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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6513-B Issued Date : 1993.01.15 Revised Date : 2000.10.01 Page No. : 1/4 HSB562 PNP EPITAXIAL PLANAR TRANSISTOR Description The HSB562 is designed for general purpose low frequency power amplifier applications. Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 900 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ....................................................................................... -25 V VCEO Collector to Emitter Voltage .................................................................................... -20 V VEBO Emitter to Base Voltage ............................................................................................ -5 V IC Collector Current ............................................................................................................ -1 A Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) VBE(on) *hFE fT Cob Min. -25 -20 -5 85 Typ. 350 38 Max. -1 -500 -1 240 Unit V V V uA mV V MHz pF Test Conditions IC=-10uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-20V, IE=0 IC=-800mA, IB=-80mA IC=-500mA, VCE=-2V VCE=-2V, IC=-500mA VCE=-2V, IC=-500mA VCB=-10V, f=1MHz *Pulse Test : Pulse Width 380us, Duty Cycle2% Classification Of hFE Rank Range B 85-170 C 120-240 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 Spec. No. : HE6513-B Issued Date : 1993.01.15 Revised Date : 2000.10.01 Page No. : 2/4 Saturation Voltage & Collector Current VCE=2 V 100 Saturation Voltage (mV) hFE 100 VCE(sat) @ IC=30IB VCE(sat) @ IC=10IB 10 0.1 1 10 100 1000 10 0.1 1 10 100 1000 10000 Collector Current (mA) Collector Current (mA) On Voltage & Collector Current 10000 1000 Cutoff Frequency & Collector Current Cutoff Frequency (MHz) On Voltage (mV) 1000 100 VCE=2V VBE(on) @ VCE=2V 100 0.1 1 10 100 1000 10000 10 1 10 100 1000 Collector Current (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 1000 10000 Safe Operating Area Capacitance (pF) 100 Collector Current-IC (mA) 1000 PT=1ms PT=100ms 100 PT=1s Cob 10 10 1 0.1 1 10 100 1 1 10 100 Reverse Biased Voltage (V) Forward Voltage-VCE (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6513-B Issued Date : 1993.01.15 Revised Date : 2000.10.01 Page No. : 3/4 Power Derating 1000 900 Power Dissipation-PD(mW) 800 700 600 500 400 300 200 100 0 0 20 40 60 80 100 o 120 140 160 Ambient Temperature-Ta( C) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 12 3 Spec. No. : HE6513-B Issued Date : 1993.01.15 Revised Date : 2000.10.01 Page No. : 4/4 2 Marking : HSMC Logo Part Number Date Code Rank Product Series 3 Laser Mark HSMC Logo Product Series C D Part Number H I E F G Ink Mark Style : Pin 1.Emitter 2.Collector 3.Base 1 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification |
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