| PART |
Description |
Maker |
| ISPLSI2128VL-100LB100 ISPLSI2128VL-100LB208 ISPLSI |
2.5V In-System Programmable SuperFAST⑩ High Density PLD
2.5V In-System Programmable SuperFAST High Density PLD
2.5VIn-SystemProgrammableSuperFASTHighDensityPLD
Linear Motion Control; Series:LCL; Track Resistance:5kohm; Resistance Tolerance:20%; Power Rating:3W; Operating Temperature Range:-30 C to C; Resistor Element Material:Conductive Plastic RoHS Compliant: Yes
Linear Motion Control; Series:LCP8; Track Resistance:10kohm; Resistance Tolerance: /-15%; Power Rating:0.2W; Operating Temperature Range:-30 C to 105 C; Resistor Element Material:Conductive Plastic RoHS Compliant: Yes EE PLD, 13 ns, PBGA208
Resistors, Variable sliding; Series:LCP15; Track Resistance:10kohm; Resistance Tolerance: /-10%; Power Rating:0.5W; Operating Temperature Range:-30 C to 105 C; Resistor Element Material:Conductive Plastic RoHS Compliant: Yes EE PLD, 13 ns, PBGA100
2.5V In-System Programmable SuperFASTHigh Density PLD EE PLD, 10 ns, PBGA100
2.5V In-System Programmable SuperFASTHigh Density PLD EE PLD, 8.5 ns, PBGA208
2.5V In-System Programmable SuperFASTHigh Density PLD EE PLD, 10 ns, PQFP176
2.5V In-System Programmable SuperFASTHigh Density PLD EE PLD, 8.5 ns, PQFP100
2.5V In-System Programmable SuperFASTHigh Density PLD EE PLD, 8.5 ns, PBGA100
|
LATTICE[Lattice Semiconductor]
LatticeSemiconductor
Lattice Semiconductor Corporation
Lattice Semiconductor, Corp.
|
| ISPLSI1032EA-170LT100 ISPLSI1032EA-200LT100 1032EA |
60 MHz in-system prommable high density PLD
170 MHz in-system prommable high density PLD
125 MHz in-system prommable high density PLD
100 MHz in-system prommable high density PLD
Shielded Paired Cable; Number of Conductors:8; Conductor Size AWG:24; No. Strands x Strand Size:7 x 32; Jacket Material:Polyethylene; Shielding Material:Aluminum Foil/Polyester Tape/Tinned Copper Braid; Number of Pairs:4 RoHS Compliant: Yes
In-System Programmable High Density PLD 在系统可编程高密度可编程逻辑器件
|
LATTICE[Lattice Semiconductor]
Lattice Semiconductor Corporation
Lattice Semiconductor, Corp.
|
| DX10AJ-50P-LNA DX10AJ-100SE-CR2A |
DX SERIES HIGH-DENSITY I/O CONNECTORS
|
Hirose Electric USA, INC.
|
| 634-015-563-010 634-015-563-020 634-015-563-130 63 |
634 SERIES HIGH DENSITY SUBMINIATURE D CONNECTOR
|
List of Unclassifed Man...
|
| SLA416T SLA4162 SLA402T SLA4028 SLA4078 SLA407T SL |
(SLA40000 Series) High Density Gate Array
|
Epson
|
| SLA5668H SLA544TH SLA5177H SLA5815H SLA5075H SLA50 |
(SLA5000H Series) High Density Gate Array
|
Epson
|
| ISPLSI1024 ISPLSI1024EA-200LT100 1024EA ISPLSI1024 |
200 MHz in-system prommable high density PLD
Shielded Paired Cable; Number of Conductors:8; Conductor Size AWG:28; No. Strands x Strand Size:7 x 36; Jacket Material:Polyethylene; Number of Pairs:4; Features:Alumunium Foil Polyester/Tinned Copper Braid; Impedance:120ohm RoHS Compliant: Yes
In-System Programmable High Density PLD
100 MHz in-system prommable high density PLD
|
Lattice Semiconductor Corporation
LATTICE[Lattice Semiconductor]
http://
|
| ATL35 |
The ATL35 series ASIC family is fabricated on a 0.35 micron CMOS process with up to four levels of metal. This family features arrays with up to 2.7 million routable gates and 976 pins. The high density and high pin count capabilities of t
|
Atmel
|
| DM5374X-XXXX |
2.77mm Density Coaxial / High Voltage and High Power
|
Cinch
|
| W4NRD0X-0000 W4NRD8C-U000 W4NXD8C-0000 W4NXD8C-L00 |
Diameter: 50.8mm; LCW substrates; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; ultra-low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; select mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 76.2mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
|
CREE POWER
|
| AM7200-35RC AM7200-35JC AM7200-35PC AM7200-50JC AM |
HIGH DENSITY FIRST-IN FIRST-OUT (FIFO) 256 X 9-BIT CMOS MEMORY 256 X 9 OTHER FIFO, 25 ns, PDIP28
HIGH DENSITY FIRST-IN FIRST-OUT (FIFO) 256 X 9-BIT CMOS MEMORY 256 X 9 OTHER FIFO, 50 ns, PDIP28
Circular Connector; No. of Contacts:13; Series:MS27508; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:10; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
JT 13C 13#22D PIN WALL RECP
|
ADVANCED MICRO DEVICES INC
Advanced Micro Devices, Inc.
|
