| PART |
Description |
Maker |
| A82DL16X4TU |
Stacked Multi-Chip Package
|
AMIC Technology
|
| AM49DL3208G |
Stacked Multi-Chip Package (MCP) Flash Memory and pSRAM
|
Advanced Micro Devices
|
| AM42BDS6408G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| AM42DL640AH |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| AM50DL128CH70IS AM50DL128CH70IT AM50DL128CH85IS AM |
STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM
|
AMD[Advanced Micro Devices]
|
| M6MGD13VW34DWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGB64BS8BWG-P M6MGT64BS8BWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13TW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| IS75V16F64GS16-7080DI 75V16F64GS16 |
64 Mbit FLASH MEMORY AND 16 Mbit PSEUDO SRAM STACKED MULTI-CHIP PACKAGE (MCP)
|
ISSI[Integrated Silicon Solution, Inc]
|
| AM49LV6408MT15I AM49LV4608MT15IS AM49LV4608MT15IT |
Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) 堆叠式多芯片封装（MCP64兆位个M × 16位）闪存兆位（为512k × 16位）
Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) pseudo Static RAM 堆叠式多芯片封装（MCP64兆位个M × 16位）闪存兆位（为512k × 16位）伪静态存储器
Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) pseudo Static RAM 堆叠式多芯片封装（MCP4兆位个M × 16位）闪存兆位（为512k × 16位）伪静态存储器
|
Spansion, Inc.
Spansion Inc.
|
