PART |
Description |
Maker |
DSPIC33EP512GM710 |
dsPIC33EP512GM710 100-Pin TQFP to 100-Pin Plug-In Module (PIM) Information Sheet
|
Microchip Technology
|
DSPIC33EP512MU810 PIC24EP512GU810 |
dsPIC33EP512MU810 and PIC24EP512GU810 100-pin TQFP to 100-pin Plug-In Module (PIM)
|
Microchip Technology
|
PIC18F67J60-I_PF PIC18F67J60-I_PT PIC18F96J65-I/PT |
64/80/100-Pin, High-Performance, 1 Mbit Flash Microcontrollers with Ethernet
|
Microchip Technology
|
40ST1141AX |
40 PIN SMD ETHERNET 10/100 BASE-TX HIGH SPEED LAN MAGNETICS
|
Bothhand USA, LP.
|
40SS1041AXMLF |
40 PIN SMD ETHERNET 10/100 BASE -TX HIGH SPEED LAN MAGNETICS
|
Bothhand USA, LP.
|
40PT1041AXLF |
40 PIN DIP ETHERNET 10/100 BASE -TX HIGH SPEED LAN MAGNETICS
|
Bothhand USA, LP.
|
50PT1150AX |
50 PIN DIP ETHERNET 10/100 BASE-TX HIGH SPEED LAN MAGNETICS
|
Bothhand USA, LP.
|
40ST1041AX 40ST1041AX-M |
40 PIN SMD ETHERNET 10/100 BASE-TX HIGH SPEED LAN MAGNETICS
|
Bothhand USA, LP.
|
0010894106 10-89-4106 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, High Profile, Dual Row, Right Angle,10 Circuits, 6.10mm (.240") Mating Pin Length, 0.76渭m (30渭") Gold (Au) Select 2.54mm (.100) Pitch C-Grid? Breakaway Header, High Profile, Dual Row, Right Angle,10 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
0010894166 10-89-4166 70216-0397 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, High Profile, Dual Row, Right Angle,16 Circuits, 6.10mm (.240") Mating Pin Length, 0.76渭m (30渭") Gold (Au) Select 2.54mm (.100) Pitch C-Grid? Breakaway Header, High Profile, Dual Row, Right Angle,16 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
HVB14S |
TIP REPLACEMNT TEFLON FOR DP-100 Silicon Epitaxial Planar PIN Diode for High Frequency Attenuator
|
Hitachi,Ltd. HITACHI[Hitachi Semiconductor]
|
|