PART |
Description |
Maker |
DFN-2-0402 |
package outline & pad layout
|
Protek Devices
|
21-0137 |
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM
|
Maxim Integrated Products
|
ZTA-MG ZTA-MT ZTA-MX |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
ZTT-MT-20.000 ZTT-MX-20.000 ZTT-MG-20.000 ZTA ZTA- |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc. ETC List of Unclassifed Manufacturers
|
SOT-89-3L |
SOT-89-3L PACKAGE OUTLINE DIMENSIONS SOT-89-3L PACKAGE OUTLINE DIMENSIONS
|
List of Unclassifed Manufacturers Electronic Theatre Controls, Inc.
|
IL3Y-HX5F6.0-32.768 IL3Y-HX5F12.5-32.768 |
2 Pad Glass Package Quartz Crystal, 1.5 mm x 4.1 mm
|
ILSI America LLC
|
AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
SSOP-16 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN5X5-32 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP15X15-163 |
Package Outline
|
Global Mixed-mode Techn...
|