CDRH4D16NP-100M SD18-100-R LPS4018-103 *Typical L (H) 10 10 10 10 MAX IDC (A) 1.22 10.5 1.28 1.1 MAX DCR () 0.118 0.155 0.158* 0.200 SIZE in mm (L x W x H) 6.2 x 6.2 x 2 4.8 x 4.8 x 1.8 5.2 x 5.2 x 1.8 4.0 x 4.0 x 1.8 MANUFACTURER Toko www.toko.com Sumida www.sumida.com Cooper www.cooperet.com Coil Craft www.coilcraft.com
Note that the maximum boost output current must be set by the minimum VOUT operating voltage. If the boost converter is allowed to operate down to the VOUT UVLO then 2.5V must be assumed as the minimum operating VOUT voltage. Inductor Selection The LED boost converter is designed to work with a 10H inductor. The inductor must be able to handle a peak current of 1A and should have a low ESR value for good efficiency. Table 7 shows several inductors that work well with the LED boost converter. These inductors offer a good compromise in current rating, DCR and physical size. Consult each manufacturer for detailed information on their entire selection of inductors.
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I2C Timing Diagram
DATA BYTE A ADDRESS 0 START SDA 0 0 0 1 0 0 1 0 ACK ACK ACK 0 0 1 0 0 1 WR 0 A7 A6 A5 A4 A3 A2 A1 A0 B7 B6 B5 B4 B3 B2 B1 B0 STOP DATA BYTE B
SCL
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SDA tSU, DAT tLOW SCL tHD, STA START CONDITION tr tHIGH tf REPEATED START CONDITION tSP STOP CONDITION START CONDITION tHD, DAT tSU, STA tHD, STA tBUF tSU, STO
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I2C Bus Speed The I2C port is designed to be operated at speeds of up to 400kHz. It has built-in timing delays to ensure correct operation when addressed from an I2C compliant master device. It also contains input filters designed to suppress glitches should the bus become corrupted. I2C START and STOP Conditions A bus master signals the beginning of communications by transmitting a START condition. A START condition is generated by transitioning SDA from HIGH to LOW while SCL is HIGH. The master may transmit either the slave write or the slave read address. Once data is written to the LTC3577, the master may transmit a STOP condition which commands the LTC3577 to act upon its new command set. A STOP condition is sent by the master by transitioning SDA from LOW to HIGH while SCL is HIGH. The bus is then free for communication with another I2C device. I2C Byte Format Each byte sent to or received from the LTC3577 must be 8 bits long followed by an extra clock cycle for the acknowledge bit. The data should be sent to the LTC3577 most significant bit (MSB) first.
I2C Acknowledge The acknowledge signal is used for handshaking between the master and the slave. When the LTC3577 is written to (write address), it acknowledges its write address as well as the subsequent two data bytes. When it is read from (read address), the LTC3577 acknowledges its read address only. The bus master should acknowledge receipt of information from the LTC3577. An acknowledge (active LOW) generated by the LTC3577 lets the master know that the latest byte of information was received. The acknowledge related clock pulse is generated by the master. The master releases the SDA line (HIGH) during the acknowledge clock cycle. The LTC3577 pulls down the SDA line during the write acknowledge clock pulse so that it is a stable LOW during the HIGH period of this clock pulse. When the LTC3577 is read from, it releases the SDA line so that the master may acknowledge receipt of the data. Since the LTC3577 only transmits one byte of data, a master not acknowledging the data sent by the LTC3577 has no I2C specific consequence on the operation of the I2C port.
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I2C Slave Address The LTC3577 responds to a 7-bit address which has been factory programmed to b'0001001[R/W]'. The LSB of the address byte, known as the read/write bit, should be 0 when writing data to the LTC3577 and 1 when reading data from it. Considering the address an eight bit word, then the write address is 0x12 and the read address is 0x13. The LTC3577 will acknowledge both its read and write address. I2C Sub-Addressed Writing The LTC3577 has four command registers for control input. They are accessed by the I2C port via a subaddressed writing system. Each write cycle of the LTC3577 consists of exactly three bytes. The first byte is always the LTC3577's write address. The second byte represents the LTC3577's sub-address. The sub address is a pointer which directs the subsequent data byte within the LTC3577. The third byte consists of the data to be written to the location pointed to by the subaddress. The LTC3577 contains control registers at only four sub-address locations: 0x00, 0x01, 0x02 and 0x03. Writing to sub-addresses outside the four sub-addresses listed is not recommended as it can cause data in one of the four listed sub-addresses to be overwritten. I2C Bus Write Operation The master initiates communication with the LTC3577 with a START condition and the LTC3577's write address. If the address matches that of the LTC3577, the LTC3577 returns an acknowledge. The master should then deliver the sub-address. Again the LTC3577 acknowledges and the cycle is repeated for the data byte. The data byte is transferred to an internal holding latch upon the return of its acknowledge by the LTC3577. This procedure must be repeated for each sub-address that requires new data. After one or more cycles of [ADDRESS][SUB-ADDRESS][DATA], the master may terminate the communication with a STOP condition. Alternatively, a REPEAT-START condition can be initiated by the master and another chip on the I2C bus can be addressed. This cycle can continue indefinitely and the LTC3577 will remember the last input of valid data that it received. Once all chips on the bus have been addressed and sent valid data, a global STOP can be sent and the LTC3577 will update its command latches with the data that it had received. I2C Bus Read Operation The bus master reads the status of the LTC3577 with a START condition followed by the LTC3577 read address. If the read address matches that of the LTC3577, the LTC3577 returns an acknowledge. Following the acknowledgement of its read address the LTC3577 returns one bit of status information for each of the next 8 clock cycles. A STOP command is not required for the bus read operation. I2C Input Data There are 4 bytes of data that can be written to on the LTC3577. The bytes are accessed through the subaddresses 0x00 to 0x03. At first power application (VBUS, WALL or BAT) all bits default to 0. Additionally all bits are cleared to 0 when DVCC drops below its undervoltage lock out or if the pushbutton enters the power-down (PDN1 or PDN2) state.
