| PART |
Description |
Maker |
| IC264-22501-1 IC264-22501-1-MF IC264-22501-1-NN IC |
Ball Grid Array (BGA, 1.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| 3-1640240-4 |
Matrix Series Ball Grid Array ( BGA ) Sockets; 2401 POSITION BGA SOCKET ASSEM ( Tyco Electronics )
|
Tyco Electronics
|
| ETCSP |
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
|
Amkor Technology, Inc.
|
| 1-54-712 1-54-724 1-54-716 1-54-732 1-54-708 |
HAMMER BALL PEIN 12OZ
HAMMER BALL PEIN 24OZ
HAMMER BALL PEIN 32OZ
HAMMER BALL PEIN 8OZ
HAMMER BALL PEIN 16OZ 锤球石工16安士
|
ITT, Corp.
|
| CB0565A CB0565B |
Ceramic Ball Grid Termination Arrays
|
TT Electronics.
|
| 1FGS304-551TG MGS272-636TT FBS225-551GG FBS225-551 |
304 POS FR-4 BGA SOCKET BGA304, IC SOCKET
272 POS 1.27MM BGA SOCKET BGA272, IC SOCKET
225 POS FR-4 BGA SOCKET BGA225, IC SOCKET
521 POS FR-4 BGA SOCKET BGA521, IC SOCKET
303 POS FR-4 BGA SOCKET BGA303, IC SOCKET
540 POS FR-4 BGA SOCKET BGA540, IC SOCKET
456 POS FR-4 BGA SOCKET BGA456, IC SOCKET
475 POS FG4 BGA SOCKET BGA475, IC SOCKET
400 POS 1.27MM BGA SOCKET
BGA240, IC SOCKET
BGA400, IC SOCKET
BGA121, IC SOCKET
BGA396, IC SOCKET
BGA256, IC SOCKET
169 POS FR-4 BGA SOCKET
BGA169, IC SOCKET
432 POS FR-4 BGA SOCKET
BGA204, IC SOCKET
|
Advanced Interconnections, Corp.
ADVANCED INTERCONNECTIONS CORP
|
| ECG2331 ECG2326 ECG2322 ECG2328 ECG2332 ECG2333 |
FAN AC 176X89 220V BALL, 420cfm
TRANSISTOR | BJT | DARLINGTON | NPN | 100V V(BR)CEO | 8A I(C) | TO-220VAR
FAN AC 172X51 115V BALL, 106cfm
TRANSISTOR | BJT | NPN | 200V V(BR)CEO | 15A I(C) | TO-247VAR 晶体管|晶体管| npn型| 200伏五（巴西）总裁|5A一（c）|47VAR
FAN AC 180X65 115V BALL, 400cfm 晶体管|晶体管|达林顿|叩| 60V的五（巴西）总裁|甲一（c）|20
FAN AC 180X65 115V BALL, 340cfm 晶体管|晶体管|叩| 450V五（巴西）总裁| 8A条一c）| TO - 220AB现有
|
Vishay Intertechnology, Inc.
NEC, Corp.
|
| ECG2364 ECG2370 ECG2365 |
FAN AC 80X25 115/220V BALL, 18cfm
FAN AC 80X25 220V BALL, 25cfm
FAN AC 80X25 115/220V BALL, 13cfm 晶体管|晶体管|叩| 800V的五（巴西）总裁| 12A条一（c）|47VAR
|
EPCOS AG
|
| SD-94240-001 94240-2318 0942402318 |
2.54mm (.100) Pitch, MOX Header, 3.50mm (.137) Grid, Through Hole, SPS, Vertical, 18 Circuit, Black
2.54mm (.100") Pitch, MOX Header, 3.50mm (.137") Grid, Through Hole, SPS, Vertical, 18 Circuit, Black
|
Molex Electronics Ltd.
|
| NP178-64401-1 NP178-64401-1-MF NP178-64401-2 NP178 |
Pin Grid Array /Zero Insertion Force (PGA/ZIF - Interstitial)
|
Yamaichi Electronics Co., Ltd.
|
| V54C3256164VBUC V54C3256164VBUT V54C3256164VBLT7PC |
256Mbit (16M x 16) SDRAM, LVTTL, low power, 8ns
LOW POWER 256Mbit SDRAM 3.3 VOLT, 54-BALL SOC BGA 54-PIN TSOPII 16M X 16
256Mbit (16M x 16) SDRAM, LVTTL, low power, 7ns
|
Mosel Vitelic Corp
MOSEL[Mosel Vitelic, Corp]
|
| 0877600627 87760-0627 |
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Mating Length: 3.50mm (.138), 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, Tray, Lead-free
|
Molex Electronics Ltd.
|
|
