PART |
Description |
Maker |
LCM-S01602DSF-A SCM-S01602DSFA |
TRANSFLECTIVE 5.56mm CHARACTER HEIGHT, 5 x 8 DOT MATRIX, STN, TRANSFLECTIVE WITH LED BAKLIGHT, 16 x 2 LCD MODULE, 1/16 DUTY, 1/5 BIAS
|
LUMEX INC.
|
LCM-S01602DSF-C LCM-S01602DSFC |
16x2 LCD, 5x8 DOT MATRIX, STN, TRANSFLECTIVE 16x2 LCD, 5x8 DOT MATRIX, STN, TRANSFLECTIVE BACKLIGHT, 1/16 DUTY, 1/5 BIAS.
|
LUMEX INC.
|
LCM-S01602DSR-A LCM-S01602DSRA |
5.56mm CHARACTER HEIGHT, 5x8 DOT MATRIX, 16x2 LCD MODULE 5.56MM CHARACTER HEIGHT 5 X8 DOT MATRIX
|
LUMEX INC.
|
KHB084XXX |
Colour Transflective / Reflective LCD Modules
|
Kyocera Kinseki Corporation
|
RCM7011T |
20 Characters x 2 lines Transflective Character Module(20字符 x 2线LCD模块)
|
Rohm CO.,LTD.
|
LCM-S01602DSF-B-Y |
5.56mm CHARACTER HEIGHT
|
LUMEX INC.
|
WH0802A-YYH-CP |
LCD Character Display Modules Yl/Grn Transflective Yl/Grn LED Backlight
|
Microtips Technology, Inc.
|
0440671002 44067-1002 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") MOLEX Connector
|
Molex Electronics Ltd.
|
35730-2900 0357302900 |
3.56mm (.140) Diameter Pin Receptacle Terminal, Brass, 0.35mm (.138) Thickness, Wire Range 14-20 AWG (2.00-0.52mm2), Unplated 3.56mm (.140") Diameter Pin Receptacle Terminal, Brass, 0.35mm (.138") Thickness, Wire Range 14-20 AWG (2.00-0.52mm虏), Unplated
|
Molex Electronics Ltd.
|
0440671401 44067-1401 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB MOLEX Connector
|
Molex Electronics Ltd.
|
44067-0801 SD-44067-001 0440670801 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
Molex Electronics Ltd.
|
44067-1202 0440671202 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
Molex Electronics Ltd.
|
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