| PART |
Description |
Maker |
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| 506AL |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
| HT-210UDUYG HT-210USDNB HT-210SDYG HT-210YYG HT-21 |
Package Outline Dimensions
Package Outline Dimensions
|
List of Unclassifed Manufacturers
List of Unclassifed Man...
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| X2-DFN0806-3 SOT89-5 U-DFN3030-14 TSOT25 U-DFN2020 |
SUGGESTED PAD LAYOUT
PACKAGE OUTLINE DIMENSIONS
SUGGESTED PAD LAYOUT
|
Diodes Incorporated
|
| SSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT263 |
Package outline
|
NXP
Philips Semiconductors
|
| TO220F |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| TO252-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X6-32 |
Package Outline
|
Global Mixed-mode Techn...
|