Table 8. LDO and Buck Control Register
LDO and BUCK CONTROL REGISTER BIT B0 B1 B2 B3 B4 B5 B6 B7 NAME LDO1EN LDO2EN BK1BRST BK2BRST BK3BRST SLEWCTL1 SLEWCTL2 N/A ADDRESS: 00010010 SUB-ADDRESS: 00000000 FUNCTION Enable LDO 1 Enable LDO 2 Buck1 Burst Mode Enable Buck2 Burst Mode Enable Buck2 Burst Mode Enable Buck SW Slew Rate: 00 = 1ns, 01 = 2ns, 10 = 4ns, 11 = 8ns Not Used--No Effect on Operation
Table 8 shows the first byte of data that can be written to at sub-address 0x00. This byte of data is referred to as the "LDO and buck control register." Bits B0 and B1 enable and disable the LDOs. Writing 1 to B0 or B1 will enable LDO1 or LDO2 respectively, while writing a 0 will disable the respective LDO.
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Bits B2, B3, and B4 set the operating modes of the stepdown switching regulators (bucks). Writing 1 to any of these three registers will put that respective buck converter in the high efficiency Burst Mode operation, while a 0 will enable the low noise pulse-skipping mode operation. The B5 and B6 bits adjust the slew rate of all SW pins together so they all slew at the same rate. It is recommended that the fastest slew rate (B6:B5 = 00) be used unless EMI is an issue in the application as slower slew rates cause reduced efficiency.
Table 9. I2C LED Control Register
LED CONTROL REGISTER BIT B0 B1 B2 B3 B4 B5 B6 B7 NAME EN GR2 GR1 MD1 MD2 PWMC1 PWMC2 SLEWLED ADDRESS: 00010010 SUB-ADDRESS: 00000001 FUNCTION Enable: 1 = Enable 0 = Off Gradation GR[2:1]: 00 = 15ms, 01 = 460ms, 10 = 930ms, 11 = 1.85s Mode MD[2:1]: 00 = CC Boost, 10 = PWM Boost; 01 = HV Boost PWM CLK PWMC[2:1]: 00 = 8.77kHz, 01 = 4.39kHz, 10 = 2.92kHz, 11 = 2.19kHz LED SW Slew Rate: 0/1 = Fast/Slow
Bits B5 and B6 set the PWM clock speed as shown in Table 9 of the "LED Backlight / Boost Operation" section. Bit B7 sets the slew rate of the LED boost SW pin. Setting B7 to 0 results in the fastest slew rate and provides the most efficient mode of operation. Setting B7 to 1 should only be used in cases where EMI due to SW slewing is an issue as the slower slew rate causes a loss in efficiency. See "LED Backlight/Boost Operation" section for more detailed operating information. Table 10 shows the third byte of data that can be written to at sub-address 0x02. This byte of data is referred to as the "LED DAC register." The LED current source utilizes a 6-bit 60dB exponential DAC. This DAC provides accurate current control from 20A to 20mA with approximately 1dB per step with ILED(FS) programmed to 20mA. The LED current can be approximated by the following equation: ILED =ILED(FS) * 10
DAC - 63 3 * 63
Table 9 shows the second byte of data that can be written to at sub-address 0x01. This byte of data is referred to as the "LED control register." Bit B0 enables and disables the LED boost circuitry. Writing a 1 to B0 enables the LED boost circuitry, while writing a 0 disables the LED boost circuitry. Bits B1 and B2 are the LED gradation which sets the ramp up and down time of the LED current when enabled or disabled. The gradation function allows the LEDs to turn on/off gradually as opposed to an abrupt step. Bits B3 and B4 set the operating mode of the LED boost circuitry. The operating modes are: B4:B3 = 00 LED constant current (CC) boost operation; B4:B3 = 10 LED PWM boost operation; B4:B3 = 01 fixed high voltage (HV) output boost operation; B4:B3 = 11 not supported, do not use. See the "LED Backlight/Boost Operation" section for more information on the operating modes.
where DAC is the decimal value programmed into the I2C "LED DAC register." For example with ILED(FS) = 20mA and DAC[5:0] = 101010 (42 decimal) ILED equates to 2mA.
Table 10. I2C LED DAC Register
LED DAC REGISTER BIT B0 B1 B2 B3 B4 B5 B6 B7 NAME DAC[0] DAC[1] DAC[2] DAC[3] DAC[4] DAC[5] N/A N/A Not Used--No Effect On Operation Not Used--No Effect On Operation ADDRESS: 00010010 SUB-ADDRESS: 00000010 FUNCTION 6-Bit Log DAC Code
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Table 11 shows the final byte of data that can be written to at sub-address 0x03. This byte of data is referred to as the "LED PWM register". See the "LED PWM vs Constant Current Operation" section for detailed information on how to set the values of this register.
