| PART |
Description |
Maker |
| B65816-N1012-D1 B65815 B65815-E1000-J41 B65815-E16 |
RM 12 In accordance with IEC 60431
|
EPCOS AG
EPCOS[EPCOS]
|
| 0830484 |
Labeling service: Phoenix Contact can custom-label all EM ... markers in accordance with your requirements
|
PHOENIX CONTACT
|
| PEH532 |
IEC 60384-4 Long Life Grade 40/105/56, in accordance with CECC 30 301-809
|
Kemet Corporation
|
| RC1608F102CS RC1608J111CS RC1608J515CS RC1608J275C |
THICK-FILM CHIP RESISTOR
We, Samsung, declare that our component Chip Resistor is produced in accordance with EU RoHS directive.
|
Samsung semiconductor
|
| 1455A1002 1455A1002BK |
Bezels made from polycarbonate.
|
Hammond Manufacturing Ltd.
|
| AN887 |
MICROCONTROLLERS MADE EASY
|
STMicroelectronics
|
| CRIMPFOX-UD-6 |
Crimping pliers, for ferrules in accordance with DIN 46228-1: 1992-08 and DIN 46228-4: 1990-10
|
PHOENIX CONTACT
|
| 200D202D |
Wet Tantalum Capacitors, Wet Sintered Anode Components, Capacitor Assemblies, Type 202D Designed to Meet the Performance and Marking Requirements of Military Style CL55 in Accordance with MIL-DTL-3965
|
Vishay
|
| BA-10Y1UD |
yellow chips, which are made from GaAsP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BD-E522RD |
green CHIPS, WHICH ARE MADE FROM GAAIAS ON GAP substrate
|
BRIGHT LED ELECTRONICS CORP
|
| BD-E524RD |
hi-eff red chips, which are made from GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
| BD-E544RE |
hi-eff red chips, which are made from GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
