| PART |
Description |
Maker |
| 081029133013 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 081029132723 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 081029132636 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| DFN1006-2 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 506AL |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
| PLCC32 |
PLCC Outline Dimensions
|
Holtek Semiconductor Inc
|
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
