| PART |
Description |
Maker |
| C3216X7S2A225KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C5750X7S2A106MT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C1005X7S2A103KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| 2450BL15K050 |
2.45 GHz Medium Performance Balun (Compatible with TDK)
|
Johanson Technology Inc.
|
| GLF2012T220K GLF251812T220M GLC2518T101K GLF2518T1 |
GLF,GLC Series
TDK’s New Winding Type Chip Inductor
|
TDK Electronics
|
| ACM2520-102-2P-T002 |
EMC Engineering Section Magnetics Business Group TDK-EPC Corporation
|
TDK Electronics
|
| 55PC6021 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 55PC1133 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC1811 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 749010013 744761068A |
All 16 terminals must lie on a plane within 004 of surface A after lead tinning
specification for release
specification for release
|
Wurth Elektronik GmbH & Co. KG, Germany.
Wurth Elektronik GmbH &...
|
| ATMEGA16M1 ATMEGA16M1AUTO ATMEGA32C1 ATMEGA64M1 |
Automotive Specification at 150掳C
Automotive Specification at 150°C
|
ATMEL Corporation
|
| PXA255 GDPXA255A0E400 LUPXA255A0E400 LUPXA255A0C20 |
Electrical, Mechanical, and Thermal Specification
Intel? PXA255 Processor Electrical, Mechanical, and Thermal Specification
|
Intel Corporation
|
