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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HJ200301 Issued Date : 2001.11.30 Revised Date : 2005.07.14 Page No. : 1/4 HSB1386J LOW FREQUENCY TRANSISTOR (-20V, -4A) Features * Low VCE(sat). VCE(sat)=-0.55V(Typ.) (IC/IB=-4A/-0.1A) * Excellent DC current gain characteristics. TO-252 Structure Epitaxial planar type PNP silicon transistor Absolute Maximum Ratings (TA=25C) Symbol VCBO VCEO VEBO IC PD Tj Tstg Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Collector Power Dissipation (TC=25oC) Junction Temperature Storage Temperature Limits -30 -20 -6 -4 -10 20 150 -55~+150 Unit V V V A A(Pulse)* W o o C C Electrical Characteristics (TA=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE fT Cob Parameter Collector-Base Breakdown Voltage Collector-Emitter B reakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Emitter Cutoff Current Collector-Emitter Saturation Voltage DC Current Transfer Ratio Transition Frequency Output Capacitance Min. -30 -20 -6 82 110 30 -0.5 -0.5 -1 580 pF uA uA V Typ. Max. Unit V V IC=-1mA IC=-50uA VCB=-20V VEB=-5V IC/IB=-4A/-0.1A VCE=-2V, IC=-0.5A MHz VCE=-6V, IE=50mA, f=30MHz VCB=-20V, IE=0A, f=1MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% Test Conditions IC=-50uA Classification Of hFE Rank Range P 82-180 Q 120-270 R 180-390 E 370-580 HSB1386J HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 Spec. No. : HJ200301 Issued Date : 2001.11.30 Revised Date : 2005.07.14 Page No. : 2/4 Saturation Voltage & Collector Current Saturation Voltage (mV) 100 VCE(sat) @ IC=20IB hFE hFE @ VCE=2V VCE(sat) @ IC=40IB 10 100 1 10 100 1000 10000 1 1 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 10000 1000 Capacitance & Reverse-Biased Voltage Saturation Voltage (mV) 1000 Capacitance (pF) 100 Cob VBE(sat) @ IC=20IB 100 1 10 100 1000 10000 10 0.1 1 10 100 Collector Current-IC (mA) Reverse Biased Voltage (V) Power Derating 25 10 Safe Operating Area 20 PD(W) , Power Dissipation Collector Current-IC (A) 1 PT=1mS PT=100mS PT=1S 15 10 0.1 5 0 0 20 40 60 80 100 o Tc( C) , Ambient Temperature 120 140 0.01 1 10 100 Forward Voltage (V) HSB1386J HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-252 Dimension M A F C G 1 2 3 Date Code Spec. No. : HJ200301 Issued Date : 2001.11.30 Revised Date : 2005.07.14 Page No. : 3/4 Marking: a1 Pb Free Mark Pb-Free: " . " (Note) H Normal: None SB 1386J Control Code Note: Green label is used for pb-free packing Pin Style: 1.Base 2.Collector 3.Emitter N H a5 L a2 Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A C F G H L M N a1 a2 a5 Min. 6.35 4.80 1.30 5.40 2.20 0.40 2.20 0.90 0.40 0.65 Max. 6.80 5.50 1.70 6.25 3.00 0.90 2.40 1.50 0.65 *2.30 1.05 *: Typical, Unit: mm a1 3-Lead TO-252 Plastic Surface Mount Package HSMC Package Code: J A B C D a1 E Marking: M F y1 a1 Pb-Free: " . " (Note) H Normal: None Pb Free Mark SB 1386J Control Code Date Code GI y1 y1 Note: Green label is used for pb-free packing Pin Style: 1.Base 2.Collector 3.Emitter Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 J K a2 y2 H N L a2 y2 3-Lead TO-252 Plastic Surface Mount Package HSMC Package Code: J a1 O DIM A B C D E F G H I J K L M N O a1 a2 y1 y2 Min. 6.40 5.04 0.40 0.50 5.90 2.50 9.20 0.60 0.66 2.20 0.70 0.82 0.40 2.10 - Max. 6.80 6.00 5.64 *4.34 0.80 0.90 6.30 2.90 9.80 1.00 0.96 0.86 2.40 1.10 1.22 0.60 2.50 5o 3o *: Typical, Unit: mm Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HSB1386J HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Soldering Methods for HSMC's Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile tP TP Ramp-up TL Tsmax Temperature tL Spec. No. : HJ200301 Issued Date : 2001.11.30 Revised Date : 2005.07.14 Page No. : 4/4 Critical Zone TL to TP Tsmin tS Preheat Ramp-down 25 t 25oC to Peak Time Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb-Free devices. Sn-Pb Eutectic Assembly <3 C/sec 100oC 150oC 60~120 sec <3oC/sec 183oC 60~150 sec 240 C +0/-5 C 10~30 sec <6oC/sec <6 minutes o o o Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 sec <3oC/sec 217oC 60~150 sec 260oC +0/-5oC 20~40 sec <6oC/sec <8 minutes Peak temperature 245 C 5 C o o Dipping time 5sec 1sec 5sec 1sec 260 C +0/-5 C o o HSB1386J HSMC Product Specification |
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