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MX29LV400TMC-55 - Access time: 55ns; 4M-bit (512K x 8/256K x 16) CMOS single voltage 3V only flash memory

MX29LV400TMC-55_8321549.PDF Datasheet


 Full text search : Access time: 55ns; 4M-bit (512K x 8/256K x 16) CMOS single voltage 3V only flash memory


 Related Part Number
PART Description Maker
UT6716455PPX UT6716470PPX UT6716455WCA UT6716470WC 64K SRAM, 8Kx8. 55ns access time Lead finish optional. Prototype flow.
64K SRAM, 8Kx8. 70ns access time Lead finish optional. Prototype flow.
64K SRAM, 8Kx8. 55ns access time Lead finish solder.
64K SRAM, 8Kx8. 70ns access time Lead finish solder.
64K SRAM, 8Kx8. 85ns access time Lead finish solder.
Aeroflex Circuit Technology
M41T56C64MY6E 512 bit (64 bit x8) Serial Access TIMEKEEPER SRAM 64 Kbit (8192 bit x8) EEPROM
ST Microelectronics
M41T81 512 BIT (64 BIT SERIAL ACCESS RTC SRAM WITH ALARMS
ST Microelectronics
M41T56 M41T56M M41T56MH M41T56SH 512 bit 64b x8 Serial Access TIMEKEEPER SRAM
STMicroelectronics
K4R441869B-NMCK7 K4R441869B-NMCK8 K4R271669B-NMCG6 256K x 18 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz.
256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz.
256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 711 MHz.
K4R271669B:Direct RDRAMData Sheet
256K x 16/18 bit x 32s banks Direct RDRAMTM
256K x 16 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz.
256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz.
Samsung Electronic
SAMSUNG[Samsung semiconductor]
AS4LC256K16E0-35JC AS4LC256K16E0-35TC AS4LC256K16E 3.3V 256K x 16 CM0S DRAM (EDO), 60ns RAS access time
3.3V 256K x 16 CM0S DRAM (EDO), 45ns RAS access time
3.3V 256K x 16 CM0S DRAM (EDO), 35ns RAS access time
x16 EDO Page Mode DRAM
Alliance Semiconductor
WE512K16-XG4X WE512K16-140G4C WE512K16-140G4CA WE5 Access time:200 ns; 5V power supply; 512K x 16 CMOS EEPROM module
Access time:20150 ns; 5V power supply; 512K x 16 CMOS EEPROM module
Access time:150 ns; 5V power supply; 512K x 16 CMOS EEPROM module
Access time:140 ns; 5V power supply; 512K x 16 CMOS EEPROM module
EEPROM MCP
White Electronic Designs
MSM64Q424-NGS-K MSM64422-XXXMS-K MSM64424-XXXMS-K Built-in 256/512-Bit EEPROM and LCD Driver 4-Bit Microcontroller 内置256/512-Bit EEPROM和LCD驱动位微控制
OKI SEMICONDUCTOR CO., LTD.
IRS21271SPBF IRS21281SPBF IRS2127SPBF Asynchronous SRAM; Organization (word): 256K; Organization (bit): x 16; Memory capacity (bit): 4M; Access time (ns): 12; Supply voltage (V): 4.5 to 5.5; Operating temperature (°C): 0 to 70; Package: TSOPII (44); Status:   Remarks:  
Asynchronous SRAM; Organization (word): 1M; Organization (bit): x 4; Memory capacity (bit): 4M; Access time (ns): 12; Supply voltage (V): 3.0 to 3.6; Operating temperature (°C): 0 to 70; Package: SOJ (32); Status:   Remarks:  
International Rectifier
CF5015 CF5015AL2 CF5015AL1-2 CF5015AL2-2 Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 55; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 85; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): -40 to 85; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 70; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 85; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 70; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): -40 to 85; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 85; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 70; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; Package: FBGA (48)
Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 70; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): -40 to 85; Package: FBGA (48)
Seiko NPC Corporation
 
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