Table 11. LED PWM Register
LED PWM REGISTER BIT B0 B1 B2 B3 B4 B5 B6 B7 NAME PWMDEN[0] PWMDEN[1] PWMDEN[2] PWMDEN[3] PWMNUM[0] PWMNUM[1] PWMNUM[2] PWMNUM[3] PWM NUMERATOR ADDRESS: 00010010 SUB-ADDRESS: 00000011 FUNCTION PWM DENOMINATOR
Bit A7 shows the power good status of buck3. A 1 indicates that buck3 is enabled and is regulating correctly. A 0 indicates that either buck3 is not enabled, or that the buck3 is enabled, but is out of regulation by more than 8%. Bit A6 shows the power good status of buck2. A 1 indicates that buck2 is enabled and is regulating correctly. A 0 indicates that either buck2 is not enabled, or that the buck2 is enabled, but is out of regulation by more than 8%. Bit A5 shows the power good status of buck1. A 1 indicates that buck1 is enabled and is regulating correctly. A 0 indicates that either buck1 is not enabled, or that the buck1 is enabled, but is out of regulation by more than 8%. Bit A4 shows the power good status of LDO2. A 1 indicates that LDO2 is enabled and is regulating correctly. A 0 indicates that either LDO2 is not enabled, or that the LDO2 is enabled, but is out of regulation by more than 8%. Bit A3 shows the power good status of LDO1. A 1 indicates that LDO1 is enabled and is regulating correctly. A 0 indicates that either LDO1 is not enabled, or that the LDO1 is enabled, but is out of regulation by more than 8%. Bits A2 and A1 indicate the fault status of the charger circuit and are decoded in Table 12. The "too cold/hot" state indicates that the thermistor temperature is out of the valid charging range (either below 0C or above 40C for a curve 1 thermistor) and that charging has paused until a return to valid temperature. The battery overtemp state indicates that the battery's thermistor has reached a critical temperature (above 50C for a curve 1 thermistor) and that long-term battery capacity may be seriously compromised if the condition persists. The battery fault state indicates that an attempt was made to charge a low battery (typically < 2.85V) but that the low voltage condition persisted for more than 1/2 hour. In this case charging has terminated. Bit A0 indicates the status of the battery charger. A 1 indicates that the charger is enabled and is in the constant current charge state. In this case the battery is being charged unless the NTC thermistor is outside its valid charge range in which case charging is temporarily suspended but not complete. Charging will continue once the
I2C Output Data One status byte may be read from the LTC3577. Table 12 represents the status byte information. A 1 read back in the any of the bit positions indicates that the condition is true. For example, 1 read back from bit A3 indicate that LDO1 is enabled and regulating correctly. A status read from the LTC3577 captures the status information when the LTC3577 acknowledges its read address.
Table 12. I2C READ Register
STATUS REGISTER BIT A0 A1 A2 A3 A4 A5 A6 A7 NAME CHARGE STAT[0] STAT[1] PGLDO[1] PGLDO[2] PGBCK[1] PGBCK[2] PGBCK[3] ADDRESS: 00010011 SUB-ADDRESS: None FUNCTION Charge Status (1 = Charging) STAT[1:0]; 00 = No Fault 01 = TOO COLD/HOT 10 = BATTERY OVERTEMP 11 = BATTERY FAULT LDO1 Power Good LDO2 Power Good Buck1 Power Good Buck2 Power Good Buck3 Power Good
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battery has returned to a valid charging temperature. A 0 in bit A0 indicates that charging has entered the end-ofcharge state (hC/10) and is near VFLOAT or that charging has been terminated. Charging can be terminated by reaching the end of the charge timer or by a battery fault as described previously. I2C WRITE REGISTER MAP (see "I2C Input Data" section for more details, all registers default to 0 when reset)
LDO and BUCK CONTOL REGISTER BIT NAME B0 LDO1EN B1 LDO2EN B2 BK1BRST B3 BK2BRST B4 BK3BRST B5 SLEWCTL1 B6 SLEWCTL2 B7 N/A LED CONTROL REGISTER BIT NAME B0 EN B1 GR2 B2 GR1 B3 MD1 B4 MD2 B5 PWMC1 B6 PWMC2 B7 SLEWLED ADDRESS: 00010010 SUB-ADDRESS: 00000000 FUNCTION Enable LDO 1 Enable LDO 2 Buck1 Burst Mode Enable Buck2 Burst Mode Enable Buck2 Burst Mode Enable Buck SW Slew Rate: 00 = 1ns, 01 = 2ns, 10 = 4ns, 11 = 8ns Not Used--No Effect On Operation ADDRESS: 00010010 SUB-ADDRESS: 00000001 FUNCTION Enable: 1= Enable 0 = Off Gradation GR[2:1]: 00 = 15ms, 01 = 460ms, 10 = 930ms, 11 = 1.85 Seconds Mode MD[2:1]: 00 = CC Boost, 10 = PWM Boost, 01 = HV Boost PWM CLK PWMC[2:1]: 00 = 8.77kHz, 01 = 4.39kHz, 10 = 2.92kHz, 11 = 2.19kHz LED SW Slew rate: 0/1 = Fast/Slow ADDRESS: 00010010 SUB-ADDRESS: 00000010 FUNCTION 6-Bit Log DAC Code LED PWM REGISTER BIT NAME B0 PWMDEN[0] B1 PWMDEN[1] B2 PWMDEN[2] B3 PWMDEN[3] B4 PWMNUM[0] B5 PWMNUM[1] B6 PWMNUM[2] B7 PWMNUM[3] ADDRESS: 00010010 SUB-ADDRESS: 00000011 FUNCTION PWM Denominator
PWM Numerator
PUSHBUTTON INTERFACE OPERATION State Diagram/Operation Figure 18 shows the LTC3577 pushbutton state diagram. Upon first application of power (VBUS, WALL or BAT) an internal power-on reset (POR) signal places the pushbutton circuitry into the power-down (PDN1) state. One second after entering the PDN1 state the pushbutton circuitry will transition into the hard reset (HR) state. The following events cause the state machine to transition out of HR into the power-up (PUP1) state: 1) ON input low for 400ms (PB400MS) 2) Application of external power (EXTPWR) 3) PWR_ON input going high (PWR_ON)
HR PB400MS + EXTPWR + PWR_ON PUP2 PB400MS + EXTPWR + PWR_ON POFF 1SEC PWR_ON +UVLO HRST 5SEC PUP1 5SEC PON HRST PDN1 1SEC POR
LED DAC REGISTER BIT NAME B0 DAC[0] B1 DAC[1] B2 DAC[2] B3 DAC[3] B4 DAC[4] B5 DAC[5] B6 N/A B7 N/A
PDN2
Not Used--No Effect On 0peration Not Used--No Effect On 0peration
HRST
Figure 18. Pushbutton State Diagram
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LTC3577/LTC3577-1 OPERATION
