| PART |
Description |
Maker |
| AE541PYA562MSZ AE541PYA222MSZ AE541PYA182MSZ AE541 |
Outgassing Compliant Power Inductors
|
Coilcraft lnc.
|
| AE512PJB155MSZ AE512PJB103MSZ AE512PJB104MSZ AE512 |
Outgassing Compliant Power Inductors
|
Coilcraft lnc.
|
| AE336RAD51NSZ AE336RAD39NSZ AE336RAD6N2JSZ AE336RA |
Outgassing Compliant Chip Inductors
|
Coilcraft lnc.
|
| X2864HJ-70 X2864BPI-18 X2864HJ-90 X2864BGM-12 X286 |
10MS, 8 PDIP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, SOT23, IND TEMP, GREEN, 1.8V(SERIAL EE)
32M CONFIG FLASH, 44 PLCC, IND(FPGA)
10 MHZ, 8 LAP, IND TEMP(FPGA)
25NS, 24 SOIC, IND TEMP(EPLD)
10MS, 8 TSSOP, EXT TEMP, 2.7V(SERIAL EE)
DIE SALE,1.8V, 11MIL(SERIAL EE)
10MHZ, 8 PDIP, IND TEMP(FPGA)
10MHZ, 20 PLCC, COM TEMP(FPGA)
10MHZ, 44 TQFP, COM TEMP(FPGA)
128Kx8 EEPROM
20NS,CERDIP,883C; LEV B FULLY COMPLIANT(EPLD)
10MHZ, 20 SOIC, COM TEMP, 5K MOQ(FPGA)
10 MHZ, 20 PLCC, IND TEMP, GREEN(FPGA) x8的EEPROM
30MHZ, 3.3V, 8 LAP, COM TEMP(FPGA) x8的EEPROM
10MHZ, 20 PLCC, IND TEMP(FPGA) x8的EEPROM
30MHZ, 20 PLCC, IND TEMP, GREEN(FPGA) x8的EEPROM
|
ITT, Corp.
Pericom Technology (Shanghai) CO., Ltd.
Diodes, Inc.
Electronic Theatre Controls, Inc.
|
| ISC1210SY820K ISC1210EB1R5K ISC1210EB101J ISC1210B |
General Fixed Inductor, IND,POWDERED IRON,82UH,10% TOL,10% -TOL,1210 CASE
General Fixed Inductor, 1 ELEMENT, 1.5 uH, POWDERED IRON-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 1210, HALOGEN FREE AND ROHS COMPLIANT
General Fixed Inductor, IND,POWDERED IRON,100UH,5% TOL,5% -TOL,1210 CASE
ISC-1210 Wirewound, Surface Mount, Molded, Shielded Inductors
General Fixed Inductor, IND,POWDERED IRON,10UH,10% TOL,10% -TOL,1210 CASE
General Fixed Inductor, 1 ELEMENT, 22 uH, POWDERED IRON-CORE, GENERAL PURPOSE INDUCTOR, SMD, ROHS COMPLIANT
General Fixed Inductor, IND,POWDERED IRON,3.3UH,10% TOL,10% -TOL,1210 CASE
General Fixed Inductor, IND,POWDERED IRON,15UH,10% TOL,10% -TOL,1210 CASE
General Fixed Inductor, IND,POWDERED IRON,15UH,5% TOL,5% -TOL,1210 CASE
|
Vishay Dale
|
| PUMA67S16000M-025 PUMA2S16000I-45 PUMA67S16000I-45 |
150NS, PLCC, COM TEMP(FLASH)
15NS, 44 PLCC, COM TEMP(EPLD)
30MHZ, 3.3V, 8 LAP, COM TEMP(FPGA)
20NS, 44 PLCC, COM TEMP(EPLD)
150NS, TSOP, IND TEMP(FLASH)
20NS, 44 TQFP, IND TEMP(EPLD)
120NS, SOIC, IND TEMP(EEPROM)
70NS, TSOP, IND TEMP(EEPROM)
15NS, 68 PLCC, IND TEMP(EPLD)
25NS, 68 PLCC, IND TEMP(EPLD)
30MHZ, 32 TQFP, COM TEMP(FPGA)
120NS, PDIP, IND TEMP(EEPROM)
32 MCROCELL CPLD 1.8V ISP TQFP IND GREEN(EPLD)
x32 SRAM Module X32号的SRAM模块
90NS, TSOP, IND TEMP(EEPROM) X32号的SRAM模块
120NS, PLCC, IND TEMP(EEPROM)
|
DB Lectro, Inc.
