| PART |
Description |
Maker |
| R-8 |
8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions
|
Analog Devices
|
| SOT108-1 |
SO14: plastic small outline package; 14 leads; body width 3.9 mm
|
NXP Semiconductors
Philips Semiconductors
|
| SOIC24 |
From old datasheet system
24-Lead Small Outline IC (SOIC) 0.300 Body Width
|
Fairchild Semiconductor
|
| SOT-89-3L |
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
|
List of Unclassifed Manufacturers
Electronic Theatre Controls, Inc.
|
| SOT-89-3L |
PACKAGE OUTLINE DIMENSIONS
|
ETC
|
| DFN1006-2 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 2240-0 |
Connectors, Accessories; For Use With:Banana plug patch cords; Accessory Type:Alligator clip; Body Length:2.3"; Body Material:Steel; Color:Black; Size/Dimensions:.300; Voltage Rating:150V INTERCONNECTION DEVICE
|
Pomona Electronics
|
| TO247 TO247AC TO247C |
HEXFET TO-247AC Outline Dimensions are shown in millimeters (inches)
|
Electronic Theatre Controls, Inc.
ETC[ETC]
List of Unclassifed Manufacturers
|
| MT8LSDT1664 MT8LSDT1664H MT8LSDT1664HG-10C MT8LSDT |
SMALL-OUTLINE SDRAM MODULE
|
MICRON[Micron Technology]
|
| PSC4039 PSC-4039 |
From old datasheet system
PA/PAG PACKAGE OUTLINE 6.10MM BODY WIDTH TTSOP .50MM PITCH 尼龙/封装外形6.10MM导水管周围灰质，机身宽度TTSOP 0.50 mm间距
|
Integrated Device Technolog...
IDT[Integrated Device Technology]
Integrated Device Technology, Inc.
|
| CSSOP |
Ceramic Shrink Small Outline Package
|
Amkor Technology
|
