| PART |
Description |
Maker |
| UTC-WALLMOUNT3E UTC-WALLMOUNT1E UTC-WALLMOUNT2E |
UTC Series Floor Stand & Wall Mount
|
Advantech Co., Ltd.
|
| MAX1419 MAX1419ETN MAX1418 |
15-Bit / 65Msps ADC with -79.3dBFS Noise Floor for Baseband Applications
15-Bit, 65Msps ADC with -79.3dBFS Noise Floor for Baseband Applications
|
MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
|
| SRBOLTDOWN |
SmartRack Bolt-Down Kit - Secures stabilizing brackets or plates to facility floor
|
Tripp Lite. All Rights ...
|
| X5001V8 X5001P-4.5A X5001V8-2.7 |
3M HEAVY DUTY ATTACHMENT ADHESIVE, TEMPERATURE RANGE: -20-200 DEGREE FAHRENHEIT, INCLUDES: FOUR 1 X 3 STRIPS, FEATURES: INTENDED FOR PERMANENTLY
Multi-Purpose Cleaner; Dispensing Method:Bottle; Trade Name, Chemical:Neutral Quat; Volume:2L RoHS Compliant: NA
Connector 连接
Floor Cleaner/Neutralizer; Dispensing Method:Spray; Trade Name, Chemical:TroubleShooter; Volume:1quart (US) CPU监控
|
Xicor Inc.
Intersil, Corp.
|
| 1ML06-050-05AN05 1ML06050AN05 |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
Thermoelectric Cooling Solutions
|
RMT Ltd.
|
| 1MD03-009-05-1 |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
RMT Ltd.
|
| 1MC06-004-03 1MC06-004-05 1MC06-004-08 1MC06-004-1 |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
RMT Ltd.
|
| 1ML06-023-09T |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
RMT Ltd.
|
| 1ML07-023-09AN25 1ML07023AN25 |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
RMT Ltd.
|
| 1ML07-023-09T 1ML07023-T |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
RMT Ltd.
|
