PART |
Description |
Maker |
IDD10SG60C |
3rd Generation thinQ!TM SiC Schottky Diode
|
Infineon Technologies AG
|
TKS-G50-QM77 TKS-G50-QM77-001-DX |
EmBox with Intel 3rd Generation Core i7/i5/i3 Mobile Processor
|
AAEON Technology
|
SK34SMA-3G |
SMD Schottky Barrier Rectifier Diodes 3rd Generation
|
Diotec Semiconductor
|
TBD |
Compact Board With Intel R 3rd Generation Core Tm i Series i7/i5/i3 Mobile Processor
|
AAEON Technology
|
MIC-3395MILC-P4E |
6U CompactPCI 3rd Generation Intel? Core?i7 Rugged Processor Blade with ECC
|
Advantech Co., Ltd.
|
TKS-G21-QM77 TBD |
Fanless Embedded Box for Intel R 3rd Generation Core Tm i7/i3/Celeron R Mobile Processor
|
AAEON Technology
|
MIC-5603AFZ-M4E MIC-5603A2M-M4E MIC-5603A2M-M8E MI |
Advanced Mezzanine Card based on 3rd Generation Intel? Core Processors with ECC
|
Advantech Co., Ltd.
|
MIC-3395C1-M4E MIC-3395A1-M4E MIC-3395B1-M4E MIC-3 |
6U CompactPCI? 2nd and 3rd Generation Intel Core i3/i5/i7 Processor Blade with ECC Support
|
Advantech Co., Ltd.
|
FSB-B75G-A10-G2 FSB-B75G-15 |
PICMG 1.0 Full-Size SBC with Intel 3rd Generation Core i7/i5/i3 LGA 1155 Processor
|
AAEON Technology
|
IDV05S60C |
2nd Generation thinQ! SiC Schottky Diode
|
Infineon Technologies AG
|