Upon entering the PUP1 state, the pushbutton circuitry will sequence up the three step-down switching regulators in numerical order. LDO1, LDO2 and LED backlight are enabled via I2C and do not take part in the power-up sequence of the pushbutton. Five seconds after entering the PUP1 state, the pushbutton circuitry will transition into the power-on (PON) state. Note that the PWR_ON input must be brought high before entering the PON state if the part is to remain in the PON state. PWR_ON going low, or VOUT dropping to its undervoltage lockout (VOUT UVLO) threshold will cause the state machine to leave the PON state and enter the power-down (PDN2) state. The PDN1 and PDN2 states reset the I2C registers effectively shutting down the LDOs and LED backlight as well as disable all switching regulators together. The one second delay before leaving either power-down state allows all LTC3577 generated supplies to power down completely before they can be re-enabled. The same three events used to exit HR are also used to exit the POFF state and enter PUP2 state. The PUP2 state operates in the same manner as the PUP1 state previously described. The hard reset (HRST) event is generated by pressing and holding the pushbutton (ON input low) for 5 seconds. For a valid HRST event to occur the initial pushbutton application must start in the PUP1, PUP2 or PON state, but can end in any state. If a valid HRST event is present in PON, PDN2 or POFF then the state machine will transition to the , PDN1 state and subsequently transition to the HR state one second later. In the HR state all supplies are disabled and the PowerPath circuitry is placed in an ultralow quiescent state to minimize battery drain. If no external charging supply is present (WALL or VBUS) then the ideal diode is shut down disconnecting VOUT from BAT to further minimize battery drain. The ultralow power consumption in the HR state makes it ideal for shipping or long term storage, minimizing battery drain. Power-Up via Pushbutton Timing The timing diagram, Figure 19, shows the LTC3577 powering up through application of the external pushbutton. For this example the pushbutton circuitry starts in the POFF or HR state with a battery connected and all buck disabled. Pushbutton application (ON low) for 400ms transitions the pushbutton circuitry into the PUP state which brings WAKE Hi-Z for 5 seconds. WAKE going Hi-Z sequences buck1-3 up in numerical order. WAKE will stay Hi-Z if PWR_ON is driven high before the 5 seconds PUP period is over. If PWR_ON is low or goes low after the 5 second period, WAKE will go low and buck1-3 will be shut down together. PG_DCDC is asserted once all enabled bucks are within 8% of their regulation voltage for 230ms. PBSTAT does not go low impedance with ON going low during the power-up pushbutton application. PBSTAT will go low impedance with ON on subsequent pushbutton applications once in the PUP1, PUP2 or PON states. The LDOs and LED backlight can be enabled and disabled at any time via I2C once in the PUP1, PUP2 or PON states. The PWR_ON input can be driven via a P/C or by one of the buck outputs through a high impedance (100k typ) to keep the bucks enabled as described above.
BAT VBUS ON (PB) PBSTAT 400ms WAKE BUCK1-3 PG_DCDC 5SEC PWR_ON STATE POFF/HR PUP2/PUP1 PON
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BUCKS SEQUENCE UP 123 230ms
Figure 19. Power-Up via Pushbutton Timing
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Power-Up via External Power Timing The timing diagram, Figure 20, shows the LTC3577 powering up through application of the external power (VBUS or WALL). For this example the pushbutton circuitry starts in the POFF or HR state with a battery connected and all buck disabled. 100ms after WALL or VBUS application the WAKE output goes Hi-Z for 5 seconds. The 100ms delay time allows the applied supply to settle. WAKE going Hi-Z sequences buck1-3 up in numerical order. WAKE will stay Hi-Z if the PWR_ON input is driven high before the 5 seconds PUP period is over. If PWR_ON is low or goes low after the 5 second period, WAKE will go low and buck1-3 will be shut down together. PG_DCDC is asserted once all enabled bucks are within 8% of their regulation voltage for 230ms. The LDOs and LED backlight can be enabled and disabled via I2C any time after entering the PUP1, PUP2 or PON state. The PWR_ON input can be driven via a P/C or one of the buck outputs through a high impedance (100k typ) to keep the bucks enabled as described above. Without a battery present initial power application causes a power on reset which puts the pushbutton circuitry in the PDN2 state and subsequently the HR state 1 second later. In this case the pushbutton must be applied to enter the PUP1 state after initial power application.
BAT VBUS ON (PB) PBSTAT 100ms WAKE BUCK1-3 PG_DCDC 5SEC PWR_ON STATE POFF/HR PUP2/PUP1 PON
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Power-Up via PWR_ON Timing The timing diagram, Figure 21, shows the LTC3577 powering up by driving PWR_ON high. For this example the pushbutton circuitry starts in the POFF or HR state with a battery connected and all bucks disabled. 50ms after PWR_ON goes high the WAKE output goes Hi-Z for 5 seconds. WAKE going Hi-Z sequences buck1-3 up in numerical order. WAKE will stay Hi-Z as long as PWR_ON is high at the end of the 5 second PUP period. If PWR_ON is low or goes low after the 5 second period, WAKE will go low and buck1-3 will be shut down together. PG_DCDC is asserted once all enabled bucks are within 8% of their regulation voltage for 230ms. The LDOs and LED backlight can be enabled and disabled via I2C any time after entering the PUP1, PUP2 or PON state. Powering up via PWR_ON is useful for applications containing an always on C. This allows the C to power the application up and down for house keeping and other activities outside the user's control.
