| PART |
Description |
Maker |
| TF-GENE-QM57-A10 TF-GENE-QM57-A10-01 |
3.5 SubCompact Board with Intel Core i7/i5 Mobile/ Celeron Processor
|
AAEON Technology
|
| HYB18M512160BFX HYB18M512160BFX-7.5 |
DRAMs for Mobile Applications 512-Mbit DDR Mobile-RAM
|
Qimonda AG
|
| HYB18L256160B |
DRAMs for Mobile Applications 256-Mbit Mobile-RAM DRAM的针对移动应56兆移动RAM
|
Qimonda AG
|
| HYE18L128160BF-7.5 |
DRAMs for Mobile Applications 128-Mbit Mobile-RAM
|
http://
|
| HYB18L512160BF-7.5 HYE18L512160BF-7.5 |
DRAMs for Mobile Applications 512-Mbit Mobile-RAM
|
http://
|
| HYB18L128160BC-7.5 HYE18L128160BC-7.5 HYB18L128160 |
DRAMs for Mobile Applications 128-Mbit Mobile-RAM
|
Qimonda AG
|
| RG82845M 82845MZ 82845MP 82845MX |
Intel 845 Family Chipset-Mobile 82845MP/82845MZ Chipset Memory Controller Hub Mobile (MCH-M)
|
Intel Corporation
|
| MB82DBS04163C MB82DBS04163C-70L MB82DBS04163C-70LW |
MEMORY Mobile FCRAMTM CMOS 64 M Bit (4 M word】16 bit) Mobile Phone Application Specific Memory
|
Fujitsu Media Devices Limited
|
| M57715 M57715R 57715R |
144-148MHz 12.5V /13W /FM MOBILE RADIO
144-148MHz 12.5V,13W,FM MOBILE RADIO
144-148MHZ, 12.5V, 13W, FM MOBILE RADIO
144-148MHz 12.5V13WFM MOBILE RADIO
From old datasheet system
|
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| DF18D-50DS-0.4V DF18B-50DS-0.4V DF18E-80DS-0.4V DF |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors
0.4mm Contact Pitch 1.5mm above the board Board-to-Board / Board-to-FPC Connectors
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors 间距0.4mm的联系，高于板，板对板对FPC连接.5毫米
0.4mm Contact Pitch/ 1.5mm above the board/ Board-to-Board / Board-to-FPC Connectors
CAT5E PATCH CORD ORANGE 5FT 间距0.4mm的联系，高于板，板对板对FPC连接.5毫米
|
HIROSE[Hirose Electric]
Hirose Electric USA, INC.
HIROSE ELECTRIC Co., Ltd.
|
