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| Composite Transistors NP04501 Silicon NPN epitaxial planar type For general amplification Features Two elements incorporated into one package (Each transistor is separated) SSS Mini type 6-pin package, reduction of the mounting area and assembly cost by one half Maximum package height (0.4 mm) contributes to develop thinner equipments 6 0.12 -0.02 5 4 0.800.05 1.000.04 0 to 0.02 +0.03 Unit: mm 1 2 1.000.05 3 0.10 (0.35) (0.35) Basic Part Number 2SD0601A x 2 Display at No.1 lead 0.10 Absolute Maximum Ratings Ta = 25C Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector current Peak collector current Total power dissipation * Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC ICP PT Tj Tstg Rating 60 50 7 100 200 125 125 -55 to +125 Unit V V V mA mA mW C C Tr1 1: Emitter (Tr1) 2: Base (Tr1) 3: Collector (Tr2) 0.37 -0.02 4: Emitter (Tr2) 5: Base (Tr2) 6: Collector (Tr1) SSSMini6-F1 Package Marking Symbol: 5H Internal Connection 6 5 4 Tr2 Note) * : Measuring on substrate at 17 mm x 10 mm x 1 mm 1 2 3 Electrical Characteristics Ta = 25C3C Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) * Emitter-base voltage (Collector open) Collector-base cutoff current (Emitter open) Collector-emitter cutoff current (Base open) Forward current transfer ratio Collector-emitter saturation voltage Collector output capacitance (Common base, input open circuited) Transition frequency Symbol VCBO VCEO VEBO ICBO ICEO hFE VCE(sat) Cob fT Conditions IC = 10 A, IE = 0 IC = 2 mA, IB = 0 IE = 10 A, IC = 0 VCB = 20 V, IE = 0 VCE = 10 V, IB = 0 VCE = 10 V, IC = 2 mA IC = 100 mA, IB = 10 mA VCB = 10 V, IE = 0, f = 1 MHz VCB = 10 V, IE = --2 mA, f = 200 MHz 3.5 150 180 Min 60 50 7 0.1 100 390 0.3 Typ Max Unit V V V A A V pF MHz Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Pulse measurement (0.10) +0.03 Publication date: December 2004 SJJ00309AED 1 NP04501 NP04501_PT-Ta PT Ta NP04501_IC-VCE IC VCE NP04501_IC-IB IC IB 0.05 120 Ta = 25C IB = 160 A 140 A 120 A 0.12 VCE = 10 V Total power dissipation PT (mW) 0.04 Collector current IC (A) 80 0.03 100 A 80 A Collector current IC (A) 0.08 0.02 60 A 40 A 20 A 40 0.04 0.01 0 0 40 80 120 0 0 4 8 12 0 0 0.2 0.4 0.6 0.8 1.0 Ambient temperature Ta (C) NP04501_IB-VBE Collector-emitter voltage VCE (V) NP04501_IC-VBE Base current IB (mA) NP04501_VCE(sat)-IC IB VBE IC VBE VCE(sat) IC Collector-emitter saturation voltage VCE(sat) (V) 3 VCE = 10 V Ta = 25C 100 VCE = 10 V 1 IC / IB = 10 2 Collector current IC (mA) 80 Ta = 85C 25C 40 -25C 20 Base current IB (mA) 60 0.1 Ta = 85C -25C 25C 1 0 0 0.2 0.4 0.6 0.8 0 0 0.4 0.8 1.2 0.01 0.1 1 10 100 Base-emitter voltage VBE (V) NP04501_VBE(sat)-IC Base-emitter voltage VBE (V) NP04501_hFE-IC Collector current IC (mA) NP04501_Cob-VCB VBE(sat) IC hFE IC Cob VCB Base-emitter saturation voltage VBE(sat) (V) IC / IB = 10 Forward current transfer ratio hFE Ta = 85C 300 25C -25C 200 VCE = 10 V Collector output capacitance (Common base, input open circuited) Cob (pF) 10 400 100 Ta = 25C f = 1 MHz 10 1 Ta = -25C 85C 25C 1 100 0.1 0.1 1 10 100 0 0.001 0.01 0.1 1 0.1 0 10 20 30 40 Collector current IC (mA) Collector current IC (A) Collector-base voltage VCB (V) 2 SJJ00309AED Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2003 SEP This datasheet has been download from: www..com Datasheets for electronics components. |
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