BAT ON (PB) PBSTAT 5SEC PWR_ON 5Oms WAKE BUCK1-3 PG_DCDC STATE POFF/HR PUP2/PUP1 PON
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BUCKS SEQUENCE UP 123 230ms
BUCKS SEQUENCE UP 123 230ms
Figure 21. Power-Up via PWR_ON Timing
Figure 20. Power-Up via External Power Timing
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Power-Down via Pushbutton Timing The timing diagram, Figure 22, shows the LTC3577 powering down by C/P control. For this example the pushbutton circuitry starts in the PON state with a battery connected and all bucks enabled. In this case the pushbutton is applied (ON low) for at least 50ms, which generates a low impedance on the PBSTAT output. After receiving the PBSTAT the C/P will drive the PWR_ON input low. 50ms after PWR_ON goes low the WAKE output will go low and the pushbutton circuitry will enter the PDN2 state. The bucks are disabled together at once upon entering the PDN2 state. Once entering the PDN2 state a 1 second wait time is initiated before entering the POFF state. During this 1 second time ON and PWR_ON inputs as well as external power application are ignored to allow all LTC3577 generated supplies to go low. Though the above assumes a battery present, the same operation would take place with a valid external supply (VBUS or WALL) with or without a battery present. Upon entering the PDN2 state the LDOs and LED backlight I2C registers are cleared effectively disabling both. If this is not desirable the LDOs and LED backlight should be disabled via I2C prior to entering the PDN2 state. Holding ON low through the 1 second power-down period will not cause a power-up event at end of the 1 second period. The ON input must be brought high following the power-down event and then go low again to establish a valid power-up event.
BAT VBUS/WALL 1SEC ON (PB) 50ms PBSTAT C/P CONTROL PWR_ON 50ms WAKE ALL BUCKS LOW BUCK1-3 PG_DCDC STATE PON PDN2 POFF
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UVLO Minimum Off-Time Timing (Low Battery) The timing diagram, Figure 23, assumes the battery is either missing or at a voltage below the VOUT UVLO threshold and the application is running via external power (VBUS or WALL). A glitch on the external supply causes VOUT to drop below the VOUT UVLO threshold temporarily. The VOUT UVLO condition will cause the pushbutton circuitry to transition from the PON state to the PDN2 state. Upon entering the PDN2 state WAKE and PG_DCDC will go low while the bucks, LDOs and LED backlight power down together. If the external supply recovers after entering the PND2 state such that VOUT is no longer in UVLO then the LTC3577 will transition back into the PUP2 state once the PDN2 one second delay is complete. Though not shown in Figure 23, the pushbutton logic briefly visits the POFF state when transitioning between PDN2 and PUP2. Entering the PUP2 state will cause the bucks to sequence up as described previously in the power-up sections. The LDOs and LED backlight must be re-enabled via I2C once device is powered back up.
BAT VBUS/WALL ON (PB) PBSTAT PWR_ON 1SEC WAKE BUCKS PG_DCDC STATE PON PDN2 PUP2 PON
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5SEC
BUCKS SEQUENCE UP 123 230ms
Figure 23. UVLO Minimum Off-Time
Figure 22. Power-Down va Pushbutton Timing
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Hard Reset Timing Hard reset provides an ultralow power-down state for shipping or long-term storage as well as a way to power down the application in case of a software lock-up. In the case of software lock-up ON is brought low by the user applying the pushbutton. If the user holds the pushbutton for 5 seconds a hard reset event (HRST) will occur placing the pushbutton circuitry in the PDN1 state. At this point the bucks, LDOs and LED backlight will all be shut down and WAKE and PG_DCDC will both go low. Following a 1 second power-down period the pushbutton circuitry will enter the hard reset state (HR). Holding ON low through the 1 second power-down period will not cause a power-up event at end of the 1second period. The ON must be brought high following the power-down event and then go low for again for 400ms to establish a valid power up event as shown in Figure 24. Power-Up Sequencing Figure 25 shows the actual power-up sequencing of the LTC3577. Buck1, buck2 and buck3 are all initially disabled (0V). Once the pushbutton has been applied (ON low) for 400ms, WAKE goes high and buck1 is enabled. Buck1 slews up and enters regulation once enabled. The actual slew rate is controlled by the soft-start function of buck1 in conjunction with output capacitance and load (see "Step-Down Switching Regulator Operation" section for more information). When buck1 is within about 8% of final regulation, buck2 is enabled and slews up into regulation. Finally when buck2 is within about 8% of final regulation, buck3 is enabled and slews up into regulation. 230ms after buck3 is within 8% of final regulation the PG_DCDC output will go high impedance (not shown in Figure 25). The regulators in Figure 25 are slewing up with nominal output capacitors and no load. Adding a load or increasing output capacitance on any of the outputs will reduce the slew rate and lengthen the time it takes the regulator to get into regulation. Reducing the slew rate also pushes out the time until the next regulator is enabled proportionally.