TE Connectivity, Ltd.
|
| T342-SERIES X342-SERIES T322-SERIES X322-SERIES T3 |
10MS, 8 TSSOP, IND TEMP, GREEN, 2.7V(SERIAL EE)
BGA,GREEN,IND TEMP(ARM)
NGD: SMART CARD, MODULE(SMARTCARDS)
20NS, TQFP, IND TEMP(EPLD) 外围芯片
Peripheral IC 外围芯片
|
Marktech Optoelectronics
|
| FP3-3R3 |
IND,Iron,3.3uH,15 % Tol,15-% Tol,2926-Case RoHS Compliant: No 1 ELEMENT, 3.3 uH, GENERAL PURPOSE INDUCTOR, SMD
|
Cooper Bussmann, Inc.
|
| PUMA2S16000M-35 PUMA2S16000M-020 PUMA77S16000M-025 |
30MHZ, 8 LAP, IND TEMP, GREEN(FPGA)
15NS, 100 PQFP, IND TEMP(EPLD)
25NS, 100 PQFP, IND TEMP(EPLD)
20NS, 68 PLCC, COM TEMP(EPLD)
30MHZ, 3.3V, 8 LAP, IND TEMP(FPGA)
7NS, 100 TQFP, COM TEMP(EPLD)
32 MC CPLD,1.8V ISP CPLD,44 PIN TQFP(EPLD)
x32 SRAM Module X32号的SRAM模块
|
Fujitsu, Ltd.
|
| PUMA2X0214I-9035 PUMA2X0214I-9045 PUMA2X0214I-9055 |
10MS, DIE, 1.8V, 9 MIL THICKNESS(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 TSSOP, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 TSSOP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 SOIC, EXT TEMP, 2.7V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, GREEN, 1.8V(SERIAL EE)
SRAM/EPROM 静态存储器/存储
8 ULTRA THIN,MINI MAP,PB/HALO FREE,IND T(SERIAL EE) 静态存储器/存储
10MS, 8 TSSOP, EXT TEMP, GREEN,2.7V(SERIAL EE) 静态存储器/存储
10MS, 8 SOIC, INT TEMP, GREEN, 1.8V(SERIAL EE) 静态存储器/存储
|
Electronic Theatre Controls, Inc.
HIROSE ELECTRIC Co., Ltd.
Maxim Integrated Products, Inc.
|
| AM3064-70/BZC AM3064-50GI175 AM3064-50JC068 AM3090 |
10MS, 8 EIAJ SOIC, IND TEMP, GREEN, 2.7V(BIOS FLASH)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(BIOS FLASH)
DIE SALE, 2.7V, 7 MIL(BIOS FLASH)
10MS, 8 SAP, IND, ROHS-B, 2.7V(BIOS FLASH)
8-SOIC,AUTO TEMP,2.7V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, 2.7V(SERIAL EE)
10MS, 8 PDIP, EXT TEMP, GREEN,2.7V(SERIAL EE)
10MS, 8 TSSOP, INT TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 PDIP, INT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, DIE 1.8V, 11 MILS THICKNESS(SERIAL EE)
10MS, 8 PDIP, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, GREEN,2.7V(SERIAL EE)
8 ULTRA THIN,MINI MAP,PB/HALO FREE,IND T(SERIAL EE) 现场可编程门阵列（FPGA
10MS, 8 SOIC, EXT TEMP, GREEN, 2.7V(SERIAL EE) 现场可编程门阵列（FPGA
Field Programmable Gate Array (FPGA) 现场可编程门阵列（FPGA
10MS, 8 SOIC, INT TEMP, GREEN, 2.7V(SERIAL EE) 现场可编程门阵列（FPGA
10MS, 8 PDIP, EXT TEMP, GREEN, 2.7V(SERIAL EE)
|
Stackpole Electronics, Inc.
Ecliptek, Corp.
Analog Devices, Inc.
Glenair, Inc.
|
|
