| PART |
Description |
Maker |
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| WLCSP9X9-81 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN3X3-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOD723 |
Package outline
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| TSSOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| 21-0125A |
PACKAGE OUTLINE
|
Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
|
| SOT23-3 |
Package Outline
|
Global Mixed-mode Techn...
|