1 WAKE PBSTAT 400ms WAKE BUCKS 1SEC PWR_ON PG_DCDC STATE PON PDN1 HR PUP
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BAT 5SEC ON (PB)
0 BUCK1 2V/DIV
123
0V BUCK2 1V/DIV 0V BUCK3 1V/DIV 0V 50s/DIV
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Figure 24. Hard Reset Timing
Figure 25. Power-Up Sequencing
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LAYOUT AND THERMAL CONSIDERATIONS Printed Circuit Board Power Dissipation In order to be able to deliver maximum charge current under all conditions, it is critical that the exposed ground pad on the backside of the LTC3577 package is soldered to a ground plane on the board. Correctly soldered to 2500mm2 ground plane on a double-sided 1oz. copper board the LTC3577 has a thermal resistance (JA) of approximately 45C/W. Failure to make good thermal contact between the Exposed Pad on the backside of the package and a adequately sized ground plane will result in thermal resistances far greater than 45C/W. The conditions that cause the LTC3577 to reduce charge current due to the thermal protection feedback can be approximated by considering the power dissipated in the part. For high charge currents with a wall adapter applied to VOUT, the LTC3577 power dissipation is approximately: PD = (VOUT - BAT) * IBAT + PDREGS where, PD is the total power dissipated, VOUT is the system supply voltage, BAT is the battery voltage, and IBAT is the battery charge current. PDREGS is the sum of power dissipated on-chip by the step-down switching, LDO and LED boost regulators. The power dissipated by a step-down switching regulator can be estimated as follows: PD(SWx) = (BOUTx *IOUT ) * 100 - Eff 100 The power dissipated on chip by a LDO regulator can be estimated as follows: PDLDOx = (VINLDOx - LOUTx) * IOUT where LOUTx is the programmed output voltage, VINLDOx is the LDO supply voltage and IOUT is the LDO output load current. Note that if the LDO supply is connected to one of the buck output, then its supply current must be added to the buck regulator load current for calculating the buck power loss. The power dissipated by the LED boost regulator can be estimated as follows: BOOST PDLED =ILED * 0.3V + RNSWON * ILED * V - 1
OUT 2
where BOOST is the output voltage driving the top of the LED string, RNSWON is the on-resistance of the SW N-FET (typically 330m), ILED is the LED programmed current sink. Thus the power dissipated by all regulators is: PDREGS = PDSW1 + PDSW2 + PDSW3 + PDLDO1 + PDLDO2 + PDLED It is not necessary to perform any worst-case power dissipation scenarios because the LTC3577 will automatically reduce the charge current to maintain the die temperature at approximately 110C. However, the approximate ambient temperature at which the thermal feedback begins to protect the IC is: TA = 110C - PD * JA Example: Consider the LTC3577 operating from a wall adapter with 5V (VOUT) providing 1A (IBAT) to charge a Li-Ion battery at 3.3V (BAT). Also assume PDREGS = 0.3W, so the total power dissipation is: PD = (5V - 3.3V) * 1A + 0.3W = 2W The ambient temperature above which the LTC3577 will begin to reduce the 1A charge current, is approximately TA = 110C - 2W * 45C/W = 20C
where BOUTx is the programmed output voltage, IOUT is the load current and Eff is the % efficiency which can be measured or looked up on an efficiency table for the programmed output voltage.
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LTC3577/LTC3577-1 OPERATION
The LTC3557 can be used above 20C, but the charge current will be reduced below 1A. The charge current at a given ambient temperature can be approximated by: PD = Thus: (110C - TA ) - PDREGS JA IBAT = VOUT - BAT Consider the above example with an ambient temperature of 55C. The charge current will be reduced to approximately: 110C - 55C - 0.3W 45C/W IBAT = 5V - 3.3V 1.22W - 0.3W = 542mA 1.7V If an external buck switching regulator controlled by the LTC3577 VC pin is used instead of a 5V wall adapter we see a significant reduction in power dissipated by the LTC3577. This is because the external buck switching regulator will drive the PowerPath output (VOUT) to about 3.6V with the battery at 3.3V. If you go through the example above and substitute 3.6V for VOUT we see that thermal regulation does not kick in until about 83C. Thus, the external high voltage buck regulator not only allows higher charging currents, but lower power dissipation means a cooler running application. IBAT = Printed Circuit Board Layout When laying out the printed circuit board, the following list should be followed to ensure proper operation of the LTC3577: 1. The Exposed Pad of the package (Pin 45) should connect directly to a large ground plane to minimize thermal and electrical impedance. 110C - TA = ( VOUT - BAT ) *IBAT + PD(REGS) JA 2. The step-down switching regulator input supply pins (VIN12 and VIN3) and their respective decoupling capacitors should be kept as short as possible. The GND side of these capacitors should connect directly to the ground plane of the part. These capacitors provide the AC current to the internal power MOSFETs and their drivers. It's important to minimizing inductance from these capacitors to the pins of the LTC3577. Connect VIN12 and VIN3 to VOUT through a short low impedance trace. 3. The switching power traces connecting SW1, SW2, and SW3 to their respective inductors should be minimized to reduce radiated EMI and parasitic coupling. Due to the large voltage swing of the switching nodes, sensitive nodes such as the feedback nodes (FBx, LDOx_FB and LED_OV) should be kept far away or shielded from the switching nodes or poor performance could result. 4. Connections between the step-down switching regulator inductors and their respective output capacitors should be kept should be kept as short as possible. The GND side of the output capacitors should connect directly to the thermal ground plane of the part. 5. Keep the buck feedback pin traces (FB1, FB2, and FB3) as short as possible. Minimize any parasitic capacitance between the feedback traces and any switching node (i.e. SW1, SW2, SW3, and logic signals). If necessary shield the feedback nodes with a GND trace. 6. Connections between the LTC3577 PowerPath pins (VBUS and VOUT) and their respective decoupling capacitors should be kept as short as possible. The GND side of these capacitors should connect directly to the ground plane of the part. 7. The boost converter switching power trace connecting SW to the inductor should be minimized to reduce radiated EMI and parasitic coupling. Due to the large voltage swing of the SW node, sensitive nodes such as the feedback nodes (FBx, LDOx_FB and LED_OV) should be kept far away or shielded from this switching node or poor performance could result.
