| PART |
Description |
Maker |
| FBGA-SD |
Fine Pitch Ball Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
| 3-1640240-4 |
Matrix Series Ball Grid Array ( BGA ) Sockets; 2401 POSITION BGA SOCKET ASSEM ( Tyco Electronics )
|
Tyco Electronics
|
| CHC-CD0865A-01-10R0F CHC-CD0865A-01-10R0G CHC-CD08 |
Ceramic Ball Grid Termination Arrays
|
IRC - a TT electronics Company.
|
| CB0565A CB0565B |
Ceramic Ball Grid Termination Arrays
|
TT Electronics.
|
| K4S51323PF-MF90 K4S51323PF-MF75 K4S51323PF-MF1L K4 |
16M X 32 SYNCHRONOUS DRAM, 7 ns, PBGA90 LEAD FREE, FBGA-90
16M X 32 SYNCHRONOUS DRAM, 7 ns, PBGA90 FBGA-90
16M X 32 SYNCHRONOUS DRAM, 6 ns, PBGA90 LEAD FREE, FBGA-90
16M X 32 SYNCHRONOUS DRAM, 6 ns, PBGA90 FBGA-90
4M x 32Bit x 4 Banks Mobile-SDRAM
From old datasheet system
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
|
| 546-99-108-12-101-036 546-91-108-12-101-035 546-91 |
Pin Grid Array sockets Press-fit terminations 针栅阵列插座压接端子
|
PRECI-DIP SA
PREDIP[Precid-Dip Durtal SA]
|
| NP236-102002-1 NP236-102002-2 |
Pin Grid Array /Zero Insertion Force (PGA/ZIF - Interstitial)
|
Yamaichi Electronics Co., Ltd.
|
| K4M56323PG-FHE_G75 K4M56323PG-FE_G75 K4M56323PG-FC |
2M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
8M X 32 SYNCHRONOUS DRAM, 6 ns, PBGA90 LEAD FREE, FBGA-90
8M X 32 SYNCHRONOUS DRAM, 7 ns, PBGA90 FBGA-90
|
SAMSUNG SEMICONDUCTOR CO. LTD.
Elite Semiconductor Memory Technology, Inc.
Marvell Semiconductor, Inc.
|
| WSFX054-SERIES XSFX054-SERIES YSFX054-SERIES WSFX0 |
Cyclone II FPGA 35K FBGA-484
Interface IC 接口IC
CYCLONE III FPGA 25K 324-FBGA 接口IC
|
Ironwood Electronics
DB Lectro, Inc.
|
| CA-PLCC44-D-M-T-01 |
Carrier Adaptor (CA): 44 position PLCC production socket with test points to mini-grid array interface.
|
Ironwood Electronics.
|
