| PART |
Description |
Maker |
| G61XS G61XS-000 G618S G619S G611S |
MULTI-ELEMENT LED LIGHT SOURCE
T-1, (3-mm) Round, PCB Mount Direct View Array, G61XS Series
Tantalum Molded Capacitor; Capacitance: 100uF; Voltage: 4V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 330uF; Voltage: 4V; Case Size: 6x3.2 mm; Packaging: Tape & Reel
|
List of Unclassifed Manufacturers
Instrument Design Engineering Associates
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| KA741 KA741D KA741I KA741DTF |
Single Operational Amplifier
Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 16V; Case Size: 1.7x3.3 mm; Packaging: Tape & Reel
Tantalum Conformal-Coated Capacitor; Capacitance: 4.7uF; Voltage: 16V; Packaging: Tape & Reel
From old datasheet system
|
Fairchild Semiconductor Corporation
FAIRCHILD[Fairchild Semiconductor]
|
| ADG721 ADG721BRM ADG722BRM ADG723BRM ADG722 ADG723 |
4 Ohm, Low Voltage Dual SPST (1NO/1NC) Switch on 8-ld uSOIC
CMOS Low Voltage 4 ohm Dual SPST Switches
Tantalum Conformal-Coated Capacitor; Capacitance: 100uF; Voltage: 4V; Packaging: Tape & Reel
Tantalum Conformal-Coated Capacitor; Capacitance: 15uF; Voltage: 4V; Packaging: Tape & Reel
|
AD[Analog Devices]
Analog Devices, Inc.
|
| ANI-019 |
Tape & Reel Packaging and Orientation for Surface Mount Components
|
http://
|
| FQD13N10TF FQD19N10TF |
D-PAK Tape and Reel Data
D-PAK Tape and Reel Data D-PAK Packaging Configuration: Figure 1.0
|
Fairchild Semiconductor
|
| 6861XX14122 |
1.0MM ZIF FPC HORIZONTAL TOP CONTACT TYPE - TAPE & REEL PACKAGING
|
Wurth Elektronik GmbH & Co. KG, Germany.
|
| 68715014022 |
0.5MM ZIF FPC HORIZONTAL TOP CONTACT TYPE -TAPE & REEL PACKAGING
|
Wurth Elektronik GmbH & Co. KG, Germany.
|
| AM29L510PCB AM29L510/BXC AM29510LMB AM29L510DCB |
and flexible way to implement power solutions for the latest high performance CPUs and ASICs.; Same as IR3086AM with Tape and Reel Packaging
Hi-Rel RAD-Hard, Single, 28V Input DC-DC Converter in LS package; Hi-Rel RAD-Hard, Single, 28V Input DC-DC Converter in LS package
Universal Active ORing Controller. Controller / driver IC in an SO-8 package for implementation of Active ORing / reverse polarity protection using N-channel Power MOSFETs.; Similar to IR5001S with Lead-Free packaging.
200V Secondary Side High Speed SR Controller in a 8-Lead SOIC Package. Used to drive N-Channel power MOSFETs used as Synchronous Rectifiers in isolated Flyback converters.; Similar to IR1166SPBF with Tape and Reel Packaging. 乘法累加
|
ITT, Corp.
|
| 1.5KA30A 1.5KA10 1.5KA10A 1.5KA11 1.5KA11A 1.5KA12 |
AUTOMOTIVE TRANSIENT VOLTAGE SUPPRESSOR
Tantalum Conformal-Coated Capacitor; Capacitance: 4.7uF; Voltage: 25V; Case Size: 1.7x3.2 mm; Packaging: Tape & Reel 汽车瞬态电压抑制器
AUTOMOTIVE TRANSIENT VOLTAGE SUPPRESSOR 汽车瞬态电压抑制器
Tantalum Conformal-Coated Capacitor; Capacitance: 2.2uF; Voltage: 25V; Packaging: Tape & Reel
Automotive Transient Voltage Suppressor(汽车瞬变电压抑制
Tantalum Conformal-Coated Capacitor; Capacitance: 4.7uF; Voltage: 25V; Case Size: 1.7x3.2 mm; Packaging: Tape & Reel
|
GE Security, Inc.
General Semiconductor
|
| AM29F800BT-90WBC AM29F800BT-55WBI AM29F800BB-55WBE |
and flexible way to implement power solutions for the latest high performance CPUs and ASICs.; Same as IR3087 with bag packaging
30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3709Z with Lead Free Packaging
40V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7470 with Lead Free Packaging
Complete VR11.0 or AMD PVID power solution.; A IR3505M packaged on tape and reel 3000 per reel
8 PWM 400 KHz Sync Contr in a 8-Pin SOIC(NB) package; A IRU3037ACS with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRLZ44NS with Lead Free Packaging
The XPHASE Control IC combined with an IR XPhase TM Phase IC provides a full featured and flexible way to implement a complete an Opteron or Athlon 64 power solution.; A IR3082M with Tape and Reel Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; Similar to IRLL024Z with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; A IRLL2705 with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a TO-262 Package; Similar to IRF2807ZL with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3805S with Lead Free Packaging
x8/x16 Flash EEPROM x8/x16闪存EEPROM
XPHASE VRD10 Control IC with VccVid and Overtemp Detect; Similar to IR3080M with Lead Free Packaging on Tape and Reel x8/x16闪存EEPROM
XPHASE IC with Fault and Overtemp Detect; Same as the IR3088AM with Tape and Reel Packaging. x8/x16闪存EEPROM
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO44
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO44
|
Linear Technology, Corp.
ATM Electronic, Corp.
Integrated Device Technology, Inc.
Advanced Micro Devices, Inc.
|
| V23833-G6005-A101 |
Tantalum Molded Capacitor; Capacitance: 1uF; Voltage: 35V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel
|
Infineon Technologies AG
|