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48
LTC3577/LTC3577-1 TYPICAL APPLICATION
USB Plus 5V Adapter Input Charger, Multi-Channel Power Supply and PowerPath Controller
5V WALL ADAPTER
Si2333DS D3
Si2306BDS Si2333DS VOUT SYSTEM LOAD
42 R1 6.2k OPTIONAL OVERVOLTAGE/ REVERSE VOLTAGE PROTECTION 40 10F 2.1k 43 2k 13 8 VC
4
41 30 10F 39 2.2F 32 2.2F 6
WALL ACPR VINLDO2 VOUT VIN12
OVGATE OVSENSE
1k
USB
VBUS
VIN3
CLPROG
36
PROG
44 CHRG 37 IDGATE 38 BAT 34 100k NTCBIAS 35 NTC
Si2333DS (OPT)
+
100k NTC
BAT Li-Ion 20F 10H ZLLS400
LTC3577 DVCC SDA SCL C/P WAKE PBSTAT PWR_ON ILIM0 ILIM1 PUSHBUTTON 15 VLDO1 1.2V 75mA 28 1F 464k 232k 27 29 1F 470k 1.00M 24 LDO2_FB GND 45 FB3 ON LDO1 LDO1_FB LDO2 499k 10 DVCC 11 SDA 12 SCL SW LED_OV 18,19,20 9 6M 22nF 20k
1F 50V 6-LED BACKLIGHT
22 ILED 499k 3 17 LED_FS WAKE 16 21 PBSTAT PG_DCDC 14 PWR_ON 1 ILIM0 2 ILIM1 SW1 FB1 VINLDO1 SW2 FB2 SW3 33 26 23 31 25 5 7
4.7H 10pF 1.02M
100k 10F
RST
VOUT1 3.3V 500mA
324k
4.7H 10pF 3.3H 10pF 232k 10F 806k 10F
VOUT2 1.8V 500mA
649k
VLDO2 2.5V 150mA
VOUT3 1.2V 800mA
464k
3577 TA02
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49
LTC3577/LTC3577-1 TYPICAL APPLICATION
USB Plus HV Input Charger, Multi-Channel Power Supply and PowerPath Controller
HVIN 8V TO 38V (TRANSIENTS TO 60V) OPTIONAL HIGH VOLTAGE BUCK INPUT 0.47F 6.8H DFLS240L BD FB VC 9 Si2333DS 42 VC Si2306BDS USB 40 10F VIN12 13 6.2k OPTIONAL OVERVOLTAGE PROTECTION 8 OVGATE OVSENSE VIN3 4 41 30 10F 39 2.2F 32 2.2F 6 1k VOUT SYSTEM LOAD 1 8 100k 499k 22F 4 4.7F 68nF 150k 5 40.2k 10 NC NC 6 7 2
VIN RUN/SS RT SYNC PG GND 11
BOOST LT3480 SW
3
WALL ACPR VINLDO2
VBUS
VOUT
2.1k 43 2k
CLPROG
36
PROG
44 CHRG 37 IDGATE 38 BAT 34 100k NTCBIAS 35 NTC
Si2333DS (OPT)
+
100k NTC
BAT Li-Ion 20F 10H ZLLS400
LTC3577 DVCC SDA SCL C/P WAKE PBSTAT PWR_ON ILIM0 ILIM1 PUSHBUTTON 15 VLDO1 1.2V 75mA 28 1F 464k 232k 27 29 1F 470k 1.00M 24 LDO2_FB GND 45 FB3 LDO1_FB LDO2 FB2 SW3 25 5 7 3.3H 10pF 232k ON LDO1 499k 10 DVCC 11 SDA 12 SCL SW LED_OV 18,19,20 9 10M 22nF 20k
1F 50V 10-LED BACKLIGHT
22 ILED 499k 3 17 LED_FS WAKE 16 21 PBSTAT PG_DCDC 14 PWR_ON 1 ILIM0 2 ILIM1 SW1 FB1 VINLDO1 SW2 33 26 23 31
4.7H 10pF 1.02M
100k 10F
RST
VOUT1 3.3V 400mA
324k
4.7H 10pF 806k 10F
VOUT2 1.8V 400mA
649k
VLDO2 2.5V 150mA
464k
10F
VOUT3 1.2V 600mA
3577 TA03
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50
LTC3577/LTC3577-1 PACKAGE DESCRIPTION
UFF Package Variation: UFFMA 44-Lead Plastic QFN (4mm x 7mm)
(Reference LTC DWG # 05-08-1762 Rev O)
1.48 0.05 0.70 0.05
4.50 0.05 3.10 0.05 2.40 REF
2.56 0.05
1.70 0.05 2.02 0.05 2.76 0.05 0.98 0.05
2.64 0.05
PACKAGE OUTLINE 0.20 0.05 5.60 REF 6.10 0.05 7.50 0.05 0.40 BSC
RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 0.75 0.05 0.00 - 0.05
4.00 0.10
2.40 REF 43 44
PIN 1 NOTCH R = 0.30 TYP OR 0.35 45 CHAMFER
0.40 0.10 1 2 PIN 1 TOP MARK (SEE NOTE 6) 2.64 0.10 2.56 0.10 7.00 0.10 5.60 REF 1.70 0.10 R = 0.10 TYP 0.74 0.10 R = 0.10 TYP 0.74 0.10
(UFF44MA) QFN REF O 1107
2.76 0.10
0.200 REF
R = 0.10 TYP 0.98 0.10
0.20 0.05 0.40 BSC
BOTTOM VIEW--EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
3577f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
51
LTC3577/LTC3577-1 RELATED PARTS
PART NUMBER LTC3455 DESCRIPTION Dual DC/DC Converter with USB Power Manager and Li-Ion Battery Charger COMMENTS Seamless Transition Between Input Power Sources: Li-Ion Battery, USB and 5V Wall Adapter. Two High Efficiency DC/DC Converters: Up to 96%. Full Featured Li-Ion Battery Charger with Accurate USB Current Limiting (500mA/100mA). Pin Selectable Burst Mode Operation. Hot SwapTM Output for SDIO and Memory Cards. 24-Lead 4mm x 4mm QFN Package Seamless Transition Between 2-Cell Battery, USB and AC Wall Adapter Input Power Sources. Main Output: Fixed 3.3V Output, Core Output: Adjustable from 0.8V to VBATT(MIN). Hot Swap Output for Memory Cards. Power Supply Sequencing: Main and Hot Swap Accurate USB Current Limiting. High Frequency Operation: 1MHz. High Efficiency: Up to 92%. 24-Lead 4mm x 4mm QFN Package Synchronous Buck Converter, Efficiency: >90%, Adjustable Outputs at 800mA and 400mA, Charge Current Programmable up to 950mA, USB Compatible, 16-Lead 5mm x 3mm DFN Package Maximizes Available Power from USB Port, Bat-Track, "Instant On" Operation, 1.5A Max Charge Current, 180m Ideal Diode with <50m Option, 3.3V/25mA Always-On LDO, Three Synchronous Buck Regulators, One 1A Buck-Boost Regulator, 4mm x 5mm QFN28 Package Maximizes Available Power from USB Port, Bat-Track, "Instant On" Operation, 1.5A Max Charge Current, 180m Ideal Diode with <50m Option, 3.3V/25mA Always-On LDO, Two 400mA Synchronous Buck Regulators, One 1A Buck-Boost Regulator, 4mm x 5mm QFN28 Package Complete Multifunction ASSP: Linear Power Manager and Three Buck Regulaters Charge Current Programmable up to 1.5A from Wall Adapter Input, Thermal Regulation Synchronous Buck Efficiency: >95%, ADJ Outputs: 0.8V to 3.6V at 400mA/400mA/600mA Bat-Track Adaptive Output Control, 200m Ideal Diode, 4mm x 4mm QFN28 Package, "-1" version has 4.1V Float Voltage. Multifunction PMIC: Switchmode Power Manager and 1A Buck-Boost Regulator + LDO, Charge Current Programmable Up to 1.5A from Wall Adapter Input, Thermal Regulation Synchronous Buck-Boost Converters Efficiency: >95%, ADJ Output: Down to 0.8V at 1A, Bat-Track Adaptive Output Control, 180m Ideal Diode, LTC3567 Has I2C Interface, 4mm x 4mm QFN24 Package Complete Multi-Function PMIC: Bi-Directional Switching Power Manager + 3 Bucks + LDO, ADJ Output Down to 0.8V at 400mA/400mA/1A, Over-Voltage Protection, USB On-The-Go, Charge Current Programmable Up to 1.5A from Wall Adapter Input, Thermal Regulation, I2C, Hi-Voltage Bat-Track Buck Interface, 180m Ideal Diode, 4mm x 6mm QFN-38 Package Maximizes Available Power from USB Port, Bat-Track, "Instant On" Operation, 1.5A Max Charge Current, 180m Ideal Diode with <50m Option, 3.3V/25mA Always-On LDO, Two 400mA Synchronous Buck Regulators, One 1A Buck-Boost Regulator, One 600mA Boost Regulator, 4mm x 6mm 38-Pin QFN Package Charges Single Cell Li-Ion Batteries Directly from a USB Port, Thermal Regulation, 200m Ideal Diode with <50m Option, 4mm x 3mm DFN14 Package, "-1" version has 4.1V Float Voltage. Maximizes Available Power from USB Port, Bat-Track, "Instant On" Operation, 1.5A Max Charge Current, 180m Ideal Diode with <50m Option, 3.3V/25mA Always-On LDO, 4mm x 3mm DFN14 Package Maximizes Available Power from USB Port, Bat-Track, "Instant-On" Operation, 1.5A Max Charge Current, 180m Ideal Diode with <50m Option, Automatic Charge Current Reduction Maintains 3.6V Minimum VOUT, Battery charger disabled when all logic inputs are grounded, 3mm x 4mm DFN14 Package Maximizes Available Power from USB Port, Bat-Track, "Instant-On" Operation, 1.5A Max Charge Current, 180m Ideal Diode with <50m Option, Automatic Charge Current Reduction Maintains 3.6V Minimum VOUT, 3mm x 4mm DFN14 Package . High VIN : 38V Operating, 60V Transient; 66V OVP Maximizes Available Power from USB Port, Bat-Track, "Instant-On" Operation, 1.5A Max Charge Current from Wall, 600mA Charge Current from USB, 180m Ideal Diode with <50m Option; 3mm x 4mm Ultra-Thin QFN20 Package
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LTC3456
2-Cell, Multi-Output DC/DC Converter with USB Power Manager
LTC3552
Standalone Linear Li-Ion Battery Charger with Adjustable Output Dual Synchronous Buck Converter I2C Controlled High Efficiency USB Power Manager Plus Triple Step-Down DC/DC High Efficiency USB Power Manager Plus Dual Buck Plus Buck-Boost DC/DC
LTC3555
LTC3556
LTC3557/ LTC3557-1
USB Power Manager with LiIon/Polymer Charger and Triple Synchronous Buck Converter
LTC3566 LTC3567
Switching USB Power Manager with Li-Ion/Polymer Charger, 1A Buck-Boost Converter Plus LDO
LTC3576/-1
Switching USB Power Manager with USB OTG + Triple Step-Down DC/DCs
LTC3586
Switching USB Power Manager with Li-Ion/Polymer Charger Plus Dual Buck Plus Buck-Boost Plus Boost DC/DC USB Power Manager with Ideal Diode Controller and Li-Ion Charger High Efficiency USB Power Manager and Battery Charger High Efficiency USB Power Manager and Battery Charger with Regulated Output Voltage High Efficiency USB Power Manager and Battery Charger with Regulated Output Voltage USB-Compatible Switchmode Power Manager with OVP
LTC4085/ LTC4085-1 LTC4088
LTC4088-1
LTC4088-2
LTC4098
Hot Swap is a trademark of Linear Technology Corporation.
52 Linear Technology Corporation
(408) 432-1900 FAX: (408) 434-0507
LT 0709 * PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
www.linear.com
(c) LINEAR TECHNOLOGY CORPORATION 2009


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